TPS7A0230PDQNR.A
1 Features
Manufacturer
Texas Instruments
Overview
Part: TPS7A02 from Texas Instruments
Type: Low-Dropout Voltage Regulator
Key Specs:
- Quiescent Current (IQ): 25 nA (typ)
- Shutdown Quiescent Current (IQ): 3 nA (typ)
- Output Current: 200 mA
- Input Voltage Range: 1.5 V to 6.0 V
- Output Voltage Range: 0.8 V to 5.0 V (fixed)
- Output Accuracy: 1.5% over temperature
- Dropout Voltage: 270 mV (max) at 200 mA (VOUT = 3.3 V)
- Operating Temperature Range: –40°C to +125°C
Features:
- Ultra-low IQ, even in dropout
- Excellent transient response (< 10-μs settling time, 100-mV undershoot)
- Smart enable pulldown
- Stable with a 1-μF or larger capacitor
- Output voltage available in 50-mV steps
Applications:
- Wearables electronics
- Thermostats
- Smoke and heat detectors
- Gas, heat, and water meters
- Blood glucose monitors
- Pulse oximeters
- Residential circuit breakers
- Fault indicators
- Building security
- Video surveillance devices
- EPOS card readers
Package:
- X2SON (DQN): 1.00 mm × 1.00 mm
- SOT23-5 (DBV): 2.90 mm × 1.60 mm
- DSBGA (YCH): 0.64 mm × 0.64 mm
Features
- Ultra-low IQ: 25 nA (typ), even in dropout
- Shutdown IQ: 3 nA (typ)
- Excellent transient response (1 mA to 50 mA)
- < 10-μs settling time
- 100-mV undershoot
- Packages:
- 1.0-mm × 1.0-mm X2SON
- SOT23-5
- 0.64-mm × 0.64-mm DSBGA
- Input voltage range: 1.5 V to 6.0 V
- Output voltage range: 0.8 V to 5.0 V (fixed)
- Output accuracy: 1.5% over temperature
- Smart enable pulldown
- Very low dropout:
- 270 mV (max) at 200 mA (VOUT = 3.3 V)
- Stable with a 1-μF or larger capacitor
Applications
Pin Configuration
Figure 5-1. DQN Package, 1-mm × 1-mm, 4-Pin X2SON (Top View)
| NAME | PIN | I/O(1) | DESCRIPTION |
|---|---|---|---|
| DQN | DBV | ||
| EN | 3 | 3 | Input |
| GND | 2 | 2 | — |
| IN | 4 | 1 | Input |
| NC | — | 4 | — |
| OUT | 1 | 5 | Output |
| Thermal pad | — | — | — |
Table 5-1. Pin Functions: DQN, DBV
(1) NC = No internal connection.
Figure 5-3. YCH Package, 4-Pin DSBGA, 0.35-mm Pitch (Top View)
B
A
Figure 5-4. YCH Package, 4-Pin DSBGA, 0.35-mm Pitch (Bottom View)
Table 5-2. Pin Functions: YCH
| YCH | NAME | I/O |
|---|---|---|
| A1 | IN | Input |
| A2 | OUT | Output |
| B1 | EN | Input |
| B2 | GND | — |
Electrical Characteristics
Specified at TJ = –40°C to +125°C, VIN = VOUT(nom) + 0.5 V or 2.0 V (whichever is greater), IOUT = 1 mA, VEN = VIN, and CIN = COUT = 1 μF (unless otherwise noted). Typical values are at TJ = 25°C.
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| = 25°C, VOUT ≥ 1.5 V, 1 μA(3) ≤ IOUT ≤ 1 mA TJ TJ = 25°C; VOUT < 1.5 V | –1 | 1 | % | ||||
| Nominal accuracy | –15 | 15 | mV | ||||
| Accuracy over | VOUT ≥ 1.5 V | –1.5 | 1.5 | % | |||
| temperature | VOUT < 1.5 V | TJ = –40°C to +125°C | –20 | 20 | mV | ||
| ΔVOUT(ΔVIN) | Line regulation | VOUT(nom) + 0.5 V ≤ VIN ≤ 6.0 V(1) | TJ = –40°C to +125°C | 5 | mV | ||
| 1 mA ≤ IOUT ≤ 200 mA, | TJ = –40°C to +85°C | 20 | 38 | ||||
| ΔVOUT(ΔIOUT) | Load regulation(2) | VIN = VOUT(nom) + 0.5 V(1) | TJ = –40°C to +125°C TJ = 25°C | 25 | 50 46 | mV | |
| IGND | Ground current | IOUT = 0 mA 5 μA ≤ IOUT < 1 mA | TJ = –40°C to +85°C | 1 | 60 | nA | |
| IGND/IOUT | Ground current vs load current | 1 mA ≤ IOUT < 100 mA IOUT ≥ 100 mA | TJ = 25°C | 0.25 0.15 | % | ||
| IGND(DO) | Ground current in dropout(3) | IOUT = 0 mA, VIN = 95% x VOUT (NOM) | TJ = 25°C | 25 | nA | ||
| ISHDN | Shutdown current | VEN = 0 V, 1.5 V ≤ VIN ≤ 5.0 V, TJ = 25°C | 3 | 10 | nA | ||
| ICL | Output current limit | VOUT = 90% × VOUT(nom) | VOUT < 2.5V, VIN = VOUT(nom) + VDO(max) + 1.0 V | 240 | 450 | 750 | mA |
| VOUT ≥ 2.5V, VIN = VOUT(nom) + VDO(max) + 0.5 V | 240 | 450 | 750 | mA | |||
| ISC | Short-circuit current limit Dropout voltage(4) | VOUT = 0 V TJ = –40°C to +85°C | 0.8 V ≤ VOUT < 1.0 V 1.0 V ≤ VOUT < 1.2 V 1.2 V ≤ VOUT < 1.5 V 1.5 V ≤ VOUT < 1.8 V 1.8 V ≤ VOUT < 2.5 V 2.5 V ≤ VOUT < 3.3 V 3.3 V ≤ VOUT ≤ 5.0 V | 65 | 1050 790 650 490 400 310 270 | mA | |
| VDO | TJ = –40°C to +125°C | 0.8 V ≤ VOUT < 1.0 V 1.0 V ≤ VOUT < 1.2 V 1.2 V ≤ VOUT < 1.5 V 1.5 V ≤ VOUT < 1.8 V 1.8 V ≤ VOUT < 2.5 V 2.5 V ≤ VOUT < 3.3 V 3.3 V ≤ VOUT ≤ 5.0 V | 1100 850 700 560 450 360 310 | mV | |||
| PSRR | Power-supply rejection ratio | f = 1 kHz, IOUT = 30 mA | 55 | dB | |||
| VN | Output voltage noise | BW = 10 Hz to 100 kHz, VOUT = 0.8 V, IOUT = 30 mA | 130 | μVRMS | |||
| VIN rising VIN falling | 1.23 | 1.3 | 1.47 | ||||
| VUVLO | UVLO threshold | 1.0 | 1.12 | 1.41 | V | ||
| VUVLO(HYST) | UVLO hysteresis | VIN hysteresis | 180 | mV |
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Voltage | VIN | –0.3 | 6.5 | V |
| VEN | –0.3 | 6.5 | ||
| VOUT | –0.3 | VIN + 0.3 or 5.5(2) | ||
| Current | Maximum output | Internally limited | A | |
| Temperature | Operating junction, TJ | –40 | 150 | |
| Storage, Tstg | –65 | 150 | °C |
(2) Maximum is VIN + 0.3 V or 5.5 V, whichever is smaller.
Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted)
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VIN | Input voltage | 1.5 | 6.0 | V | |
| VEN | Enable voltage | 0 | 6.0 | V | |
| VOUT | Output voltage | 0.8 | 5.0 | V | |
| IOUT | Output current | 0 | 200 | mA | |
| CIN | Input capacitor | 1 | μF | ||
| COUT | Output capacitor(1) (2) | 1 | 1 | 22 | μF |
| FEN | EN toggle frequency | 10 | kHz | ||
| TJ | Operating junction temperature | –40 | 125 | °C |
(1) Effective output capacitance of 0.5 μF minimum required for stability.
(2) 22 μF is the maximum derated capacitance that can be used for stability.
6.4 Thermal Information
| THERMAL METRIC(1) | TPS7A02 | |
|---|---|---|
| DQN (X2SON) | ||
| 4 PINS | ||
| RθJA | Junction-to-ambient thermal resistance | 179.1 |
| RθJC(top) | Junction-to-case(top) thermal resistance | 137.6 |
| RθJB | Junction-to-board thermal resistance | 116.3 |
| ψJT | Junction-to-top characterization parameter | 6.1 |
| ψJB | Junction-to-board characterization parameter | 116.3 |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | 112.3 |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.5 Electrical Characteristics
Specified at TJ = –40°C to +125°C, VIN = VOUT(nom) + 0.5 V or 2.0 V (whichever is greater), IOUT = 1 mA, VEN = VIN, and CIN = COUT = 1 μF (unless otherwise noted). Typical values are at TJ = 25°C.
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| = 25°C, VOUT ≥ 1.5 V, 1 μA(3) ≤ IOUT ≤ 1 mA TJ TJ = 25°C; VOUT < 1.5 V | –1 | 1 | % | ||||
| Nominal accuracy | –15 | 15 | mV | ||||
| Accuracy over | VOUT ≥ 1.5 V | –1.5 | 1.5 | % | |||
| temperature | VOUT < 1.5 V | TJ = –40°C to +125°C | –20 | 20 | mV | ||
| ΔVOUT(ΔVIN) | Line regulation | VOUT(nom) + 0.5 V ≤ VIN ≤ 6.0 V(1) | TJ = –40°C to +125°C | 5 | mV | ||
| 1 mA ≤ IOUT ≤ 200 mA, | TJ = –40°C to +85°C | 20 | 38 | ||||
| ΔVOUT(ΔIOUT) | Load regulation(2) | VIN = VOUT(nom) + 0.5 V(1) | TJ = –40°C to +125°C TJ = 25°C | 25 | 50 46 | mV | |
| IGND | Ground current | IOUT = 0 mA 5 μA ≤ IOUT < 1 mA | TJ = –40°C to +85°C | 1 | 60 | nA | |
| IGND/IOUT | Ground current vs load current | 1 mA ≤ IOUT < 100 mA IOUT ≥ 100 mA | TJ = 25°C | 0.25 0.15 | % | ||
| IGND(DO) | Ground current in dropout(3) | IOUT = 0 mA, VIN = 95% x VOUT (NOM) | TJ = 25°C | 25 | nA | ||
| ISHDN | Shutdown current | VEN = 0 V, 1.5 V ≤ VIN ≤ 5.0 V, TJ = 25°C | 3 | 10 | nA | ||
| ICL | Output current limit | VOUT = 90% × VOUT(nom) | VOUT < 2.5V, VIN = VOUT(nom) + VDO(max) + 1.0 V | 240 | 450 | 750 | mA |
| VOUT ≥ 2.5V, VIN = VOUT(nom) + VDO(max) + 0.5 V | 240 | 450 | 750 | mA | |||
| ISC | Short-circuit current limit Dropout voltage(4) | VOUT = 0 V TJ = –40°C to +85°C | 0.8 V ≤ VOUT < 1.0 V 1.0 V ≤ VOUT < 1.2 V 1.2 V ≤ VOUT < 1.5 V 1.5 V ≤ VOUT < 1.8 V 1.8 V ≤ VOUT < 2.5 V 2.5 V ≤ VOUT < 3.3 V 3.3 V ≤ VOUT ≤ 5.0 V | 65 | 1050 790 650 490 400 310 270 | mA | |
| VDO | TJ = –40°C to +125°C | 0.8 V ≤ VOUT < 1.0 V 1.0 V ≤ VOUT < 1.2 V 1.2 V ≤ VOUT < 1.5 V 1.5 V ≤ VOUT < 1.8 V 1.8 V ≤ VOUT < 2.5 V 2.5 V ≤ VOUT < 3.3 V 3.3 V ≤ VOUT ≤ 5.0 V | 1100 850 700 560 450 360 310 | mV | |||
| PSRR | Power-supply rejection ratio | f = 1 kHz, IOUT = 30 mA | 55 | dB | |||
| VN | Output voltage noise | BW = 10 Hz to 100 kHz, VOUT = 0.8 V, IOUT = 30 mA | 130 | μVRMS | |||
| VIN rising VIN falling | 1.23 | 1.3 | 1.47 | ||||
| VUVLO | UVLO threshold | 1.0 | 1.12 | 1.41 | V | ||
| VUVLO(HYST) | UVLO hysteresis | VIN hysteresis | 180 | mV |
6.5 Electrical Characteristics (continued)
Specified at TJ = –40°C to +125°C, VIN = VOUT(nom) + 0.5 V or 2.0 V (whichever is greater), IOUT = 1 mA, VEN = VIN, and CIN = COUT = 1 μF (unless otherwise noted). Typical values are at TJ = 25°C.
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| VEN(HI) | EN pin logic high voltage | 1.1 | V | |||
| VEN(LOW) | EN pin logic low voltage | 0.3 | V | |||
| IEN | EN pin leakage current | VEN = VIN = 6.0 V | 10 | nA | ||
| REN(PULLDOWN) | Smart enable pulldown resistor | VEN = 0.3 V | 500 | KΩ | ||
| RPULLDOWN | Pulldown resistor | VIN = 3.3 V, device disabled | 60 | Ω | ||
| TSD(shutdown) | Thermal shutdown temperature | Shutdown, temperature increasing | 170 | °C | ||
| TSD(reset) | Thermal shutdown reset temperature | Reset, temperature decreasing | 145 | °C |
(1) VIN = 2.0 V for VOUT ≤ 1.5 V.
(2) Load Regulation is normalized to the output voltage at IOUT = 1 mA.
(3) Specified by design
(4) Dropout is measured by ramping VIN down until VOUT = VOUT (nom) x 95%, with IOUT = 200 mA.
Thermal Information
| THERMAL METRIC(1) | TPS7A02 | |
|---|---|---|
| DQN (X2SON) | ||
| 4 PINS | ||
| RθJA | Junction-to-ambient thermal resistance | 179.1 |
| RθJC(top) | Junction-to-case(top) thermal resistance | 137.6 |
| RθJB | Junction-to-board thermal resistance | 116.3 |
| ψJT | Junction-to-top characterization parameter | 6.1 |
| ψJB | Junction-to-board characterization parameter | 116.3 |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | 112.3 |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| TPS7A0230DBVR | Texas Instruments | — |
| TPS7A0230PDBVR | Texas Instruments | — |
| TPS7A0230PDBVR.A | Texas Instruments | — |
| TPS7A0230PDQNR | Texas Instruments | — |
| TPS7A0230PYCHR | Texas Instruments | — |
| TPS7A0230PYCHR.A | Texas Instruments | — |
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