ST25R3917B

Part: ST25R3916B-AQWT — STMicroelectronics

Type: NFC Reader / Transceiver IC

Description: NFC reader IC (ST25R3916B family) with EMVCo PCD L1 v3.2a compliance, 2.6–5.5 V supply, SPI up to 10 Mbit/s and I2C interfaces, and a 512-byte FIFO.

Operating Conditions:

• Supply voltage: 2.6–5.5 V (-40 to +105 °C); 2.4–5.5 V (-20 to +105 °C)
• Operating temperature: -40 to +105 °C
• Peripheral communication supply (VDD_IO): 1.65–5.5 V
• Crystal: 27.12 MHz

Absolute Maximum Ratings:

• Max supply voltage (VDD, VDD_TX): 6.0 V (5 V when option bit sup3V is set)
• Max VDD_IO: 6 V
• Max driver current using internal voltage regulator: 350 mA
• Max peak current from external source (regulator bypassed): 500 mA
• Latch-up input current (JESD78): ±100 mA
• ESD (HBM, JS-001): 2000 V
• Storage temperature: -65 to 150 °C
• Junction temperature: -40 to 125 °C

Key Specs:

• Supply range: 2.6–5.5 V from -40 to +105 °C; 2.4–5.5 V from -20 to +105 °C
• VDD_IO range: 1.65–5.5 V
• SPI: up to 10 Mbit/s
• I2C: 400 kbit/s Fast-mode, 1 Mbit/s Fast-mode Plus, 3.4 Mbit/s High-speed mode
• FIFO: 512 bytes
• ASK modulation depth adjustable from 0 to 82%
• NFC-A/B up to 848 kbit/s, NFC-F up to 424 kbit/s, NFC-V up to 53 kbit/s

Features:

• Operating modes: reader/writer, card emulation, active and passive peer to peer
• EMVCo PCD L1 v3.2a analog and digital compliant, with integrated EMD handling
• Dynamic power output (DPO), active wave shaping (AWS), noise suppression receiver (NSR), automatic antenna tuning (AAT)
• Automatic gain control and squelch
• AM/PM and I/Q demodulator with channel summation or automatic channel selection
• Can drive two independent single-ended antennas
• Measurement of antenna amplitude and phase, RSSI, and supply and regulated voltages
• Integrated regulators for improved PSRR
• Low-power NFC active and passive target modes
• Low-level modes for MIFARE Classic-compliant or custom protocols
• NFC-A and NFC-F card emulation

Applications:

• Payment
• Consumer
• Industrial NFC applications

Package:

• VFQFPN32 (5 x 5 mm)
• UFQFPN32 (5 x 5 mm)
• WLCSP36 (3.223 x 3.213 mm)

• Operating modes
• -Reader/writer
• -Card emulation
• -Active and passive peer to peer
• RF communication
• -EMVCo ® PCD L1 v3.2a analog and digital compliant
• -NFC-A/ISO14443A up to 848 kbit/s
• -NFC-B/ISO14443B up to 848 kbit/s
• -NFC-F/FeliCa™ up to 424 kbit/s
• -NFC-V/ISO15693 up to 53 kbit/s
• -NFC-A/ISO14443A (106 kbit/s) and NFC-F/FeliCa™ (212/424 kbit/s) card emulation
• -Active and passive peer to peer initiator and target modes, up to 424 kbit/s
• -Low-level modes to implement MIFARE Classic ® -compliant or other custom protocols
• Key characteristics
• -Dynamic power output (DPO) controls the field strength to stay within given limits
• -Active wave shaping (AWS) reduces overand undershoots
• -Noise suppression receiver (NSR) allows reception in a noisy environment
• -Automatic antenna tuning (AAT) via variable capacitor

The ST25R3916B, ST25R3917B and ST25R3919B devices are suitable for a wide range of NFC and HF RFID applications, among them

• NFC Forum compliant NFC universal device
• EMVCo PCD L1 v3.2a compliant contactless payment terminal
• ISO14443 and ISO15693 compliant general purpose NFC device
• FeliCa™ reader / writer
• Support all five NFC Forum Tag types in reader mode
• Support all common proprietary protocols, such as Kovio, CTS, B'.

The main differences between the two devices are detailed in Table 1 .

Table 1. List of features

Table 1. List of features

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Table 124. Characteristics of CMOS I/Os (1)

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Stresses beyond the limits listed in Table 122 may cause permanent damage to the device. These are stress ratings only.

Functional operation of the device at these or any other conditions beyond those indicated in Table 122 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 122. Absolute maximum ratings

1. Provide good thermal management to ensure that junction temperature remains below the specified value.
2. VDD_RF is connected to VDD_TX to bypass the internal voltage regulator.
3. Peak current with RF driver externally supplied. Provide good thermal management to ensure that junction temperature remains below the specified value.
4. Reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 'Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices'.

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To meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at www.st.com .

ECOPACK is an ST trademark.