ST25DV04K-XX

Part: ST25DVxxx Type: Dynamic NFC/RFID tag IC

Description: Dynamic NFC/RFID tag IC with 4-Kbit, 16-Kbit or 64-Kbit EEPROM, supporting ISO/IEC 15693 and NFC Forum Type 5 tag standards, featuring an I2C interface and Fast Transfer Mode capability.

Operating Conditions:

• Supply voltage: 1.8V to 5.5V
• Operating temperature: -40 to 85 °C
• I2C protocol speed: 1MHz
• RF fast read access: up to 53 Kbit/s

Key Specs:

• EEPROM memory sizes: 4-Kbit, 16-Kbit, 64-Kbit
• I2C interface speed: 1MHz
• RF fast read access speed: up to 53 Kbit/s
• Internal RF tuning capacitance: 28.5 pF
• Data retention: 40 years
• Write cycles endurance: 1 million at 25 °C, 600k at 85 °C
• Fast Transfer Mode buffer size: 256 bytes
• RF interface standard: ISO/IEC 15693 and NFC Forum Type 5 tag

Features:

• Two-wire I2C serial interface supports 1MHz protocol
• Multiple byte write programming (up to 256 bytes)
• Supports all ISO/IEC 15693 modulations, coding, subcarrier modes and data rates
• Single and multiple blocks write (up to 4) and read via RF
• Fast data transfer between I2C and RF interfaces
• Analog output pin for energy harvesting to power external components
• User memory: 1 to 4 configurable areas, protectable in read and/or write by three 64-bit RF passwords and one 64-bit I2C password
• System configuration: protected in write by 64-bit RF and I2C passwords
• GPO interruption pin configurable on multiple RF events
• Low power mode input pin
• RF command interpreter enabled/disabled from I2C host controller

Package:

• SO8N
• TSSOP8
• UFDFN8
• UFDFPN12

ST25DVxxx offers the following features:

• A Fast Transfer Mode (FTM), to achieve a fast link between RF and contact worlds, via a 256 byte buffer called Mailbox. This mailbox dynamic buffer of 256 byte can be filled or emptied via either RF or I 2 C.
• A GPO pin, which indicates incoming event to the contact side, like RF Field changes, RF activity in progress, RF writing completion or Mailbox message availability.
• An Energy Harvesting element to deliver μW of power when external conditions make it possible.
• RF management, which allows ST25DVxxx to ignore RF requests.

All these features can be programmed by setting static and/or dynamic registers of the ST25DVxxx. ST25DVxxx can be partially customized using configuration registers located in the E 2 system area.

These registers are:

• dedicated to Data Memory organization and protection ENDA i , I2CSS, RFAiSS, LOCK_CCFILE.
• dedicated to Fast Transfer Mode MB_WDG, MB_MODE
• dedicated to observation, GPO, IT_TIME
• dedicated to RF , RF_MNGT, EH_MODE
• dedicated the device's structure LOCK_CFG

A set of additional registers allows to identify and customize the product (DSFID, AFI, IC_REF, etc.).

210

Table 208. I 2 C AC characteristics

1. t CHCL timeout.
2. t CLCH timeout.
3. There is no min. or max. values for the input signal rise and fall times. It is however recommended by the I 2 C specification that the input signal rise and fall times be less than 120 ns when f C < 1 MHz.
4. Characterized on bench.
5. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA.
6. t CLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach 0.8V CC in a compatible way with the I 2 C specification (which specifies t SU:DAT (min) = 100 ns), assuming that the R bus × C bus time constant is less than 150 ns (as specified in the Figure 75: I 2 C Fast mode (f C = 1 MHz): maximum R bus value versus bus parasitic capacitance (C bus ) ).
7. For a reStart condition, or following a write cycle.
8. t DLCL timeout.

Figure 74. I 2 C AC waveforms

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Figure 75 indicates how the value of the pull-up resistor can be calculated. In most applications, though, this method of synchronization is not employed, and so the pull-up resistor is not necessary, provided that the bus master has a push-pull (rather than open drain) output.

Figure 75. I 2 C Fast mode (f C = 1 MHz): maximum R bus value versus bus parasitic capacitance (C bus )

Figure 75 indicates how the value of the pull-up resistor can be calculated. In most applications, though, this method of synchronization is not employed, and so the pull-up resistor is not necessary, provided that the bus master has a push-pull (rather than open drain) output.

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.