Part: VL53L8CX — STMicroelectronics

Type: Time-of-Flight (ToF) sensor

Description: 8x8 multizone Time-of-Flight (ToF) ranging sensor providing accurate ranging up to 400 cm with a 65° diagonal FoV, enhanced performance under ambient light, and reduced power consumption.

Operating Conditions:

• Supply voltage: AVDD: 3.3 V, CORE_1V8: 1.8 V, IOVDD: 1.2 V or 1.8 V
• Operating temperature: -30 to 85°C
• Ranging distance: 2 to 400 cm per zone
• Max frame rate: 60 Hz

Key Specs:

• Ranging resolution: 4x4 or 8x8 zones
• Diagonal Field of View (FoV): 65° (detection volume)
• Emitter wavelength: 940 nm (invisible VCSEL)
• I²C interface speed: Up to 1 MHz
• SPI interface speed: Up to 3 MHz
• Module dimensions: 6.4 x 3.0 x 1.75 mm
• Cover glass crosstalk immunity: Above 60 cm

Features:

• Multizone distance measurement capability with either 4x4 or 8x8 separate zones
• Autonomous low-power mode with interrupt programmable threshold
• Ranging up to 400 cm, with enhanced performance under ambient light
• Multitarget detection and distance measurement in each zone
• Histogram processing and algorithmic compensation to minimize or remove cover glass crosstalk
• Motion indicator for each zone
• Fully integrated miniature module with wide field of view (FoV)
• New generation, high-power 940 nm invisible light VCSEL emitter
• 65° diagonal square FoV using DOEs
• Receiving array of SPADS (single photon avalanche diodes)
• Low-power microcontroller running firmware
• Single reflowable component
• I²C (up to 1 MHz) or SPI (up to 3 MHz) interface
• Compatible with wide range of cover glass materials
• Can be hidden behind a dark cover glass

Applications:

• Robotic applications including SLAM, wall tracking, small object detection, cliff prediction, and floor type recognition
• System activation under ambient light for smart buildings and smart lighting (e.g., user detection)
• Content management for tanks, loads in trucks, and waste bins
• Liquid level monitoring
• Gesture recognition
• Keystone correction for video projectors
• Devices requiring better ambient light immunity
• Augmented reality/Virtual reality enhancement
• IoT and battery powered devices for user and object detection
• LAF (laser assisted autofocus)

Package:

• Optical LGA16 (6.4 x 3.0 x 1.75 mm)

• New generation, multizone Time-of-Flight (ToF) sensor with low-power and enhanced distance ranging performance
• -Multizone distance measurement capability with either 4x4 or 8x8 separate zones
• -Autonomous low-power mode with interrupt programmable threshold to wake up the host
• -Ranging up to 400 cm, with enhanced performance under ambient light
• -Multitarget detection and distance measurement in each zone
• -Histogram processing and algorithmic compensation to minimize or remove the impact of cover glass crosstalk
• -Motion indicator for each zone to show if targets have moved and how they have moved
• -Frame rate capability of 60 Hz
• Fully integrated miniature module with wide field of view (FoV)
• -New generation, high-power emitter: 940 nm invisible light VCSEL (vertical-cavity surface-emitting laser) and integrated analog driver
• -65° diagonal square FoV using DOEs (diffractive optical elements) on both transmitter and receiver
• -Receiving array of SPADS (single photon avalanche diodes)
• -Low-power microcontroller running firmware
• -Size: 6.4 x 3.0 x 1.75 mm
• Easy integration
• -Single reflowable component
• -Requires 1.8 V core supply and 3.3 V AVDD supply
• -Optional 1.2 V or 1.8 V IOVDD interface voltage levels
• -I²C (up to 1 MHz) or SPI (up to 3 MHz) interface
• -Compatible with wide range of cover glass materials
• -Can be hidden behind a dark cover glass

• Robotic applications in difficult environments including SLAM, wall tracking, small object detection, cliff prediction, and floor type recognition
• System activation under ambient light for smart buildings and smart lighting. For example: user detection to wake up devices
• Content management for tanks, loads in trucks, and waste bins
• Liquid level monitoring
• Gesture recognition
• Keystone correction for video projectors
• Devices requiring better ambient light immunity
• Augmented reality/Virtual reality enhancement. Dual camera stereoscopy and 3D depth assistance thanks to multizone distance measurements
• IoT and battery powered devices for user and object detection
• LAF (laser assisted autofocus), which enhances the camera AF system speed and robustness, especially in difficult low light or low contrast scenes.

VL53L8CX Pinout – Optical LGA16

Notes

• All digital signals must be driven to IOVDD level.
• Pin designations follow a grid layout (A1–A7, B1/B4/B7, C1–C7) as shown in the bottom-view diagram.
• NCS pin function differs by protocol: I²C reset (active high) vs. SPI chip select (active low).
• SDA/MOSI and SCL/MCLK pins are protocol-dependent; configure via SPI_I2C_N pin selection.
• THERMALPAD (B4) must be connected to ground plane per application note AN5897.

Table 9. Absolute maximum ratings

Note:

Table 10. Recommended operating conditions

Note:

All three supplies are independent.

Note:

When IOVDD is 1.8 V, it is recommended to use the same supply as CORE_1V8.

Figure 5. Typical application schematic for I²C shows the application schematic of the VL53L8CX in I²C protocol configuration.

Figure 5. Typical application schematic for I²C

Note:

Capacitors on the external supplies (AVDD, CORE_1V8, and IOVDD) should be placed as close as possible to the module pins.

Note:

IOVDD must be set to ensure the host and the VL53L8CX operate at the same voltage levels for direct interfacing.

Figure 6. Typical application schematic for SPI shows the application schematic of the VL53L8CX in SPI protocol configuration.

Figure 6. Typical application schematic for SPI

Note:

Capacitors on the external supplies (AVDD, CORE_1V8, and IOVDD) should be placed as close as possible to the module pins.

Note:

IOVDD must be set to ensure the host and the VL53L8CX operate at the same voltage levels for direct interfacing.

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.