TDA2030

Part: TDA2030 from STMicroelectronics

Type: 14 W Hi-Fi Audio Amplifier

Description: The TDA2030 is a monolithic integrated circuit in a Pentawatt package, intended for use as a low frequency class-AB amplifier, typically providing 14 W output power at 14 V/4 Ω with short-circuit protection and thermal shutdown.

Operating Conditions:

• Supply voltage: ±6 to ±18 V (12 to 36 V)
• Operating temperature: -40 to 150 °C (junction temperature)
• Output power: up to 12 W (min) on 4 Ω load, 8 W (min) on 8 Ω load (d = 0.5%, f = 40 to 15,000 Hz)

Absolute Maximum Ratings:

• Max supply voltage: ±18 V (36 V)
• Max continuous current: 3.5 A (Output peak current)
• Max junction/storage temperature: -40 to 150 °C

Key Specs:

• Output power (d = 0.5%, R L = 4 Ω): 12 W (Min), 14 W (Typ)
• Output power (d = 0.5%, R L = 8 Ω): 8 W (Min), 9 W (Typ)
• Quiescent drain current (V s = ±18 V): 40 mA (Typ), 60 mA (Max)
• Input offset voltage (V s = ±18 V): ±2 mV (Typ), ±20 mV (Max)
• Distortion (P o = 0.1 to 12 W, R L = 4 Ω): 0.2 % (Typ), 0.5 % (Max)
• Frequency response (-3 dB): 10 Hz to 140 kHz
• Voltage gain (closed loop, f = 1 kHz): 29.5 dB (Min), 30 dB (Typ), 30.5 dB (Max)
• Thermal shutdown junction temperature: 145 °C (Typ)

Features:

• Wide-range supply voltage, up to 36 V
• Single or split power supply
• Short-circuit protection to ground
• Thermal shutdown

Applications:

• Typical amplifier with split power supply
• Typical amplifier with single power supply
• Bridge amplifier configuration

Package:

• Pentawatt horizontal

• ■ Wide-range supply voltage, up to 36 V
• ■ Single or split power supply

■ Short-circuit protection to ground ■ Thermal shutdown Description The TDA2030 is a monolithic integrated circuit in the Pentawatt ® package, intended for use as a low frequency class-AB amplifier. Typically it provides 14 W output power (d = 0.5%) at 14 V/4 Ω . At ±14 V or 28 V, the guaranteed output power is 12 W on a 4 Ω load and 8 W on an 8 Ω (DIN45500). The TDA2030 provides high output current and has very low harmonic and crossover distortion. Furthermore, the device incorporates an original (and patented) short-circuit protection system comprising an arrangement for automatically limiting the dissipated power so as to keep the operating point of the output transistors within their safe operating range. A conventional thermal shutdown system is also included. Figure 1. Ex: Functional block diagram Table 1. Device summary Obsolete Product(s) - Obsolete Product(s)

Typical amplifier with split power Typical amplifier with single power

Figure 16. supply

Figure 17. supply

Figure 18. PC board and component layout for a typical amplifier with split power supply Figure 19. PC board and component layout for a typical amplifier with single power supply Obsolete Product(s) - Obsolete Product(s)

Figure 18. PC board and component layout for a typical amplifier with split power supply Figure 19. PC board and component layout for a typical amplifier with single power supply Obsolete Product(s) - Obsolete Product(s)

Figure 20. Bridge amplifier configuration with split power supply (P o = 28 W, V s = ± 14 V)

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2.2 Thermal data 2.3 Electrical characteristics Refer to the test circuit in Figure 3 ; V S = ±14 V, T amb = 25°C unless otherwise specified. Table 3. Thermal data Table 4. Electrical characteristics Obsolete Product(s) - Obsolete Product(s)

Table 4. Electrical characteristics (continued)

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Table 4. Electrical characteristics (continued)

The presence of a thermal limiting circuit offers the following advantages:

1. An overload on the output (even if it is permanent), or an above limit ambient temperature can be easily supported since T j cannot be higher than 150°C.
2. The heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no possibility of device damage due to high junction temperature. If for any reason, the junction temperature increases to 150°C, the thermal shutdown simply reduces the power dissipation at the current consumption.

The maximum allowable power dissipation depends upon the size of the external heatsink (i.e. its thermal resistance); Figure 25 shows this power dissipation as a function of ambient temperature for different thermal resistances.

Figure 23. Output power and drain current vs. case temperature (R L = 4 Ω ) Figure 24. Output power and drain current vs. case temperature (R L = 8 Ω ) Obsolete Product(s) - Obsolete Product(s)

Figure 23. Output power and drain current vs. case temperature (R L = 4 Ω ) Figure 24. Output power and drain current vs. case temperature (R L = 8 Ω ) Obsolete Product(s) - Obsolete Product(s)

Figure 25. Maximum allowable power dissipation vs. ambient temperature

Figure 26. Example of heatsink

The following table shows the length that the heatsink in Figure 26 must have for several values of P tot and R th . Table 7. Recommended values of heatsink Obsolete Product(s) - Obsolete Product(s)

Figure 26. Example of heatsink

Figure 27. Pentawatt (horizontal) package outline and dimensions

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In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.