TLV1117LV33DCYR

Part: TLV1117 Type: Linear Voltage Regulator

Key Specs:

• Input voltage range: 2.7V to 15V
• Output current: 800mA
• Fixed Output voltage range: 1.5V to 5V
• Adjustable Output voltage range: 1.25V to 13.8V
• Output accuracy (Fixed, new chip): ±1.0% at TJ = 25°C
• Output accuracy (Adjustable): ±1.0% at TJ = 25°C
• Quiescent current (Fixed, new chip): 60µA (typical)
• Quiescent current (Adjustable): 5mA (typical)

Features:

• Adjustable and Fixed output options
• Internal soft-start (Fixed version, new chip)
• Foldback current limit (Fixed version, new chip)
• No minimum load current requirement (Fixed version, new chip)
• Minimum 1.7mA (typical) load current for stable operation (Adjustable version)
• Requires minimum 10µF tantalum capacitor at output for stability (Adjustable version)

Applications:

• Appliances
• Home theater and entertainment
• Motor drives
• HVAC and building security systems
• Smart meters

Package:

• DCY (SOT-223, 4): 6.5mm × 7mm
• KVU (TO-252, 3): 6.6mm × 10.11mm
• NDP (TO-252, 3): 6.58mm × 9.92mm
• DRJ (WSON, 8): 4mm × 4mm
• KCS (TO-220, 3): 10.16mm × 28.65mm
• KCT (TO-220, 3): 10.16mm × 28.65mm
• KTT (DDPAK/TO-263, 3): 10.18mm × 15.24mm

Input voltage range V_IN: 2.7V to 15V

Output voltage options:

Fixed: 1.5V to 5V

Adjustable: 1.25V to 13.8V

Output current: 800mA

Output accuracy (new chip):

• Fixed: $\pm 1.0%$ at $T_{.I} = 25^{\circ}C$

Adjustable: ±1.0% at T_J = 25°C

Quiescent current (I_O):

• Fixed: 60µA (typical, approximately 1.5µA in shutdown) (new chip)

Adjustable: 5mA (typical)

· Packages:

– New chip:

4-pin SOT-223 (DCY), R_θJA = 95.4°C/W

3-pin, TO-252 (KVU), R_θJA = 67.2°C/W

Legacy chip:

3-pin, TO-263 (KTT), $R_{\theta JA} = 27.5^{\circ}C/W$

3-pin, TO-220 (KCT, KCS), $R_{\theta JA} = 30.1^{\circ}C/W$

8-pin, WSON (DRJ), R_0.JA = 38.3°C/W

Appliances

Home theater and entertainment

Motor drives

HVAC and building security systems

Smart meters

Simplified Application Schematic for the Adjustable Regulator

Figure 4-1. DCY Package, 4-Pin SOT (Top View)

Figure 4-2. KCT and KCS Package, 3-Pin TO-220 (Top View)

Figure 4-3. KTT Package, 3-Pin TO-263 (Top View)

Figure 4-4. KVU Package, 3-Pin TO-252 (Top View)

Figure 4-5. DRJ Package, 8-Pin WSON (Top View)

Table 4-1. Pin Functions

| | PIN | |---------------|-----|-----|-----|---------|-----|------|-------------------------------------------------------------------------------------------------------|--|--|--| | NAME | KTT | KVU | DCY | DRJ | KCT | TYPE | DESCRIPTION | | ADJ/GND | 1 | 1 | 1 | 1 | 1 | I/O | Adjust pin for adjustable output option. Ground pin for fixed output option. | | INPUT (VIN) | 3 | 3 | 3 | 2, 3, 4 | 3 | I | Input voltage pin for the regulator. For the DRJ package, connect the VIN and
VOUT pins together. | | OUTPUT (VOUT) | 2 | 2 | 2 | 5, 6, 7 | 2 | O | Output voltage pin for the regulator. For the DRJ package, connect the VIN
and VOUT pins together. | | NC | — | — | — | 8 | — | — | No connect. |

TJ = –40°C to 125°C for I version, T^J = 0°C to 125°C for C version, and all typical values are at T^J = 25°C (unless otherwise noted)

PARAMETER (1)		TEST CONDITIONS(10)		MIN (4)	TYP (5)	MAX (4)	UNIT
		VIN – VOUT = 2V, IOUT = 10mA, TJ = 25℃	TLV1117C/I	1.238		1.25 1.262
VREF	Reference voltage		TLV1117C	1.225	1.25	1.27	V
		VIN – VOUT = 1.4V to 10V, IOUT = 10mA to 800mA	TLV1117I	1.2	1.25	1.29
		VIN = 3.5V, IOUT = 10mA, TJ = 25°C	TLV1117C/I-15	1.485		1.5 1.515
			TLV1117C-15	1.455		1.5 1.545
		VIN = 2.9V to 10V, IOUT = 0mA to 800mA	TLV1117I-15	1.44	1.5	1.56
		VIN = 3.8V, IOUT = 10mA, TJ = 25°C	TLV1117C/I-18	1.782		1.8 1.818
			TLV1117C-18	1.746		1.8 1.854
		VIN = 3.2V to 10V, IOUT = 0mA to 800mA	TLV1117I-18	1.728		1.8 1.872
		VIN = 4.5V, IOUT = 10mA, TJ = 25°C	TLV1117C/I-25	2.475		2.5 2.525
VOUT	Output voltage		TLV1117C-25	2.450		2.5 2.550	V
		VIN = 3.9V to 10V, IOUT = 0mA to 800mA	TLV1117I-25	2.4	2.5	2.6
		VIN = 5V, IOUT = 10mA, TJ = 25°C	TLV1117C/I-33	3.267		3.3 3.333
			TLV1117C-33	3.235		3.3 3.365
		VIN = 4.75V to 10V, IOUT = 0mA to 800mA	TLV1117I-33	3.168		3.3 3.432
		VIN = 7V, IOUT = 10mA, TJ = 25°C	TLV1117C/I-50	4.950		5.0 5.050
			TLV1117C-50	4.900	5.0	5.1
		VIN = 6.5V to 12V, IOUT = 0mA to 800mA	TLV1117I-50	4.80	5.0	5.20
		IOUT = 10mA, VIN – VOUT = 1.5V to 13.75V	TLV1117C		0.035	0.2	%
			TLV1117I		0.035	0.3
		IOUT = 0mA, VIN = 2.9V to 10V	TLV1117C-15		1	6	mV
			TLV1117I-15		1	10
	Line regulation	IOUT = 0mA, VIN = 3.2V to 10V	TLV1117C-18		1	6
ΔVOUT(ΔVIN)			TLV1117I-18		1	10
		IOUT = 0mA, VIN = 3.9V to 10V	TLV1117C-25		1	6
			TLV1117I-25		1	10	mV
		IOUT = 0mA, VIN = 4.75V to 15V	TLV1117C-33		1	6
			TLV1117I-33		1	10
		IOUT = 0mA, VIN = 6.5V to 15V	TLV1117C-50		1	10
			TLV1117I-50		1	15
			TLV1117C-15		1	10
		IOUT = 0mA to 800mA, VIN = 2.9V	TLV1117I-15		1	15
			TLV1117C-18		1	10
		IOUT = 0mA to 800mA, VIN = 3.2V	TLV1117I-18		1	15
			TLV1117C-25		1	10
		IOUT = 0mA to 800mA, VIN = 3.9V	TLV1117I-25		1	15	mV
	Load regulation(6)		TLV1117C-33		1	10
ΔVOUT(ΔIOUT)		IOUT = 0mA to 800mA, VIN = 4.75V	TLV1117I-33		1	15
			TLV1117C-50		1	15
		IOUT = 0mA to 800mA, VIN = 6.5V	TLV1117I-50		1	20
		VIN – VOUT = 3V, 10mA ≤ IOUT ≤ 800mA, TJ = 25℃	TLV1117C/I		0.2
			TLV1117C			0.4	%
		VIN – VOUT = 3V, 10mA ≤ IOUT ≤ 800mA	TLV1117I			0.5
	Load regulation (new chip, fixed output)	0mA ≤ IOUT ≤ 800mA	TLV1117C/I			0.5	%/A

over operating free-air temperature range (unless otherwise noted)(1)

		MIN	MAX	UNIT
(2) VIN	Continuous input voltage	–0.3	16	V
VOUT (3)	Output voltage (new chip, fixed version only)	–0.3	VIN + 0.3	V
Power	Power dissipation	Package limited (4)		W
	Operating junction (Tj )	–50	150
Temperature	Storage (Tstg)	–65	150	°C

⁽¹⁾ Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

over operating free-air temperature range (unless otherwise noted)

| | | | MIN | NOM
MAX | UNIT | |--------------|-----------------------------------------------|------------|-----|------------|------|--| | | | TLV1117 | 2.7 | 15 | | VIN | | TLV1117-15 | 2.9 | 15 | | | Input voltage | TLV1117-18 | 3.2 | 15 | V | | | | TLV1117-25 | 3.9 | 15 | | | | TLV1117-33 | 4.7 | 15 | | | | TLV1117-50 | 6.4 | 15 | | IOUT | Output current | | | 0.8 | A | | COUT ESR (1) | Output capacitor ESR (new chip, fixed output) | | 2 | 500 | mΩ | | (2)
TJ | | TLV1117C | 0 | 125 | °C | | | Junction temperature | TLV1117I | –40 | 125 | ⁽¹⁾ Maximum supported ESR range for new chip, fixed output is 0.5Ω. For output capacitor with higher ESR values, place a low ESR MLCC capacitor.

⁽²⁾ The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–TA) / RθJA. All numbers apply for packages soldered directly into a PCB.

| | | | | | Legacy chip (2) | |---------------------------|--------------------------------------------------------------------------------|--------------------|--------------------|--------|-----------------|--------|----------|--------|------| | | THERMAL METRIC ⁽¹⁾ | KTE
(PowerFlex) | KTP
(PowerFlex) | DRJ | DCY | KVU | кcѕ, кcт | ктт | UNIT | | | | 3 PINS | 3 PINS | 8 PINS | 4 PINS | 3 PINS | 3 PINS | 3 PINS | | $R_{\theta JA}$ | Junction-to-ambient thermal resistance | 38.6 | 49.2 | 38.3 | 104.3 | 50.9 | 30.1 | 27.5 | °C/W | | R _θ
JC(top) | Junction-to-case (top) thermal resistance | 34.7 | 60.6 | 36.5 | 53.7 | 57.9 | 44.6 | 43.2 | °C/W | | $R_{\theta JB}$ | Junction-to-board thermal resistance | 3.2 | 3.1 | 60.5 | 5.7 | 34.8 | 1.2 | 17.3 | °C/W | | $\Psi_{JT}$ | Junction-to-top characterization parameter | 5.9 | 8.7 | 0.2 | 3.1 | 6 | 5 | 2.8 | °C/W | | $\Psi_{JB}$ | Junction-to-board characterization parameter | 3.1 | 3 | 12 | 5.5 | 23.7 | 1.2 | 9.3 | °C/W | | R _θ
JC(bot) | Junction-to-case (bottom) thermal resistance | 3 | 3 | 4.7 | n/a | 0.4 | 0.4 | 0.3 | °C/W | | $R_{\theta JP}$ | Thermal resistance between the die junction and the bottom of the exposed pad. | 2.7 | 1.4 | 1.78 | n/a | n/a | 3 | 1.94 | °C/W |

⁽¹⁾ For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.