ADAU1466

Part: ADAU1466WBCPZ300 — Analog Devices

Type: Automotive Audio DSP (SigmaDSP Digital Audio Processor)

Description: Automotive-qualified 32-bit SigmaDSP audio processor with a 294.912 MHz core at 1.2 V, 24 kWords of program memory, 80 kWords of data memory, 48-channel digital I/O and 8 stereo ASRCs.

Operating Conditions:

• Supply voltage: AVDD 2.97–3.63 V, PVDD 2.97–3.63 V, IOVDD 1.71–3.63 V, DVDD 1.14–1.26 V
• Operating temperature: -40 to +105 °C
• DSP core clock: up to 294.912 MHz
• Master clock input: 12.288 MHz (typical specification condition)

Absolute Maximum Ratings:

• DVDD to ground: 0 to 1.4 V
• AVDD, IOVDD, PVDD to ground: 0 to 4.0 V
• Digital inputs: DGND − 0.3 V to IOVDD + 0.3 V
• Maximum junction temperature: 125 °C
• Storage temperature: -65 to +150 °C
• Soldering (10 sec): 300 °C

Key Specs:

• AVDD analog current: 1.66 mA typ, 2 mA max
• PLL current (PVDD): 10.1 mA typ, 12.9 mA max at 25 °C (12.288 MHz MCLK, default PLL settings)
• DVDD current, maximum program (25 °C): 233 mA typ, 495 mA max
• DVDD current, maximum program (-40 to +105 °C): 485 mA typ, 920 mA max
• DVDD current, typical program (25 °C): 220 mA (16-channel I/O, 10-band EQ per channel, all ASRCs active)
• IOVDD operating current: 53 mA typ at 3.3 V; 22 mA typ at 1.8 V (all serial ports clock masters)
• ASRC dynamic range: 139 dB (A-weighted, 20 Hz–20 kHz)
• ASRC I/O sample rate: 6–192 kHz, ratio 1:8 to 7.75:1
• Crystal oscillator transconductance: 10.6 mS typ

Features:

• Qualified for automotive applications
• Fully programmable audio DSP, programmed with the SigmaStudio graphical tool
• Up to 6144 SIMD instructions per sample at 48 kHz
• Up to 1600 ms digital audio delay pool at 48 kHz
• 4 serial input ports and 4 serial output ports; 48-channel, 32-bit digital I/O up to 192 kHz
• TDM, I²S, left/right-justified and PCM formats
• Up to 8 stereo ASRCs
• Stereo S/PDIF input and output at 192 kHz
• Four PDM microphone input channels
• Crystal oscillator, integer PLL and flexible clock generators
• Integrated die temperature sensor
• I²C and SPI control interfaces (slave and master); self-boot from serial EEPROM
• 6-channel, 10-bit SAR auxiliary control ADC
• 14 multipurpose pins
• On-chip regulator generating 1.2 V from a 3.3 V supply

Applications:

• Automotive audio processing
• Head units
• Distributed amplifiers
• Rear seat entertainment systems
• Trunk amplifiers
• Commercial and professional audio processing

Package:

• 72-lead LFCSP, 10 mm × 10 mm, with 5.3 mm exposed pad

Qualified for automotive applications

Fully programmable audio DSP for enhanced sound processing

Features SigmaStudio, a proprietary graphical programming

tool for the development of custom signal flows

Up to 294.912 MHz, 32-bit SigmaDSP core at 1.2 V

Up to 24 kWords of program memory

Up to 80 kWords of parameter/data RAM

Up to 6144 SIMD instructions per sample at 48 kHz

Up to 1600 ms digital audio delay pool at 48 kHz

Audio I/O and routing

4 serial input ports, 4 serial output ports

48-channel, 32-bit digital I/O up to a sample rate of 192 kHz

Flexible configuration for TDM, I 2 S, left and right justified formats, and PCM

Up to 8 stereo ASRCs from 1:8 up to 7.75:1 ratio and 139 dB dynamic range

Stereo S/PDIF input and output at 192 kHz

Four PDM microphone input channels

Multichannel, byte addressable TDM serial ports

Automotive audio processing

Head units

Distributed amplifiers

Rear seat entertainment systems

Trunk amplifiers

Commercial and professional audio processing

Digital Input/Output

Table 4.

Parameter	Min	Typ	Max	Unit	Test Conditions/Comments
DIGITAL INPUT
Input Voltage					Excluding SPDIFIN, which is not a standard digital input
IOVDD = 3.3V
High Level (V IH )	1.71		3.3	V
Low Level (V IL )	0		1.71	V
IOVDD = 1.8V
High Level (V IH )	0.92		1.8	V
Low Level (V IL )	0		0.89	V
Input Leakage
High Level (I IH )			2	μA	Digital input pins with pull-up resistor
			14	μA	Digital input pins with pull-down resistor
			2	μA	Digital input pins with no pull resistor
			8	μA	MCLK
			120	μA	SPDIFIN
Low Level (I IL ) at 0V	-14			μA	Digital input pins with pull-up resistor
	-2			μA	Digital input pins with pull-down resistor
	-2			μA	Digital input pins with no pull resistor
	-8			μA	MCLK
	-120			μA	SPDIFIN
Input Capacitance (C I )		2		pF	Guaranteed by design
DIGITAL OUTPUT
Output Voltage
IOVDD = 3.3V High Level (V OH )	3.09		3.3	V	I OH =1mA
Low Level (V OL )	0		0.26	V	I OL =1mA
IOVDD = 1.8V
High Level (V OH )	1.45		1.8
Low Level (V OL )	0		0.33
Digital Output Pins, Output Drive					Thedigital output pins are driving low impedance PCBtraces to a
IOVDD=1.8V
Drive Strength Setting Lowest			1	mA	The digital output pins are not designed for static current draw; do not use these pins to drive LEDs directly
Low			2	mA	The digital output pins are not designed for static current draw; do not use these pins to drive LEDs directly
High			3	mA	The digital output pins are not designed for static current draw; do not use these pins to drive LEDs directly
Highest			5	mA	The digital output pins are not designed for static current draw; do not use these pins to drive LEDs directly
IOVDD= 3.3V
Drive Strength Setting
Lowest			2	mA	The digital output pins are not designed for static current draw; do not use these pins to drive LEDs directly
Low			5	mA	The digital output pins are not designed for static current draw; do not use these pins to drive LEDs directly
High			10	mA	The digital output pins are not designed for static current draw; do not use these pins to drive LEDs directly
Highest			15	mA	The digital output pins are not designed for static current draw; do not use these pins to drive LEDs directly

Data Sheet

Table 16.

Parameter	Rating
DVDD to Ground	0V to 1.4V
AVDD to Ground	0V to 4.0V
IOVDD to Ground	0V to 4.0V
PVDD to Ground	0V to 4.0V
Digital Inputs	DGND-0.3V to IOVDD + 0.3V
MaximumAmbientTemperatureRange	-40°C to +105°C
MaximumJunctionTemperature	125°C
Storage Temperature Range	-65°C to +150°C
Soldering (10 sec)	300°C

Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.

The capabilities of the ADAU1462/ADAU1466 are such that it is possible to configure the device in a mode where its power dissipation can risk exceeding the absolute maximum junction temperature. The junction temperature reached in a device is influenced by several factors, for example, the power dissipated in the device; the thermal efficiency of the printed circuit board (PCB) design; the maximum ambient temperature supported in the application.

To ensure that the ADAU1462/ADAU1466 does not exceed its absolute maximum junction temperature in an application, thermal considerations must be taken from the start of the design (for example: likely modes of operation, thermal considerations in the PCB design (see the AN-772 Application Note), and thermal simulations) to its finish (qualification at the maximum ambient temperature supported in the application).

While all of the following thermal coefficients can be used to analyze the thermal performance of ADAU1462/ADAU1466, ψJT is the most reflective of real-world applications and is recommended as the primary approach for thermal qualification.

Table 17. Thermal Coefficients for ADAU1462/ADAU1466

Thermal Coefficient	Value	Unit
ψ JT 1	0.15	°C/W
θ JA 1	29.15	°C/W
θ JB 2	10.59	°C/W
θ JCT 3	0.04	°C/W
θ JCB 4	3.39	°C/W

• 1 Based on simulation using a JEDEC 2s2p thermal test PCB with 25 thermal vias in a JEDEC natural convection environment, as per JESD51.
• 2 Based on simulation using a JEDEC 2s2p thermal test PCB with 25 thermal vias in a JEDEC Junction to Board environment, as per JESD51.

3 Based on simulation using a cold plate attached directly to exposed paddle.

To employ the ψJT-based approach to thermal analysis,

1. Configure the ADAU1462/ADAU1466 in the highest power mode of operation to be used in the application and record the power dissipated in the device.
2. Compute the maximum allowable surface temperature, TS_MAX:

TS_MAX = TJ_MAX - ( Power × ψJT )

1. Measure the case temperature at the center of the ADAU1462/ADAU1466 package (TS) at the maximum ambient temperature supported in the application and compare to TS_MAX.
2. For safe operation, use TS < TS_MAX in the highest power mode of operation in the application.

For more information, see the PCB Design Considerations section and the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) .

Figure 90. Automotive Infotainment Amplifier Block Diagram

14810-086