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BHI360

Inertial Measurement Unit (IMU)

The BHI360 is a inertial measurement unit (imu) from Bosch Sensortec. View the full BHI360 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Official BHI360 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Bosch Sensortec

Package

2.5 mm X 3 mm LGA

Lifecycle

Active

BHI360 Key Specifications

ParameterValue
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C
Output TypeI2C, SPI
Package / Case20-VFLGA
PackagingMouseReel
Sensor TypeAccelerometer, Gyroscope, 6 Axis
Standard Pack Qty5000
Supplier Device Package20-LGA (2.5x3)

BHI360 Overview

Part: BHI360 — Bosch Sensortec

Type: Programmable Inertial Measurement Unit (6-axis IMU with MCU and sensor fusion)

Description: Ultra-low-power programmable smart sensor combining a 16-bit 3-axis accelerometer, a 16-bit 3-axis gyroscope, a 32-bit ARC EM4 MCU (Fuser2) and an ultra-low-power custom core, with an integrated BSX sensor fusion library, in a 2.5 mm × 3 mm LGA package.

Operating Conditions:

  • Supply voltage: VDD up to 4 V and VDDIO up to 2.75 V
  • Fuser2 clock: up to 50 MHz (Turbo mode)
  • Host interface: SPI or I2C; SPI and GPIOs up to 50 MHz, I2C up to 3.4 MHz

Absolute Maximum Ratings:

  • Max supply voltage: 4 V (VDD pin), 2.75 V (VDDIO pin)
  • Voltage at any logic pin: -0.3 V to VDDIO+0.3 V
  • Storage temperature: -50 to 150 °C (≤65% rel. humidity)
  • ESD: 2 kV HBM, 500 V CDM, 200 V MM
  • Mechanical shock: 10,000 g (200 μs half sine), 2,900 g (0.3 ms half sine)

Key Specs:

  • CPU: ARC EM4, up to 3.6 CoreMark/MHz, with FPU and MPU
  • Long Run mode: 950 μA at 20 MHz running CoreMark
  • Turbo mode: 2.8 mA at 50 MHz running CoreMark
  • Memory: 256 kByte on-chip SRAM, 144 kByte on-chip ROM preloaded with software
  • Sensors: 16-bit 3-axis accelerometer and 16-bit 3-axis gyroscope
  • GPIOs: up to 8
  • NVM data retention: 10 years at 85 °C after 15 cycles; 14 NVM write cycles max

Features:

  • Host interface configurable as SPI or I2C
  • Two secondary master interfaces (one I²C, one selectable SPI or I²C)
  • 4-channel micro DMA controller
  • Open sensor platform with SDK for custom embedded algorithms on Fuser2
  • Event-driven software framework, OPENRTOS and virtual sensor stack
  • BSX sensor fusion library with dynamic offset autocalibration, 6DoF/9DoF orientation and gravity vector
  • Algorithms on the Bosch Sensortec Core: step counter, tap detection, gesture detection, activity recognition
  • Pin-to-pin backward compatible with many Bosch Sensortec IMUs

Applications:

  • Wearable devices such as smartwatches, hearables and smart glasses
  • Smartphones, tablets and other mobile communication devices
  • 24/7 always-on sensor data processing at ultra-low power

Package:

  • 2.5 mm × 3 mm LGA

BHI360 Features

  • Open sensor platform for development of custom embedded algorithms on Fuser2 (MCU) including SDK
  • Integrated Event-Driven Software Framework and OPENRTOS™ with virtual sensor stack
  • Integrated BSX sensor fusion software library including dynamic offset autocalibration algorithms, 6DoF and 9DoF 3D device orientation, gravity vector, etc. Support for high performance mode as well as several low-power modes
  • Optimized algorithms running on ultra-low-power Bosch Sensortec Core including step counter, tap detection, gesture detection and activity recognition

BHI360 Applications

  • Wearable devices like smartwatches, hearables and smart glasses
  • Smartphones, tablets and other mobile communication devices
  • 24/7 always-on sensor data processing at ultra-low power consumption

BHI360 Electrical Characteristics

Table 119: Electrical characteristics

ParameterSymbolConditionMinTypMaxUnit
Brown-out detection level risingV BROUT - RT A = -40 ◦ C to 85 ◦ C1.31.6V
Voltage Input Low LevelV IL0.3VDDIO-
Voltage Input High LevelV IH0.7VDDIO-
Voltage Output Low Level, auxiliary IMU interface (pads ASDX,V OALVDDIO=1.71V, IOL=3mA0.2VDDIO-
Voltage Output High Level, auxiliary IMU interface (pads ASDX, ASCX, OCSB, OSDO)V OAHVDDIO=1.71V, IOH=3mA0.8VDDIO-
Voltage Output Low Level, all other outputsV OMLVDDIO=1.71V, IOL=4mA for LDS 3) , IOL=6mA for HDS 4)0.3VDDIO-
Voltage Output High Level, all other outputsV OMHVDDIO=1.71V, IOL=4mA for LDS 3) , IOL=6mA for HDS 4)0.7VDDIO-
Internal Pull-up resistor (M3SCL pad)R UPCLK3561107k Ω
Internal pull-up resistors (other pads)R UP71121214k Ω
Internal Pull-down resistor (HSDO pin)R DN62109208k Ω
Pad Capacitance, HSCX, HCSB, HSDX, HSDO, HIRQ, RESETN, JTAG_DIO, M3SDA padsC PAD 11.8pF
Pad Capacitance M3SCL padC PAD 23.6pF
Pad Capacitance ASCX, ASDX, OCSB, OSDO, RESV1, RESV2 padsC PAD 36.8pF
System Oscillator Frequencyf SYSLRLong run mode, T A =25 ◦ C18.42021.6MHz
System Oscillator Frequencyf SYSTTurbo Mode, T A =25 ◦ C465054MHz
System Oscillator Temperature DriftDF SYS - TEMPDrift from 25 ◦ C for T A = -40 ◦ C to 85 ◦ C-66%
ParameterSymbolConditionMinTypMaxUnit
System Oscillator Start-up time 1)OSC SYS - STARTT A =25 ◦ C4μs
Timer Oscillator Frequencyf TMRT A =25 ◦ C125128131kHz
Timer Oscillator Temperature DriftDF TMR - TEMPDrift from 25 ◦ C for T A = -40 ◦ C to 85 ◦ C-55%
Timer Oscillator Start-up time 1)OSC TMR - STARTT A =25 ◦ C250μs
Timer Oscillator trim step size 5)d TRIM - TMRT A =25 ◦ C0.9%
Current consumption, total on pins VDD and VDDIO(I DD + I DDIO )Gyro and Accel in suspend, Fuser2 in Deep Sleep, 32KBytes RAM retention, T A = 25 ◦ C7.8μA
Current consumption, total on pins VDD and VDDIO(I DD + I DDIO )Gyro and Accel in suspend, Fuser2 in Regular Sleep, 32KBytes RAM retention, T A = 25 ◦ C8.1μA
Current consumption, total on pins VDD and VDDIO(I DD + I DDIO )Accel in Low Power Mode, ODR 25Hz, Gyro in suspend, Fuser2 in deep sleep, T =25 ◦ C14μA
Current consumption, total on pins VDD and VDDIO(I DD + I DDIO )Accel in Normal Mode, Gyro in suspend, Fuser2 in deep sleep, T A =25 ◦ C214μA
Current consumption, total on pins VDD and VDDIO(I DD + I DDIO )Accel and Gyro in Low Power Mode, ODR 25Hz, Fuser2 in deep sleep, T A =25 ◦ C424μA
Current consumption, total on pins VDD and VDDIO(I DD + I DDIO )Accel and Gyro in Normal Mode, ODR max, Fuser2 in deep sleep, T A =25 ◦ C689μA
Current consumption, total on pins VDD and VDDIO(I DD + I DDIO )Accel and Gyro in Performance Mode, ODR max, Fuser2 in deep sleep, T A =25 ◦ C974μA
Current consumption, total on pins VDD and VDDIO(I DD + I DDIO )Fuser2 executing matrix multiplication in Long Run mode, Gyro and Accel in suspend, T A = 25 ◦ C840μA
Current consumption, total on pins VDD and VDDIO(I DD + I DDIO )Fuser2 executing CoreMark® in Long Run mode 6) , Gyro and Accel in suspend, T A = 25 ◦ C950μA
Current consumption, total on pins VDD and VDDIO(I DD + I DDIO )Fuser2 executing CoreMark® in Turbo mode 6) , Gyro and Accel in suspend, T A = 25 ◦ C2800μA
ParameterSymbolConditionMinTypMaxUnit
Fuser2 CPU benchmarkMetaware compiler ccac, compiler options set for maximum performance3.67Core Mark / MHz

BHI360 Absolute Maximum Ratings

Table 117: Absolute maximum ratings 1

ParameterConditionMinMaxUnit
Voltage at Supply PinVDD Pin-0.34V
Voltage at Supply PinVDDIO Pin-0.32.75V
Voltage at any Logic PinNon-Supply Pin-0.3VDDIO+0.3V
Passive Storage Temp. Range<=65% rel. H.-50150◦ C
None-volatile memory (NVM) Data RetentionT = 85 ◦ C, after 15 cycles10y
Non-volatile memory (NVM) write-cyclesUsing Physical Sensor Control Parameters14cycles
Mechanical ShockDuration 200 μs, half sine10,000g
Mechanical ShockDuration 0.3 ms, half sine2,900g
Mechanical ShockFree fall onto hard surfaces2m
ESDHBM2kV
ESDCDM500V
ESDMM200V

Other IMUs / Motion Sensors

  • LIS3DH – STMicroelectronics, 3-axis Linear Accelerometer
  • LSM6DSL – STMicroelectronics, iNEMO Inertial Module (3D Accelerometer and 3D Gyroscope)
  • BMI270 – Bosch Sensortec, Inertial Measurement Unit
  • ADXL345 – Analog Devices, 3-Axis Digital Accelerometer
  • ADXL345BCCZ – Analog Devices, 3-Axis Digital Accelerometer
  • ADXL345BCCZ-RL – Analog Devices, 3-Axis Digital Accelerometer
  • ADXL345BCCZ-RL7 – Analog Devices, 3-Axis Digital Accelerometer
  • ADXL345Z – Analog Devices, 3-Axis Digital Accelerometer

All IMUs / Motion Sensors datasheetsAll Bosch Sensortec datasheets (16)

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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