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W25Q128

Serial Flash Memory

The W25Q128 is a serial flash memory from Winbond. View the full W25Q128 datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Winbond

Category

Memory ICs

Overview

Part: W25Q128JV

Type: Serial Flash Memory

Description: 128M-bit (16M-byte) serial flash memory with Standard, Dual, and Quad SPI interfaces, supporting up to 133MHz clock frequencies (532MHz equivalent Quad I/O) and operating from a 2.7V to 3.6V supply.

Operating Conditions:

  • Supply voltage: 2.7V to 3.6V
  • Operating temperature: -40°C to +85°C, -40°C to +105°C
  • Max SPI clock frequency: 133MHz (Single, Dual/Quad SPI)
  • Equivalent Dual/Quad SPI clock: 266MHz (Dual I/O), 532MHz (Quad I/O)

Key Specs:

  • Capacity: 128M-bit / 16M-byte
  • Page size: 256-bytes
  • Sector erase size: 4KB
  • Continuous data transfer rate: 66MB/S
  • Program-Erase cycles: Min. 100K per sector
  • Data retention: More than 20-year
  • Power-down current: <1μA (typ.)
  • Array organization: 65,536 programmable pages
  • Erasable sectors: 4,096

Features:

  • New Family of SpiFlash Memories
  • Flexible Architecture with 4KB sectors
  • Standard SPI: CLK, /CS, DI, DO
  • Dual SPI: CLK, /CS, IO0, IO1
  • Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
  • Software & Hardware Reset
  • Highest Performance Serial Flash
  • Efficient 'Continuous Read' with 8/16/32/64-Byte Wrap
  • Allows true XIP (execute in place) operation
  • Low Power, Wide Temperature Range
  • Uniform Sector/Block Erase (4K/32K/64K-Byte)
  • Program 1 to 256 byte per programmable page
  • Erase/Program Suspend & Resume
  • Advanced Security Features: Software and Hardware Write-Protect, Power Supply Lock-Down, Special OTP protection, Top/Bottom, Complement array protection, Individual Block/Sector array protection, 64-Bit Unique ID, Discoverable Parameters (SFDP) Register, 3X256-Bytes Security Registers with OTP locks, Volatile & Non-volatile

Package:

  • SOIC 208-mil (8-Pin)
  • WSON 6x5-mm (8-Pad)
  • WSON 8x6-mm (8-Pad)
  • SOIC 300-mil
  • TFBGA 8x6-mm (24-Ball, 5x5-1 or 6x4 Ball Array)
  • WLCSP (24-Ball)

Part

Features

  • New Family of SpiFlash Memories Flexible Architecture with 4KB sectors
  • W25Q128JV: 128M-bit / 16M-byte
  • Standard SPI: CLK, /CS, DI, DO
  • Dual SPI: CLK, /CS, IO0, IO1
  • Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
  • Software & Hardware Reset (1)
  • Highest Performance Serial Flash
  • 133MHz Single, Dual/Quad SPI clocks
  • 266/532MHz equivalent Dual/Quad SPI
  • 66MB/S continuous data transfer rate
  • Min. 100K Program-Erase cycles per sector
  • More than 20-year data retention
  • Efficient 'Continuous Read'
  • Continuous Read with 8/16/32/64-Byte Wrap
  • As few as 8 clocks to address memory
  • Allows true XIP (execute in place) operation
  • Low Power, Wide Temperature Range
  • Single 2.7 to 3.6V supply
  • <1μA Power-down (typ.)
  • -40°C to +85°C operating range
  • -40°C to +105°C operating range
  • Uniform Sector/Block Erase (4K/32K/64K-Byte)
  • Program 1 to 256 byte per programmable page
  • Erase/Program Suspend & Resume
  • Advanced Security Features
  • Software and Hardware Write-Protect
  • Power Supply Lock-Down
  • Special OTP protection
  • Top/Bottom, Complement array protection
  • Individual Block/Sector array protection
  • 64-Bit Unique ID for each device
  • Discoverable Parameters (SFDP) Register
  • 3X256-Bytes Security Registers with OTP locks
  • Volatile & Non-volatile Status Register Bits
  • Space Efficient Packaging
  • 8-pin SOIC 208-mil
  • 16-pin SOIC 300-mil (additional /RESET pin)
  • 8-pad WSON 6x5-mm / 8x6-mm
  • 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
  • 24-ball WLCSP
  • Contact Winbond for KGD and other options

Note: 1. Hardware /RESET pin is only available on TFBGA or SOIC16 packages

  • 4 - Revision F

Pin Configuration

Figure 1a. W25Q128JV Pin Assignments, 8-pin SOIC 208-mil (Package Code S)

Figure 1a. W25Q128JV Pin Assignments, 8-pin SOIC 208-mil (Package Code S)

Electrical Characteristics

PARAMETERSYMBOLCONDITIONSSPECSPECSPECUNIT
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNIT
Input CapacitanceCIN (1)VIN = 0V (1)6pF
Output CapacitanceCout (1)VOUT = 0V (1)8pF
Input LeakageI LI±2μA
I/O LeakageILO±2μA
Standby CurrentICC1/CS = VCC, VIN = GND or VCC1060μA
Power-down CurrentICC2/CS = VCC, VIN = GND or VCC120μA
Current Read Data / Dual /Quad 50MHz (2)ICC3C = 0.1 VCC / 0.9 VCC DO = Open815mA
Current Read Data / Dual /Quad 80MHz (2)ICC3C = 0.1 VCC / 0.9 VCC DO = Open1018mA
Current Read Data / Dual /Quad 104MHz (2)ICC3C = 0.1 VCC / 0.9 VCC DO = Open1220mA
Current Write Status RegisterICC4/CS = VCC2025mA
Current Page ProgramICC5/CS = VCC2025mA
Current Sector/Block EraseICC6/CS = VCC2025mA
Current Chip EraseICC7/CS = VCC2025mA
Input Low VoltageVIL-0.5VCC x 0.3V
Input High VoltageVIHVCC x 0.7VCC + 0.4V
Output Low VoltageVOLIOL = 100 μA0.2V
Output High VoltageVOHIOH = -100 μAVCC - 0.2V
  1. Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 3.0V.
  2. Checker Board Pattern.
  • 62 - Revision F

Absolute Maximum Ratings

PARAMETERSSYMBOLCONDITIONSRANGEUNIT
Supply VoltageVCC-0.6 to 4.6V
Voltage Applied to Any PinVIORelative to Ground-0.6 to VCC+0.4V
Transient Voltage on any PinVIOT<20nS Transient Relative to Ground-2.0V to VCC+2.0VV
Storage TemperatureTSTG-65 to +150° C
Lead TemperatureTLEADSee Note (2)° C
Electrostatic Discharge VoltageVESDHuman Body Model (3)-2000 to +2000V
  1. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device reliability. Exposure beyond absolute maximum ratings may cause permanent damage.
  2. Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly and the European directive on restrictions on hazardous substances (RoHS) 2002/95/EU.
  3. JEDEC Std JESD22-A114A (C1=100pF, R1=1500 ohms, R2=500 ohms).
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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