ADXL345

Part: ADXL345

Type: 3-Axis, ±2 g /±4 g /±8 g /±16 g Digital Accelerometer

Description: The ADXL345 is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g, featuring SPI (3- or 4-wire) and I2C digital interfaces.

Operating Conditions:

• Supply voltage: 2.0 V to 3.6 V
• Operating temperature: -40°C to +85°C
• I/O voltage range: 1.7 V to V S
• Output Data Rate (ODR): 0.1 Hz to 3200 Hz

Absolute Maximum Ratings:

• Max supply voltage: +3.9 V
• Max continuous current: null
• Max junction/storage temperature: +105°C

Key Specs:

• Measurement Range: User selectable ±2, ±4, ±8, ±16 g
• Resolution: Up to 13 Bits at ±16 g (full resolution)
• Sensitivity: 3.9 m g/LSB (All g-ranges, full resolution, Typ)
• 0 g Output for X OUT, Y OUT: -150 to 150 m g (Typ 0 m g)
• Supply Current: 140 μA (ODR ≥ 100 Hz, Typ)
• Standby Mode Leakage Current: 0.1 μA (Typ)
• Nonlinearity: ±0.5 % (Percentage of full scale, Typ)
• Shock Survival: 10,000 g (Any Axis, Unpowered/Powered)

Features:

• Ultralow power: as low as 23 μA in measurement mode and 0.1 μA in standby mode at V S = 2.5 V (typical)
• Power consumption scales automatically with bandwidth
• User-selectable resolution (up to 13-bit at ±16 g)
• Embedded memory management system with FIFO technology
• Single tap/double tap detection
• Activity/inactivity monitoring
• Free-fall detection
• SPI (3- and 4-wire) and I 2 C digital interfaces
• Wide temperature range (-40°C to +85°C)
• 10,000 g shock survival

Applications:

• Handsets
• Medical instrumentation
• Gaming and pointing devices
• Industrial instrumentation
• Personal navigation devices
• Hard disk drive (HDD) protection

Package:

• 3 mm × 5 mm × 1 mm, 14-lead, plastic LGA package

• Ultralow power: as low as 23 μA in measurement mode and 0.1 μA in standby mode at V S = 2.5 V (typical)
• Power consumption scales automatically with bandwidth
• User-selectable resolution
• Fixed 10-bit resolution
• Full resolution, where resolution increases with g range, up to 13-bit resolution at ±16 g (maintaining 4 m g /LSB scale factor in all g ranges )
• Embedded memory management system with FIFO technology minimizes host processor load
• Single tap/double tap detection
• Activity/inactivity monitoring
• Free-fall detection
• Supply voltage range: 2.0 V to 3.6 V
• I/O voltage range: 1.7 V to V S
• SPI (3- and 4-wire) and I 2 C digital interfaces
• Flexible interrupt modes mappable to either interrupt pin
• Measurement ranges selectable via serial command
• Bandwidth selectable via serial command
• Wide temperature range (-40°C to +85°C)
• 10,000 g shock survival
• Pb free/RoHS compliant
• Small and thin: 3 mm × 5 mm × 1 mm LGA package

Figure 3. Pin Configuration (Top View)

Table 5. Pin Function Descriptions

Table 5. Pin Function Descriptions

Figure 4. X-Axis Zero g Offset at 25°C, V S = 2.5 V

Figure 5. Y-Axis Zero g Offset at 25°C, V S = 2.5 V

Figure 6. Z-Axis Zero g Offset at 25°C, V S = 2.5 V

Figure 7. X-Axis Zero g Offset at 25°C, V S = 3.3 V

Figure 8. Y-Axis Zero g Offset at 25°C, V S = 3.3 V

Figure 9. Z-Axis Zero g Offset at 25°C, V S = 3.3 V

Figure 10. X-Axis Zero g Offset Temperature Coefficient, V S = 2.5 V

Figure 11. Y-Axis Zero g Offset Temperature Coefficient, V S = 2.5 V

Figure 12. Z-Axis Zero g Offset Temperature Coefficient, V S = 2.5 V

Figure 13. X-Axis Zero g Offset vs. Temperature-45 Parts Soldered to PCB, VS = 2.5 V

Figure 14. Y-Axis Zero g Offset vs. Temperature-45 Parts Soldered to PCB, VS = 2.5 V

Figure 15. Z-Axis One g Offset vs. Temperature-45 Parts Soldered to PCB, VS = 2.5 V

Figure 16. X-Axis Sensitivity at 25°C, V S = 2.5 V, Full Resolution

Figure 17. Y-Axis Sensitivity at 25°C, V S = 2.5 V, Full Resolution

Figure 18. Z-Axis Sensitivity at 25°C, V S = 2.5 V, Full Resolution

Figure 19. X-Axis Sensitivity Temperature Coefficient, V S = 2.5 V

Figure 20. Y-Axis Sensitivity Temperature Coefficient, V S = 2.5 V

Figure 21. Z-Axis Sensitivity Temperature Coefficient, V S = 2.5 V

Figure 22. X-Axis Sensitivity vs. Temperature-Eight Parts Soldered to PCB, VS = 2.5 V, Full Resolution

Figure 23. Y-Axis Sensitivity vs. Temperature-Eight Parts Soldered to PCB, VS = 2.5 V, Full Resolution

Figure 24. Z-Axis Sensitivity vs. Temperature-Eight Parts Soldered to PCB, VS = 2.5 V, Full Resolution

Figure 25. X-Axis Sensitivity vs. Temperature-Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution

Figure 26. Y-Axis Sensitivity vs. Temperature-Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution

Figure 25. X-Axis Sensitivity vs. Temperature-Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution

Figure 27. Z-Axis Sensitivity vs. Temperature-Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution

Figure 26. Y-Axis Sensitivity vs. Temperature-Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution

Figure 27. Z-Axis Sensitivity vs. Temperature-Eight Parts Soldered to PCB, VS = 3.3 V, Full Resolution

Figure 28. X-Axis Self-Test Response at 25°C, V S = 2.5 V

Figure 29. Y-Axis Self-Test Response at 25°C, V S = 2.5 V

Figure 30. Z-Axis Self-Test Response at 25°C, V S = 2.5 V

Figure 31. Current Consumption at 25°C, 100 Hz Output Data Rate, V S = 2.5 V

Figure 32. Current Consumption vs. Output Data Rate at 25°C-10 Parts, V S = 2.5 V

Figure 33. Supply Current vs. Supply Voltage, V S at 25°C

Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.

Table 3. Package Characteristics