STM32H743ZIT6

Part: STM32H743ZIT6 (STM32H743xI family) — STMicroelectronics

Type: 32-bit Arm Cortex-M7 MCU

Description: 32-bit Arm Cortex-M7 MCU with double-precision FPU running at up to 400 MHz, with up to 2 MB Flash, 1 MB RAM, and 46 communication and analog interfaces.

Operating Conditions:

• Supply voltage (VDD): 1.62–3.6 V
• Operating temperature: -40 to 85 °C for suffix 6 (maximum power dissipation); up to 105 °C in low-power dissipation state. Suffix 3 version extends to 125 °C (130 °C low-power).
• Junction temperature (suffix 6): -40 to 125 °C
• VDDA: 1.62–3.6 V when the ADC or COMP is used; VDD33USB: 3.0–3.6 V when USB is used

Absolute Maximum Ratings:

• Max external supply voltage (VDDX − VSS): 4.0 V (min -0.3 V)
• Input voltage on FT_xxx pins: up to Min(VDD, VDDA, VDD33USB, VBAT) + 4.0 V; on BOOT0: 9.0 V; on TT_xx and other pins: 4.0 V
• Max current into each VDD pin: 100 mA; total into all VDD lines: 620 mA
• Max current sunk by any I/O: 20 mA; total I/O sink or source: 140 mA
• Max junction temperature: 125 °C
• Storage temperature: -65 to +150 °C

Key Specs:

• Core: Cortex-M7 up to 400 MHz, 856 DMIPS (2.14 DMIPS/MHz), 16 KB I-cache + 16 KB D-cache
• Memory: up to 2 MB Flash, 1 MB RAM (192 KB TCM, 864 KB user SRAM, 4 KB backup SRAM)
• Total current consumption down to 4 μA
• Power dissipation at TA = 85 °C (suffix 6): 889 mW (LQFP100) to 1093 mW (TFBGA240+25); 943 mW for LQFP208
• ADCs: 3× with 16-bit max resolution (3.6 MSPS at 16 bits, 4 MSPS at 14 bits)
• I/Os: up to 168, with up to 164 5 V-tolerant
• Timers: up to 22 timers and watchdogs, including a 2.5 ns resolution high-resolution timer
• Total injected current: ±25 mA

Features:

• Dual-mode Quad-SPI up to 133 MHz and flexible memory controller (FMC) with 32-bit bus
• Up to 35 communication peripherals: 4× I2C, 4× USART/4× UART, 1× LPUART, 6× SPI, 4× SAI, 2× FDCAN, 2× USB OTG, Ethernet MAC, 2× SDMMC, HDMI-CEC, SPDIFRX, SWPMI, MDIO slave
• 11 analog peripherals: 2× 12-bit DACs, 2× comparators, 2× op-amps, DFSDM, temperature sensor
• LCD-TFT controller up to XGA, Chrom-ART accelerator, hardware JPEG codec
• 4 DMA controllers, 3 PLLs, internal 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 40 kHz LSI oscillators
• Security: ROP, PC-ROP, active tamper; 3 true random number generators; 96-bit unique ID
• SWD and JTAG debug with 4 KB Embedded Trace Buffer
• Low-power modes: Sleep, Stop, Standby and VBAT; embedded LDO regulator with voltage scaling

Applications:

Package:

• LQFP144 (20x20 mm) for the ZI variant; the family also offers LQFP100, LQFP176, LQFP208, TFBGA100, UFBGA169, UFBGA176+25 and TFBGA240+25
• ECOPACK 2 compliant

Figure 3. LQFP100 pinout

1. The above figure shows the package top view.

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Figure 4. TFBGA100 pinout

1. The above figure shows the package top view.

Figure 5. LQFP144 pinout

1. The above figure shows the package top view.

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Unless otherwise specified, the parameters given in Table 84 are derived from tests performed under the ambient temperature, f PCLK2 frequency and V DDA supply voltage conditions summarized in Table 23: General operating conditions .

Table 84. ADC characteristics (1)

Table 84. ADC characteristics (1)

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Table 84. ADC characteristics (1) (continued)

Stresses above the absolute maximum ratings listed in Table 20: Voltage characteristics , Table 21: Current characteristics , and Table 22: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and the functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 20. Voltage characteristics (1)

1. VIN maximum must always be respected. Refer to Table 57 for the maximum allowed injected current values.
2. This formula has to be applied on power supplies related to the IO structure described by the pin definition table.
3. To sustain a voltage higher than 4V the internal pull-up/pull-down resistors must be disabled.

Table 21. Current characteristics

1. All main power (V DD , V DDA , V DD33USB ) and ground (V SS , V SSA ) pins must always be connected to the external power supplies, in the permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins referring to high pin count QFP packages.
3. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
4. A positive injection is induced by V IN >V DD while a negative injection is induced by V IN <V SS . I INJ(PIN) must never be exceeded. Refer also to Table 20: Voltage characteristics for the maximum allowed input voltage values.
5. When several inputs are submitted to a current injection, the maximum ∑ I INJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values).

Table 22. Thermal characteristics

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The maximum chip-junction temperature, T J max, in degrees Celsius, may be calculated using the following equation:

T J max = T A max + (P D max × Θ JA )

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at www.st.com. ECOPACK ® is an ST trademark.