BHI360
Inertial Measurement Unit (IMU)The BHI360 is a inertial measurement unit (imu) from Bosch Sensortec. View the full BHI360 datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.
Manufacturer
Bosch Sensortec
Category
Inertial Measurement Unit (IMU)
Package
2.5 mm X 3 mm LGA
Key Specifications
| Parameter | Value |
|---|---|
| Packaging | MouseReel |
| Packaging | MouseReel |
| Packaging | MouseReel |
| Standard Pack Qty | 5000 |
| Standard Pack Qty | 5000 |
| Standard Pack Qty | 5000 |
Overview
Part: BHI360 — Bosch Sensortec
Type: Programmable, low power, Inertial Measurement Unit with integrated sensor fusion library
Description: The BHI360 is a highly integrated, ultra-low-power, programmable smart sensor system featuring a best-in-class 6-axis IMU, a programmable 32-bit Fuser2 microcontroller, an additional ultra-low-power MCU, and preinstalled sensor data processing algorithms, all integrated in a 2.5 mm X 3 mm LGA package.
Operating Conditions:
- Max Fuser2 MCU clock: 50 MHz
Absolute Maximum Ratings:
Key Specs:
- Integrated accelerometer: 16-bit 3-axis
- Integrated gyroscope: 16-bit 3-axis
- Fuser2 MCU: ARC EM4 CPU (up to 3.6 CoreMark/MHz)
- Fuser2 on-chip SRAM: 256 kByte
- Fuser2 on-chip ROM: 144 kByte
- Fuser2 Long Run mode current: 950 μA @ 20 MHz running CoreMark®
- Fuser2 Turbo mode current: 2.8 mA @ 50 MHz running CoreMark®
- Host interface SPI speed: up to 50 MHz
- Host interface I2C speed: up to 3.4 MHz
Features:
- Open sensor platform for development of custom embedded algorithms on Fuser2 (MCU) including SDK
- Integrated Event-Driven Software Framework and OPENRTOS™ with virtual sensor stack
- Integrated BSX sensor fusion software library including dynamic offset autocalibration algorithms, 6DoF and 9DoF 3D device orientation, gravity vector, etc.
- Optimized algorithms running on ultra-low-power Bosch Sensortec Core including step counter, tap detection, gesture detection and activity recognition
Applications:
- Wearable devices like smartwatches, hearables and smart glasses
- Smartphones, tablets and other mobile communication devices
- 24/7 always-on sensor data processing at ultra-low power consumption
Package:
- LGA (2.5 mm X 3 mm)
Features
- Open sensor platform for development of custom embedded algorithms on Fuser2 (MCU) including SDK
- Integrated Event-Driven Software Framework and OPENRTOS™ with virtual sensor stack
- Integrated BSX sensor fusion software library including dynamic offset autocalibration algorithms, 6DoF and 9DoF 3D device orientation, gravity vector, etc. Support for high performance mode as well as several low-power modes
- Optimized algorithms running on ultra-low-power Bosch Sensortec Core including step counter, tap detection, gesture detection and activity recognition
Applications
- Wearable devices like smartwatches, hearables and smart glasses
- Smartphones, tablets and other mobile communication devices
- 24/7 always-on sensor data processing at ultra-low power consumption
Pin Configuration
BHI360 LGA-20 Pinout
| Pin | Name | Type | Description |
|---|---|---|---|
| 1 | VDDIO | P | I/O Supply Voltage |
| 2 | GND | P | Ground |
| 3 | CSB | I | Chip Select / I2C Address Select |
| 4 | SDO | I/O | SPI MISO / I2C Address Select |
| 5 | SCL/SCLK | I | I2C Clock / SPI Clock |
| 6 | SDA/MOSI | I/O | I2C Data / SPI MOSI |
| 7 | SDI | I | SPI MOSI (4-wire mode) |
| 8 | INT2 | O | Interrupt Output 2 |
| 9 | INT1 | O | Interrupt Output 1 |
| 10 | VDDIO | P | I/O Supply Voltage |
| 11 | GND | P | Ground |
| 12 | GPIO3 | I/O | General Purpose I/O 3 |
| 13 | GPIO2 | I/O | General Purpose I/O 2 |
| 14 | GPIO1 | I/O | General Purpose I/O 1 |
| 15 | GPIO0 | I/O | General Purpose I/O 0 |
| 16 | OPA2 | I/O | Secondary Master Interface 2 (SPI/I2C) |
| 17 | OPA1 | I/O | Secondary Master Interface 2 (SPI/I2C) |
| 18 | OPA0 | I/O | Secondary Master Interface 1 (I2C) |
| 19 | OPA3 | I/O | Secondary Master Interface 3 (SPI/I2C) |
| 20 | VDD | P | Core Supply Voltage |
Notes
- Package: LGA-20 (2.5 mm × 3 mm)
- Power pins: VDD (pin 20) is core supply; VDDIO (pins 1, 10) are I/O supply; GND (pins 2, 11) are ground returns
- Host Interface: Configurable as SPI (4-wire or 3-wire) or I2C via pins 3–7
- GPIO: Pins 12–15 provide up to 4 general-purpose I/O pins
- Secondary Interfaces: Pins 16–19 support secondary master interfaces (I2C and/or SPI)
- Interrupts: INT1 (pin 9) and INT2 (pin 8) are host interrupt outputs
- Pin numbering: Extracted from the LGA package diagram showing a 5×4 grid layout with pin 1 at top-left corner
Electrical Characteristics
Table 119: Electrical characteristics
| Parameter | Symbol | Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Brown-out detection level rising | V BROUT - R | T A = -40 ◦ C to 85 ◦ C | 1.3 | 1.6 | V | |
| Voltage Input Low Level | V IL | 0.3VDDIO | - | |||
| Voltage Input High Level | V IH | 0.7VDDIO | - | |||
| Voltage Output Low Level, auxiliary IMU interface (pads ASDX, | V OAL | VDDIO=1.71V, IOL=3mA | 0.2VDDIO | - | ||
| Voltage Output High Level, auxiliary IMU interface (pads ASDX, ASCX, OCSB, OSDO) | V OAH | VDDIO=1.71V, IOH=3mA | 0.8VDDIO | - | ||
| Voltage Output Low Level, all other outputs | V OML | VDDIO=1.71V, IOL=4mA for LDS 3) , IOL=6mA for HDS 4) | 0.3VDDIO | - | ||
| Voltage Output High Level, all other outputs | V OMH | VDDIO=1.71V, IOL=4mA for LDS 3) , IOL=6mA for HDS 4) | 0.7VDDIO | - | ||
| Internal Pull-up resistor (M3SCL pad) | R UPCLK | 35 | 61 | 107 | k Ω | |
| Internal pull-up resistors (other pads) | R UP | 71 | 121 | 214 | k Ω | |
| Internal Pull-down resistor (HSDO pin) | R DN | 62 | 109 | 208 | k Ω | |
| Pad Capacitance, HSCX, HCSB, HSDX, HSDO, HIRQ, RESETN, JTAG_DIO, M3SDA pads | C PAD 1 | 1.8 | pF | |||
| Pad Capacitance M3SCL pad | C PAD 2 | 3.6 | pF | |||
| Pad Capacitance ASCX, ASDX, OCSB, OSDO, RESV1, RESV2 pads | C PAD 3 | 6.8 | pF | |||
| System Oscillator Frequency | f SYSLR | Long run mode, T A =25 ◦ C | 18.4 | 20 | 21.6 | MHz |
| System Oscillator Frequency | f SYST | Turbo Mode, T A =25 ◦ C | 46 | 50 | 54 | MHz |
| System Oscillator Temperature Drift | DF SYS - TEMP | Drift from 25 ◦ C for T A = -40 ◦ C to 85 ◦ C | -6 | 6 | % |
| Parameter | Symbol | Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| System Oscillator Start-up time 1) | OSC SYS - START | T A =25 ◦ C | 4 | μs | ||
| Timer Oscillator Frequency | f TMR | T A =25 ◦ C | 125 | 128 | 131 | kHz |
| Timer Oscillator Temperature Drift | DF TMR - TEMP | Drift from 25 ◦ C for T A = -40 ◦ C to 85 ◦ C | -5 | 5 | % | |
| Timer Oscillator Start-up time 1) | OSC TMR - START | T A =25 ◦ C | 250 | μs | ||
| Timer Oscillator trim step size 5) | d TRIM - TMR | T A =25 ◦ C | 0.9 | % | ||
| Current consumption, total on pins VDD and VDDIO | (I DD + I DDIO ) | Gyro and Accel in suspend, Fuser2 in Deep Sleep, 32KBytes RAM retention, T A = 25 ◦ C | 7.8 | μA | ||
| Current consumption, total on pins VDD and VDDIO | (I DD + I DDIO ) | Gyro and Accel in suspend, Fuser2 in Regular Sleep, 32KBytes RAM retention, T A = 25 ◦ C | 8.1 | μA | ||
| Current consumption, total on pins VDD and VDDIO | (I DD + I DDIO ) | Accel in Low Power Mode, ODR 25Hz, Gyro in suspend, Fuser2 in deep sleep, T =25 ◦ C | 14 | μA | ||
| Current consumption, total on pins VDD and VDDIO | (I DD + I DDIO ) | Accel in Normal Mode, Gyro in suspend, Fuser2 in deep sleep, T A =25 ◦ C | 214 | μA | ||
| Current consumption, total on pins VDD and VDDIO | (I DD + I DDIO ) | Accel and Gyro in Low Power Mode, ODR 25Hz, Fuser2 in deep sleep, T A =25 ◦ C | 424 | μA | ||
| Current consumption, total on pins VDD and VDDIO | (I DD + I DDIO ) | Accel and Gyro in Normal Mode, ODR max, Fuser2 in deep sleep, T A =25 ◦ C | 689 | μA | ||
| Current consumption, total on pins VDD and VDDIO | (I DD + I DDIO ) | Accel and Gyro in Performance Mode, ODR max, Fuser2 in deep sleep, T A =25 ◦ C | 974 | μA | ||
| Current consumption, total on pins VDD and VDDIO | (I DD + I DDIO ) | Fuser2 executing matrix multiplication in Long Run mode, Gyro and Accel in suspend, T A = 25 ◦ C | 840 | μA | ||
| Current consumption, total on pins VDD and VDDIO | (I DD + I DDIO ) | Fuser2 executing CoreMark® in Long Run mode 6) , Gyro and Accel in suspend, T A = 25 ◦ C | 950 | μA | ||
| Current consumption, total on pins VDD and VDDIO | (I DD + I DDIO ) | Fuser2 executing CoreMark® in Turbo mode 6) , Gyro and Accel in suspend, T A = 25 ◦ C | 2800 | μA |
| Parameter | Symbol | Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Fuser2 CPU benchmark | Metaware compiler ccac, compiler options set for maximum performance | 3.67 | Core Mark / MHz |
Absolute Maximum Ratings
Table 117: Absolute maximum ratings 1
| Parameter | Condition | Min | Max | Unit |
|---|---|---|---|---|
| Voltage at Supply Pin | VDD Pin | -0.3 | 4 | V |
| Voltage at Supply Pin | VDDIO Pin | -0.3 | 2.75 | V |
| Voltage at any Logic Pin | Non-Supply Pin | -0.3 | VDDIO+0.3 | V |
| Passive Storage Temp. Range | <=65% rel. H. | -50 | 150 | ◦ C |
| None-volatile memory (NVM) Data Retention | T = 85 ◦ C, after 15 cycles | 10 | y | |
| Non-volatile memory (NVM) write-cycles | Using Physical Sensor Control Parameters | 14 | cycles | |
| Mechanical Shock | Duration 200 μs, half sine | 10,000 | g | |
| Mechanical Shock | Duration 0.3 ms, half sine | 2,900 | g | |
| Mechanical Shock | Free fall onto hard surfaces | 2 | m | |
| ESD | HBM | 2 | kV | |
| ESD | CDM | 500 | V | |
| ESD | MM | 200 | V |
Ordering Information
| MPN | Package | Temperature Range | Packing |
|---|---|---|---|
| BHI360 | 2.5 mm X 3 mm LGA | null | null |
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