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AT25SL128A-SUE-T

The AT25SL128A-SUE-T is an electronic component from Renesas Electronics. View the full AT25SL128A-SUE-T datasheet below including electrical characteristics.

Manufacturer

Renesas Electronics

Category

Flash

Overview

The following figures show the available package types.

A

Figure 2. 21-WLCSP (Bottom View)

Figure 3. 8-WSOIC (Top View)

During all operations, V CC must be held stable and within the specified valid range, V CC (min) to V CC (max). All of the input and output signals must be held high or low (according to voltages of V IH , V OH , V IL , or V OL .

Figure 3. 8-WSOIC (Top View)

Table 1. Pin Descriptions

SymbolName and FunctionAsserted StateType
CSCHIP SELECT When this input signal is high, the device is deselected and serial data output pins are at high impedance. Unless an internal program, erase, or write status register cycle is in progress, the device is in the Standby Power Mode (this is not the Deep Power- Down mode). Driving Chip Select (CS) low enables the device, placing it in the active power mode. After power-up, a falling edge on Chip Select (CS) is required before issuing any command.LowInput
SCKSERIAL CLOCK This input signal provides the timing for the serial interface. Commands, addresses, or data present at serial data input are latched on the rising edge of Serial Clock (SCK). Data are shifted out on the falling edge of the Serial Clock (SCK).-Input
SI (I/O 0 )SERIAL INPUT The SI pin is used to shift data into the device. The SI pin is used for all data input, including command and address sequences. Data on the SI pin is always latched in on the rising edge of SCK. With the Dual-Output and Quad-Output Read commands, the SI Pin becomes an output pin (I/O 0 ) in conjunction with other pins to allow two or four bits of data on I/O 3-0 to be clocked in on every falling edge of SCK To maintain consistency with the SPI nomenclature, the SI (I/O 0 ) pin is referenced as the SI pin unless specifically addressing the Dual-I/O and Quad-I/O modes, in which case it is referenced as I/O 0. Data present on the SI pin is ignored whenever the device is deselected (CS is deasserted).-Input/Output
SO (I/O 1 )SERIAL OUTPUT The SO pin is used to shift data out from the device. Data on the SO pin is always clocked out on the falling edge of SCK. With the Dual-Output Read commands, the SO Pin remains an output pin (I/O0) in conjunction with other pins to allow two bits of data on (I/O 1-0 ) to be clocked in on every falling edge of SCK To maintain consistency with the SPI nomenclature, the SO (I/O 1 ) pin is referenced as the SO pin unless specifically addressing the Dual-I/O modes, in which case it is referenced as I/O 1. The SO pin is in a high-impedance state whenever the device is deselected (CS is deasserted).-Input/Output
WP (I/O 2 )WRITE PROTECT The Write Protect (WP) pin can be used to protect the Status Register against data modification. Used with the Status Register's Block Protect (SEC, TB, BP2, BP1, and BP0) bits and Status Register Protect (SRP) bits, a portion or the entire memory array can be hardware protected. The WPpin is active low. When the QE bit of Status Register-2 is set for Quad I/O, the WP pin (Hardware Write Protect) function is not available because this pin is used for IO 2 . The WPpin does not have an internal pull- up; thus, it must be either driven or, if not used, pulled up with an external resistor to V CC .-Input/Output

Table 1. Pin Descriptions

Table 1. Pin Descriptions (Continued)

SymbolName and FunctionAsserted StateType
HOLD (I/O 3 )HOLD The HOLD pin is used to temporarily pause serial communication without deselecting or resetting the device. While the HOLD pin is asserted, transitions on the SCK pin and data on the SI pin are ignored, and the SO pin is placed in a high-impedance state. The CS pin must be asserted, and the SCK pin must be in the low state in order for a Hold condition to start. AHold condition pauses serial communication only; it does not have an effect on internally self-timed operations such as a program or erase cycle. With the Quad-Input Byte/Page Program command, the HOLD pin becomes an input pin (I/O 3 ) and, with other pins, allows four bits (on I/O 3-0 ) of data to be clocked in on every rising edge of SCK. With the Quad-Output Read commands, the HOLD Pin becomes an output pin (I/O 3 ) in conjunction with other pins to allow four bits of data on (I/O3 3-0 ) to be clocked in on every falling edge of SCK. To maintain consistency with SPI nomenclature, the HOLD (I/O 3 ) pin is referenced as the HOLD pin unless specifically addressing the Quad-I/O modes, in which case it is referenced as I/O 3. The HOLD pin does not have an internal pull-up; thus, it must be either driven or, if not used, pulled up with an external resistor to V CC . See Figure 1 and Figure 2 for the pin configuration of Quad I/O and QPI operation.-Input/Output
V CCDEVICE POWER SUPPLY V CC is the supply voltage. It is the single voltage used for all device functions, including read, program, and erase. The V CC pin is used to supply the source voltage to the device. Operations at invalid V CC voltages can produce spurious results; do not attempt this.-Power
GNDGROUND GND is the reference for the V CC supply voltage. The ground reference for the power supply. Connect GND to the system ground.-Power

Table 1. Pin Descriptions (Continued)

Features

  • Single voltage operation with range of 1.7 V - 2.0 V
  • Serial Peripheral Interface (SPI) compatible support
  • Supports SPI Modes 0 and 3
  • Supports Dual SPI dual output operations (1-1-2)
  • Supports Quad output operations (1-1-4)
  • Supports Quad I/O / XiP operations (1-4-4, 0-4-4)
  • Supports QPI I/O operations (4-4-4)
  • Read Operations
  • Fast read up to 133 MHz
  • Continuous read with 8/16/32/64-byte wrap
  • Flexible erase architecture time
  • Block erase 4 kB: 60 ms (Typical)
  • Block erase 32 kB and 64 kB: 200 ms and 350 ms (Typical)
  • Full chip erase: 80 s (typical)
  • Flexible Programming and time
  • Page/byte program: from 1 to 256 bytes
  • Page program time 0.6 ms (typical)
  • Erase program suspend resume
  • JEDEC Manufacturer and Device ID
  • Memory protection support
  • User-definable protected area at start or end of memory array
  • Enable/disable protection with WP pin
  • Serial Flash Discoverable Parameter (SFDP) register
  • Low power dissipation
  • 10 μA Standby Current (Typical)
  • 2 μA Deep Power-Down Current (Typical)
  • Endurance 100,000 program/erase cycles
  • Data retention: 20 years
  • Temperature Range: Industrial (-40 °C to +85 °C)
  • Industry Standard green (Pb/Halide-free/RoHS compliant) package options
  • 8-pad DFN (6 x 5 x 0.6 mm)
  • 8-lead SOIC (208-mil)
  • 21-ball WLCSP
  • 21-ball low-profile WLCSP

Pin Configuration

The following figures show the available package types.

A

Figure 2. 21-WLCSP (Bottom View)

Figure 3. 8-WSOIC (Top View)

During all operations, V CC must be held stable and within the specified valid range, V CC (min) to V CC (max). All of the input and output signals must be held high or low (according to voltages of V IH , V OH , V IL , or V OL .

Figure 3. 8-WSOIC (Top View)

Table 1. Pin Descriptions

SymbolName and FunctionAsserted StateType
CSCHIP SELECT When this input signal is high, the device is deselected and serial data output pins are at high impedance. Unless an internal program, erase, or write status register cycle is in progress, the device is in the Standby Power Mode (this is not the Deep Power- Down mode). Driving Chip Select (CS) low enables the device, placing it in the active power mode. After power-up, a falling edge on Chip Select (CS) is required before issuing any command.LowInput
SCKSERIAL CLOCK This input signal provides the timing for the serial interface. Commands, addresses, or data present at serial data input are latched on the rising edge of Serial Clock (SCK). Data are shifted out on the falling edge of the Serial Clock (SCK).-Input
SI (I/O 0 )SERIAL INPUT The SI pin is used to shift data into the device. The SI pin is used for all data input, including command and address sequences. Data on the SI pin is always latched in on the rising edge of SCK. With the Dual-Output and Quad-Output Read commands, the SI Pin becomes an output pin (I/O 0 ) in conjunction with other pins to allow two or four bits of data on I/O 3-0 to be clocked in on every falling edge of SCK To maintain consistency with the SPI nomenclature, the SI (I/O 0 ) pin is referenced as the SI pin unless specifically addressing the Dual-I/O and Quad-I/O modes, in which case it is referenced as I/O 0. Data present on the SI pin is ignored whenever the device is deselected (CS is deasserted).-Input/Output
SO (I/O 1 )SERIAL OUTPUT The SO pin is used to shift data out from the device. Data on the SO pin is always clocked out on the falling edge of SCK. With the Dual-Output Read commands, the SO Pin remains an output pin (I/O0) in conjunction with other pins to allow two bits of data on (I/O 1-0 ) to be clocked in on every falling edge of SCK To maintain consistency with the SPI nomenclature, the SO (I/O 1 ) pin is referenced as the SO pin unless specifically addressing the Dual-I/O modes, in which case it is referenced as I/O 1. The SO pin is in a high-impedance state whenever the device is deselected (CS is deasserted).-Input/Output
WP (I/O 2 )WRITE PROTECT The Write Protect (WP) pin can be used to protect the Status Register against data modification. Used with the Status Register's Block Protect (SEC, TB, BP2, BP1, and BP0) bits and Status Register Protect (SRP) bits, a portion or the entire memory array can be hardware protected. The WPpin is active low. When the QE bit of Status Register-2 is set for Quad I/O, the WP pin (Hardware Write Protect) function is not available because this pin is used for IO 2 . The WPpin does not have an internal pull- up; thus, it must be either driven or, if not used, pulled up with an external resistor to V CC .-Input/Output

Table 1. Pin Descriptions

Table 1. Pin Descriptions (Continued)

SymbolName and FunctionAsserted StateType
HOLD (I/O 3 )HOLD The HOLD pin is used to temporarily pause serial communication without deselecting or resetting the device. While the HOLD pin is asserted, transitions on the SCK pin and data on the SI pin are ignored, and the SO pin is placed in a high-impedance state. The CS pin must be asserted, and the SCK pin must be in the low state in order for a Hold condition to start. AHold condition pauses serial communication only; it does not have an effect on internally self-timed operations such as a program or erase cycle. With the Quad-Input Byte/Page Program command, the HOLD pin becomes an input pin (I/O 3 ) and, with other pins, allows four bits (on I/O 3-0 ) of data to be clocked in on every rising edge of SCK. With the Quad-Output Read commands, the HOLD Pin becomes an output pin (I/O 3 ) in conjunction with other pins to allow four bits of data on (I/O3 3-0 ) to be clocked in on every falling edge of SCK. To maintain consistency with SPI nomenclature, the HOLD (I/O 3 ) pin is referenced as the HOLD pin unless specifically addressing the Quad-I/O modes, in which case it is referenced as I/O 3. The HOLD pin does not have an internal pull-up; thus, it must be either driven or, if not used, pulled up with an external resistor to V CC . See Figure 1 and Figure 2 for the pin configuration of Quad I/O and QPI operation.-Input/Output
V CCDEVICE POWER SUPPLY V CC is the supply voltage. It is the single voltage used for all device functions, including read, program, and erase. The V CC pin is used to supply the source voltage to the device. Operations at invalid V CC voltages can produce spurious results; do not attempt this.-Power
GNDGROUND GND is the reference for the V CC supply voltage. The ground reference for the power supply. Connect GND to the system ground.-Power

Table 1. Pin Descriptions (Continued)

Electrical Characteristics

ParameterSymbolConditionsRangeUnit
Supply VoltageV CC-0.6 to V CC + 0.4V
Voltage Applied to Any PinV IORelative to Ground-0.6 to V CC + 0.4V
Transient Voltage on any PinV IOT<20 ns Transient Relative to Ground-1.0 V to V CC + 1.0 VV
Storage TemperatureT STG-65 to + 150° C
Lead TemperatureT LEADSee Note (2)° C
Electrostatic Discharge VoltageV ESDHuman Body Model (3)-2000 to +2000V

Notes:

  1. Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. The Absolute Maximum Ratings are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods can affect device reliability. Voltage extremes referenced in the Absolute Maximum Ratings are intended to accommodate short duration undershoot/overshoot conditions and does not imply or guarantee functional device operation at these levels for any extended period of time.
  2. Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly and the European directive on restrictions on hazardous substances (RoHS) 2002/95/EU.
  3. 3 . JEDEC Std JESD22-A114A (C1 = 100 pF , R1 = 1500 ohms , R2 = 500 ohms).

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
AT25SL128ARenesas Electronics
AT25SL128A-MHE-TRenesas8-UDFN Exposed Pad
AT25SL128A-SHE-TRenesas Electronics
AT25SL128A-UIUERenesas Electronics
AT25SL128A-UIUE-TRenesas Electronics
AT25SL128A-UUE-TRenesas Electronics
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