YLED0805R
The YLED0805R is an electronic component. View the full YLED0805R datasheet below including absolute maximum ratings.
Overview
Type: Red Light LED
Description: Red light LED with 2.0x1.25x0.85mm package, 1.8–2.4 V forward voltage, 20 mA DC forward current, and 48–120 mcd light intensity.
Operating Conditions:
- Supply voltage: 1.8–2.4 V (Forward Voltage)
- Operating temperature: -40 to +85 °C
- Dominant Wavelength: 615–630 nm (at IF = 10mA)
- Light Intensity: 48–120 mcd (at IF = 10mA)
Absolute Maximum Ratings:
- Max power dissipation: 60 mW
- Max peak forward current: 60 mA (1/10 duty cycle, 0.1ms pulse width)
- Max continuous current: 20 mA (DC Forward Current)
- Max storage temperature: +85 °C
Key Specs:
- Light Intensity (IV): 48 mcd (Min) to 120 mcd (Max) at IF = 10mA
- Viewing Angle (2θ1/2): 120 deg (Typ) at IF = 10mA
- Dominant Wavelength (λd): 615 nm (Min) to 630 nm (Max) at IF = 10mA
- Peak Wavelength (λp): 625 nm (Min) to 645 nm (Max) at IF = 10mA
- Forward Voltage (VF): 1.8 V (Min) to 2.4 V (Max) at IF = 10mA
- Reverse current (IR): Not designed for reverse operation at VR = 5V
- Spectral Line Half-Width (Δλ): 20 nm (Typ) at IF = 10mA
Features:
- Red light
- Transparent planar colloid lens
- EIA STD Package
- Meet ROHS, Green Product
- Compatible With SMT Automatic Equipment
- Compatible With Infrared Reflow Solder Process
Package:
- 2.0x1.25x0.85mm
Features
- 外观尺寸 / Package ( L/W/H ) : 2.01.250.85mm
- 颜色 / Color: 红光 / Red light
- 胶体 / Lens: 透明平面胶体 / Transparent planar colloid
- EIA 规范标准包装/ EIA STD P ackage
- 环保产品,符合 ROHS 要求/ Meet ROHS, Green Product
- 适用于自动贴片机/ Compatible With SMT Automatic Equipment
- 适用于红外线回流焊制程/ Compatible With Infrared Reflow Solder Process
Absolute Maximum Ratings
| 参 数/ Parameter | 符号 Symbol | 最大额定值 / Rating | 单 位/ Unit |
|---|---|---|---|
| 消耗功率/ Power Dissipation | Pd | 60 | mW |
| 最大脉冲电流/ Peak Forward Current (1/10 占空比 , 0.1ms 脉宽 ) | IFP | 60 | mA |
| 正向直流工作电流/ DC Forward Current | IF | 20 | mA |
| 工作温度范围 Operating Temperature Range | Topr | -40 ° C ~ + 8 5 ° C | -40 ° C ~ + 8 5 ° C |
| 存储温度范围 Storage Temperature Range | Tstg | -40 ° C ~ + 85 ° C | -40 ° C ~ + 85 ° C |
| 焊接条件 Soldering Condition | Tsol | 回流焊 / Reflow soldering : 260 ° C ,10 s 手动焊 / Hand soldering : 300 ° C , 3s | 回流焊 / Reflow soldering : 260 ° C ,10 s 手动焊 / Hand soldering : 300 ° C , 3s |
| 抗静电能力 Electrostatic Discharge | ESD | V |
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