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TMC2226-SA

The TMC2226-SA is an electronic component from Analog Devices Inc./Maxim Integrated. View the full TMC2226-SA datasheet below including key specifications, pinout, absolute maximum ratings.

Manufacturer

Analog Devices Inc./Maxim Integrated

Category

Integrated Circuits (ICs)

Package

28-TSSOP (0.173", 4.40mm Width) Exposed Pad

Lifecycle

Active

Key Specifications

ParameterValue
ApplicationsGeneral Purpose
Output Current2A
FunctionDriver - Fully Integrated, Control and Power Stage
InterfaceStep/Direction, UART
Mounting TypeSurface Mount
Package / Case28-TSSOP (0.173", 4.40mm Width) Exposed Pad
PackagingTray
Standard Pack Qty308
Step Resolution1 ~ 1/256
Supplier Device Package28-HTSSOP
Supplier Device Package28-HTSSOP
Load Voltage5V ~ 29V
Supply Voltage5V ~ 28V

Overview

Part: TMC2209 from TRINAMIC

Type: Ultra-silent Motor Driver IC for Two-Phase Bipolar Stepper Motors

Description: The TMC2209 is an ultra-silent motor driver IC for two-phase stepper motors, supporting up to 2A RMS coil current, 4.75–29V DC input, and featuring StealthChop2 for quiet operation, StallGuard4 for sensorless stall detection, and a UART interface.

Operating Conditions:

  • Supply voltage: 4.75–29V DC
  • Operating temperature: null
  • Max coil current: 2A RMS (2.8A peak)
  • Microstep resolution: Fullstep up to 1/256 step (via MicroPlyer interpolation)

Absolute Maximum Ratings:

  • Max supply voltage: null
  • Max continuous current: null
  • Max junction/storage temperature: null

Key Specs:

  • Coil current: 2A RMS (2.8A peak)
  • Voltage Range: 4.75… 29V DC
  • RDSon (typ. at 25°C): LS 170mΩ & HS 170mΩ
  • Microstep interpolation: 256 microsteps by MicroPlyer™
  • UART Baud rates: 9600 Baud to 500k Baud
  • Energy savings: up to 75% with CoolStep™
  • STEP/DIR Interface microstep setting: 8, 16, 32 or 64 microstep

Features:

  • StealthChop2™ silent motor operation
  • SpreadCycle™ highly dynamic motor control chopper
  • StallGuard4™ load and stall detection
  • CoolStep™ current control for energy savings
  • MicroPlyer™ microstep interpolator for 256 microstep smoothness
  • Internal Sense Resistor option
  • Single Wire UART & OTP for advanced configuration options
  • Integrated Pulse Generator for standalone motion
  • Full Protection & Diagnostics

Applications:

  • 3D Printers
  • Printers, POS
  • Office and home automation
  • Textile, Sewing Machines
  • CCTV, Security
  • ATM, Cash recycler
  • HVAC
  • Battery Operated Equipment

Package:

  • QFN28 (5 x 5 mm)

Features

2-phase stepper motors up to 2.8A coil current (peak), 2A RMS STEP/DIR Interface with 8, 16, 32 or 64 microstep pin setting

Smooth Running 256 microsteps by MicroPlyer ™ interpolation

StealthChop2™ silent motor operation

S preadCycle™ highly dynamic motor control chopper

StallGuard4 ™ load and stall detection for StealthChop

CoolStep ™ current control for energy savings up to 75%

Low RDSon, Low Heat-Up LS 170mΩ & HS 170mΩ (typ. at 25°C) Voltage Range 4.75… 29V DC

Low Power Standby to fit standby energy regulations

Internal Sense Resistor option (no sense resistors required)

Passive Braking , Freewheeling, and automatic power down

Single Wire UART & OTP for advanced configuration options

Integrated Pulse Generator for standalone motion

Full Protection & Diagnostics

Compact QFN package with large heat slug

Applications

Compatible Design Upgrade 3D Printers Printers, POS Office and home automation Textile, Sewing Machines CCTV, Security ATM, Cash recycler HVAC Battery Operated Equipment

Pin Configuration

I cannot extract a pinout for the TMC2226-SA from the provided datasheet section.

Issue: The datasheet excerpt provided is for the TMC2209 (QFN package), not the TMC2226-SA (28-TSSOP package). These are different parts in the Trinamic stepper driver family.

What is needed:

  • A datasheet section that specifically covers the TMC2226-SA pinout
  • Either a pin assignment table with pin numbers and names, or a pin diagram image showing the 28-TSSOP package pinout

Recommendation: Please provide the correct datasheet section for the TMC2226-SA, which should include its pin assignment table or package diagram for the 28-TSSOP variant.

Absolute Maximum Ratings

The maximum ratings may not be exceeded under any circumstances. Operating the circuit at or near more than one maximum rating at a time for extended periods shall be avoided by application design.

ParameterSymbolMinMaxUnit
Supply voltage operating with inductive loadV VS-0.532V
Supply and bridge voltage max. *)V VMAX33V
I/O supply voltageV VIO-0.55.5V
5VOUT supply voltage (when using external supply)V 5VOUT-0.55.5V
Logic input voltageV I-0.5V VIO +0.5V
VREF input voltage (Do not exceed both, VCC_IO and 5VOUT by more than 10%, as this enables a test mode)V VREF-0.56V
Maximum current to / from digital pins and analog low voltage I/OsI IO+/-10mA
5V regulator output current (internal plus external load)I 5VOUT25mA
5V regulator continuous power dissipation (V VM -5V) * I 5VOUTP 5VOUT0.5W
Power bridge repetitive output currentI Ox3A
Junction temperatureT J-50150°C
Storage temperatureT STG-55150°C
ESD-Protection for interface pins in application (Human body model, HBM)V ESDAP4kV
ESD-Protection for handling (Human body model, HBM)V ESD2kV
ESD-Protection for handling (charged device model, CDM)V ESD500V

Thermal Information

The following table shall give an idea on the thermal resistance of the package. The thermal resistance for a four-layer board will provide a good idea on a typical application. Actual thermal characteristics will depend on the PCB layout, PCB type and PCB size. The thermal resistance will benefit from thicker CU (inner) layers for spreading heat horizontally within the PCB. Also, air flow will reduce thermal resistance.

A thermal resistance of 30K/W for a typical board means, that the package is capable of continuously dissipating 3.3W at an ambient temperature of 25°C with the die temperature staying below 125°C. Note, that a thermally optimized layout is required.

Table 20.1 Thermal characteristics TMC2209

ParameterSymbolConditionsTypUnit
Typical power dissipationP DStealthChop or SpreadCycle, 1.4A RMS in two phase motor, sinewave, 40 or 20kHz chopper, 24V, 90°C peak surface of package (motor QSH4218-035-10- 027, short time operation)2.8W
Typical power dissipationP DStealthChop or SpreadCycle, 1.0A RMS in two phase motor, sinewave, 40 or 20kHz chopper, 24V, 70°C peak surface of package (motor QSH4218-035-10- 027)1.4W
Thermal resistance junction to ambient on a multilayer board QFN28R TMJADual signal and two internal power plane board (2s2p) as defined in JEDEC EIA JESD51-5 and JESD51-7 (FR4, 35μm CU, 70mm x 133mm, d=1.5mm)30K/W
Thermal resistance junction to caseR TJCJunction to heat slug of package6K/W

Note

A spreadsheet for calculating TMC2209 power dissipation is available on www.trinamic.com.

Typical Application

Figure 3.1 Standard application circuit

The standard application circuit uses two sense resistors to set the motor coil current. See chapter 8 to choose the right sense resistors. Use low ESR capacitors for filtering the power supply. The capacitors need to cope with the current ripple cause by chopper operation. A minimum capacity of 100μF near the driver is recommended for best performance. Current ripple in the supply capacitors also depends on the power supply internal resistance and cable length. VCC_IO can be supplied from 5VOUT, or from an external source, e.g., a 3.3V regulator.

Package Information

Figure 2.1 TMC2209 Pinning Top View -type: QFN28, 5x5mm², 0.5mm pitch

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
TMC2209Trinamic/ADI
TMC2209-BOBAnalog Devices / Maxim Integrated
TMC2209-EVALAnalog Devices / Maxim Integrated
TMC2209-EVAL-KITAnalog Devices / Maxim Integrated
TMC2209-LAAnalog Devices / Maxim Integrated28-VFQFN Exposed Pad
TMC2209-LA-TAnalog Devices Inc./Maxim Integrated28-VFQFN Exposed Pad
TMC22099Trinamic/ADI
TMC22XXTrinamic/ADI
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