BAT46WJ
<span id="page-0-2"></span>2. Features and benefits
Package
SOD-323
Overview
Part: BAT46WJ
Type: Planar Schottky barrier diode
Key Specs:
- Reverse voltage (VR): Max 100 V
- Forward voltage (VF): Typ 710 mV, Max 850 mV (at IF = 250 mA, Tamb = 25 °C)
- Reverse current (IR): Typ 1 μA, Max 4 μA (at VR = 75 V, Tamb = 25 °C)
- Forward current (IF): Max 250 mA
- Total power dissipation (Ptot): Max 400 mW (Tamb ≤ 25 °C, standard footprint)
- Diode capacitance (Cd): Max 39 pF (at VR = 0 V, f = 1 MHz, Tamb = 25 °C)
- Reverse recovery time (trr): Typ 5.9 ns
Features:
- Low forward voltage
- Reverse voltage VR ≤ 100 V
- Very small and flat lead SMD plastic package
- Low capacitance
- Integrated guard ring for stress protection
Applications:
- High-speed switching
- Line termination
- Voltage clamping
- Reverse polarity protection
Package:
- SOD323F (SC-90) Surface-Mounted Device (SMD) plastic package
Features
- Low forward voltage
- Reverse voltage VR ≤ 100 V
- Very small and flat lead SMD plastic package
- Low capacitance
3. Applications
- High-speed switching
- Line termination
- Voltage clamping
- Reverse polarity protection
4. Quick reference data
Table 1. Quick reference data
| Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| VR | reverse voltage | - | - | 100 | V | |
| VF | forward voltage | IF = 250 mA; tp ≤ 300 μs; δ ≤ 0.02; pulsed; Tamb = 25 °C | - | 710 | 850 | mV |
| IR | reverse current | VR = 75 V; tp ≤ 300 μs; δ ≤ 0.02; pulsed; Tamb = 25 °C | - | 1 | 4 | μA |
Applications
- High-speed switching
- Line termination
- Voltage clamping
- Reverse polarity protection
Thermal Information
| Symbol | Parameter | Conditions | Min | Typ | Max | Unit | |
|---|---|---|---|---|---|---|---|
| Rth(j-a) | thermal resistance from junction to ambient | in free air | [1] [2] | - | - | 310 | K/W |
| [3] [2] | - | - | 175 | K/W | |||
| Rth(j-sp) | thermal resistance from junction to solder point | [4] | - | - | 35 | K/W |
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm2 .
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 .
[4] Soldering point of cathode tab.
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