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STPS5L25B-TR

Schottky Rectifier

The STPS5L25B-TR is a schottky rectifier from STMicroelectronics. View the full STPS5L25B-TR datasheet below including key specifications.

Manufacturer

STMicroelectronics

Package

TO-252-3, DPAK (2 Leads + Tab), SC-63

Lifecycle

Active

Key Specifications

ParameterValue
Current - Average Rectified (Io)5A
Reverse Leakage Current350 µA @ 25 V
Mounting TypeSurface Mount
Operating Temperature - Junction150°C (Max)
Package / CaseTO-252-3, DPAK (2 Leads + Tab), SC-63
Clock SpeedFast Recovery =< 500ns, > 200mA (Io) Hz
Supplier Device PackageDPAK
Diode TechnologySchottky
Reverse Voltage (Max)25 V
Forward Voltage (Max)470 mV @ 5 A

Overview

Part: STPS5L25 — STMicroelectronics

Type: Low drop power Schottky rectifier

Description: Single Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters, offering a very low forward voltage drop and optimized conduction/reverse losses.

Operating Conditions:

  • Operating temperature: -65 to +150 °C
  • Max junction temperature: 150 °C

Absolute Maximum Ratings:

  • Max repetitive peak reverse voltage: 25 V
  • Max average forward current: 5 A (T c = 140 °C)
  • Max storage temperature: 150 °C

Key Specs:

  • Repetitive peak reverse voltage (V RRM): 25 V
  • Average forward current (I F(AV)): 5 A (T c = 140 °C)
  • Forward rms current (I F(RMS)): 7 A
  • Surge non repetitive forward current (I FSM): 75 A (t p = 10 ms sinusoidal)
  • Forward voltage drop (V F): 0.31 V (typ, T j = 125 °C, I F = 5 A)
  • Reverse leakage current (I R): 115 mA (max, T j = 125 °C, V R = V RRM)
  • Junction to case thermal resistance (R th(j-c)): 2.5 °C/W

Features:

  • Very low forward voltage drop for less power dissipation and reduced heatsink
  • Optimized conduction/reverse losses trade-off
  • High power surface mount miniature package
  • Avalanche specification
  • ECOPACK ® 2 compliant component for DPAK on demand

Applications:

  • Switch mode power supply
  • High frequency DC to DC converters
  • Rectifier at the secondary of 3.3 V SMPS units

Package:

  • DPAK (0.32 g)

Features

  • Very low forward voltage drop for less power dissipation and reduced heatsink
  • Optimized conduction/reverse losses trade-off which means the highest efficiency in the applications
  • High power surface mount miniature package
  • Avalanche specification
  • ECOPACK ® 2 compliant component for DPAK on demand

Package Information

  • Epoxy meets UL94,V0
  • Cooling method: by conduction (C)

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
STPS5L25STMicroelectronics
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