STM32H743ZIT6

Part: STM32H743xI — STMicroelectronics

Type: ARM Cortex-M7 Microcontroller

Description: 32-bit ARM Cortex-M7 MCU running at up to 400 MHz with double-precision FPU, up to 2 MB Flash, 1 MB RAM, and a rich set of communication and analog interfaces.

Operating Conditions:

• Supply voltage: 1.62 to 3.6 V
• Max CPU frequency: 400 MHz

Absolute Maximum Ratings:

Key Specs:

• Core: 32-bit Arm Cortex-M7 with double-precision FPU
• Max CPU frequency: 400 MHz
• Flash memory: Up to 2 Mbytes with read-while-write support
• RAM: 1 Mbyte (192 Kbytes TCM, 864 Kbytes user SRAM, 4 Kbytes Backup SRAM)
• I/O ports: Up to 168 with interrupt capability, up to 164 5 V-tolerant
• ADC resolution: 16-bit max (14 bits 4 MSPS, 16 bits 3.6 MSPS)
• DAC resolution: 12-bit (1 MHz)
• Low-power consumption: Down to 4 μA total current consumption

Features:

• L1 cache: 16 Kbytes data, 16 Kbytes instruction
• Dual mode Quad-SPI memory interface up to 133 MHz
• Flexible external memory controller (SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND Flash) up to 133 MHz
• 4 DMA controllers (1 MDMA, 2 dual-port DMAs, 1 basic DMA)
• Up to 35 communication peripherals (I2C, USART/UART, LPUART, SPI/I2S, SAI, SPDIFRX, SWPMI, MDIO, SD/SDIO/MMC, CAN FD, USB OTG, Ethernet MAC, HDMI-CEC, Camera interface)
• 11 analog peripherals (temperature sensor, DACs, comparators, operational amplifiers, DFSDM, ADCs)
• Graphics: LCD-TFT controller up to XGA, Chrom-ART graphical hardware Accelerator™, Hardware JPEG Codec
• Up to 22 timers and watchdogs (high-resolution, 32-bit, 16-bit advanced motor control, 16-bit general-purpose, 16-bit low-power, watchdogs, SysTick, RTC)
• Security features: ROP, PC-ROP, active tamper
• Debug mode: SWD & JTAG interfaces, 4 Kbyte Embedded Trace Buffer
• True random number generators

Applications:

Package:

• TFBGA240+25 (14x14 mm)
• TFBGA100 (8x8 mm)
• UFBGA176+25 (10x10 mm)
• UFBGA169 (7x7 mm)
• LQFP208 (28x28 mm)
• LQFP176 (24x24 mm)
• LQFP144 (20x20 mm)
• LQFP100 (14x14 mm)

Figure 3. LQFP100 pinout

1. The above figure shows the package top view.

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Figure 4. TFBGA100 pinout

1. The above figure shows the package top view.

Figure 5. LQFP144 pinout

1. The above figure shows the package top view.

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Unless otherwise specified, the parameters given in Table 84 are derived from tests performed under the ambient temperature, f PCLK2 frequency and V DDA supply voltage conditions summarized in Table 23: General operating conditions .

Table 84. ADC characteristics (1)

Table 84. ADC characteristics (1)

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Table 84. ADC characteristics (1) (continued)

Stresses above the absolute maximum ratings listed in Table 20: Voltage characteristics , Table 21: Current characteristics , and Table 22: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and the functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 20. Voltage characteristics (1)

1. VIN maximum must always be respected. Refer to Table 57 for the maximum allowed injected current values.
2. This formula has to be applied on power supplies related to the IO structure described by the pin definition table.
3. To sustain a voltage higher than 4V the internal pull-up/pull-down resistors must be disabled.

Table 21. Current characteristics

Table 21. Current characteristics

1. All main power (V DD , V DDA , V DD33USB ) and ground (V SS , V SSA ) pins must always be connected to the external power supplies, in the permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be sunk/sourced between two consecutive power supply pins referring to high pin count QFP packages.
3. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
4. A positive injection is induced by V IN >V DD while a negative injection is induced by V IN <V SS . I INJ(PIN) must never be exceeded. Refer also to Table 20: Voltage characteristics for the maximum allowed input voltage values.
5. When several inputs are submitted to a current injection, the maximum ∑ I INJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values).

Table 22. Thermal characteristics

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The maximum chip-junction temperature, T J max, in degrees Celsius, may be calculated using the following equation:

T J max = T A max + (P D max × Θ JA )

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at www.st.com. ECOPACK ® is an ST trademark.