SST25VF080B

Part: SST25VF080B

Type: SPI Serial Flash

Key Specs:

• Memory Size: 8-Mbit
• Operating Voltage: 2.7V-3.6V
• High-Speed Clock Frequency: Up to 66 MHz
• Endurance: 100,000 Cycles (typical)
• Data Retention: Greater than 100 years
• Active Read Current: 10 mA (typical)
• Standby Current: 5 μA (typical)
• Chip Erase Time: 35 ms (typical)
• Sector/Block Erase Time: 18 ms (typical)
• Byte Program Time: 7 μs (typical)
• Commercial Temperature Range: 0°C to +70°C
• Industrial Temperature Range: -40°C to +85°C

Features:

• SPI Compatible: Mode 0 and Mode 3
• Flexible Erase Capability: Uniform 4-Kbyte sectors, Uniform 32-Kbyte overlay blocks, Uniform 64-Kbyte overlay blocks
• Auto Address Increment (AAI) Programming
• End of Write Detection: Software polling BUSY bit, Busy Status readout on SO pin in AAI Mode
• Hold Pin (HOLD#): Suspends a serial sequence without deselecting the device
• Write Protection (WP#): Enables/Disables the Lock-Down function of the STATUS register
• Software Write Protection: Through Block Protection bits in STATUS register
• RoHS compliant
• Low pin-count package
• Improved operating frequency
• Lower power consumption
• Proprietary, high-performance CMOS SuperFlash® technology
• Split-gate cell design and thick-oxide tunneling injector

Applications:

• Null

Package:

• 8-lead PDIP: 300 mils
• 8-lead SOIC: 200 mils
• 8-contact WSON: 6 mm x 5 mm
• 16-ball XFBGA: Z-Scale™

• Single Voltage Read and Write Operations - 2.7V-3.6V
• Serial Interface Architecture:
• SPI Compatible: Mode 0 and Mode 3
• High-Speed Clock Frequency:
  • Up to 66 MHz
• Superior Reliability:
  • Endurance: 100,000 Cycles (typical)
  • Greater than 100 years Data Retention
• Low-Power Consumption:
  • Active Read Current: 10 mA (typical)
• Standby Current: 5 μA (typical)
• Flexible Erase Capability:
• Uniform 4-Kbyte sectors
• Uniform 32-Kbyte overlay blocks
• Uniform 64-Kbyte overlay blocks
• Fast Erase and Byte Program:
  • Chip Erase Time: 35 ms (typical)
  • Sector/Block Erase Time: 18 ms (typical)
  • Byte Program Time: 7 μs (typical)
• Auto Address Increment (AAI) Programming:
  • Decrease total chip programming time over Byte Program operations
• End of Write Detection:
  • Software polling the BUSY bit in STATUS Register
  • Busy Status readout on SO pin in AAI Mode
• Hold Pin (HOLD#):
• Suspends a serial sequence to the memory without deselecting the device
• Write Protection (WP#):
  • Enables/Disables the Lock-Down function of the STATUS register
• Software Write Protection:
• Write protection through Block Protection bits in STATUS register
• Temperature Range:
  • Commercial: 0°C to +70°C
  • Industrial: -40°C to +85°C
• All devices are RoHS compliant

Packages

• 8-lead PDIP (300 mils), 8-lead SOIC (200 mils), 8-contact WSON (6 mm x 5 mm) and 16-ball XFBGA (Z-Scale™) See Figure 2-1 for pin assignments.

† NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Note 1: Output shorted for no more than one second. No more than one output shorted at a time.

TABLE 5-1: OPERATING RANGE