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YLED0805R

The YLED0805R is an electronic component. View the full YLED0805R datasheet below including absolute maximum ratings.

Overview

Type: Red Light LED

Description: Red light LED with 2.0x1.25x0.85mm package, 1.8–2.4 V forward voltage, 20 mA DC forward current, and 48–120 mcd light intensity.

Operating Conditions:

  • Supply voltage: 1.8–2.4 V (Forward Voltage)
  • Operating temperature: -40 to +85 °C
  • Dominant Wavelength: 615–630 nm (at IF = 10mA)
  • Light Intensity: 48–120 mcd (at IF = 10mA)

Absolute Maximum Ratings:

  • Max power dissipation: 60 mW
  • Max peak forward current: 60 mA (1/10 duty cycle, 0.1ms pulse width)
  • Max continuous current: 20 mA (DC Forward Current)
  • Max storage temperature: +85 °C

Key Specs:

  • Light Intensity (IV): 48 mcd (Min) to 120 mcd (Max) at IF = 10mA
  • Viewing Angle (2θ1/2): 120 deg (Typ) at IF = 10mA
  • Dominant Wavelength (λd): 615 nm (Min) to 630 nm (Max) at IF = 10mA
  • Peak Wavelength (λp): 625 nm (Min) to 645 nm (Max) at IF = 10mA
  • Forward Voltage (VF): 1.8 V (Min) to 2.4 V (Max) at IF = 10mA
  • Reverse current (IR): Not designed for reverse operation at VR = 5V
  • Spectral Line Half-Width (Δλ): 20 nm (Typ) at IF = 10mA

Features:

  • Red light
  • Transparent planar colloid lens
  • EIA STD Package
  • Meet ROHS, Green Product
  • Compatible With SMT Automatic Equipment
  • Compatible With Infrared Reflow Solder Process

Package:

  • 2.0x1.25x0.85mm

Features

  • 外观尺寸 / Package ( L/W/H ) : 2.01.250.85mm
  • 颜色 / Color: 红光 / Red light
  • 胶体 / Lens: 透明平面胶体 / Transparent planar colloid
  • EIA 规范标准包装/ EIA STD P ackage
  • 环保产品,符合 ROHS 要求/ Meet ROHS, Green Product
  • 适用于自动贴片机/ Compatible With SMT Automatic Equipment
  • 适用于红外线回流焊制程/ Compatible With Infrared Reflow Solder Process

Absolute Maximum Ratings

参 数/ Parameter符号 Symbol最大额定值 / Rating单 位/ Unit
消耗功率/ Power DissipationPd60mW
最大脉冲电流/ Peak Forward Current (1/10 占空比 , 0.1ms 脉宽 )IFP60mA
正向直流工作电流/ DC Forward CurrentIF20mA
工作温度范围 Operating Temperature RangeTopr-40 ° C ~ + 8 5 ° C-40 ° C ~ + 8 5 ° C
存储温度范围 Storage Temperature RangeTstg-40 ° C ~ + 85 ° C-40 ° C ~ + 85 ° C
焊接条件 Soldering ConditionTsol回流焊 / Reflow soldering : 260 ° C ,10 s 手动焊 / Hand soldering : 300 ° C , 3s回流焊 / Reflow soldering : 260 ° C ,10 s 手动焊 / Hand soldering : 300 ° C , 3s
抗静电能力 Electrostatic DischargeESDV
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