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SSM3K333R,LF(T

N-Channel MOSFET

The SSM3K333R,LF(T is a n-channel mosfet from Toshiba. View the full SSM3K333R,LF(T datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.

Manufacturer

Toshiba

Category

N-Channel MOSFET

Lifecycle

Production (Last Updated: 4 months ago)

Key Specifications

ParameterValue
Case/PackageSOT-23-3
Continuous Drain Current (ID)6 A
Drain to Source Resistance28 mΩ
Drain-Source Voltage (Vdss)30 V
Input Capacitance436 pF
Introduction Date2014-03-19
Lifecycle StatusProduction (Last Updated: 4 months ago)
Max Power Dissipation1 W
Min Breakdown Voltage30 V
MountSurface Mount
Number of Elements1
Number of Terminals3
Rds On Max28 mΩ
RoHSCompliant

Overview

Part: SSM3K333R — TOSHIBA

Type: N-Channel MOS Type (U-MOS VII-H) Field-Effect Transistor

Description: 30 V, 6 A N-channel MOSFET with 28 mΩ max ON-resistance at VGS = 10 V, designed for power management and high-speed switching applications.

Operating Conditions:

  • Gate-source voltage: ±20 V
  • Operating temperature: -55 to 150 °C (storage temperature range)

Absolute Maximum Ratings:

  • Max supply voltage: 30 V (Drain-source voltage)
  • Max continuous current: 6 A (DC Drain current)
  • Max junction/storage temperature: 150 °C (Channel temperature)

Key Specs:

  • Drain-source breakdown voltage: 30 V (min) @ ID = 10 mA, VGS = 0 V
  • Drain-source ON-resistance: 42 mΩ (max) @ ID = 3.0 A, VGS = 4.5 V
  • Drain-source ON-resistance: 28 mΩ (max) @ ID = 5.0 A, VGS = 10 V
  • Gate threshold voltage: 1.3 V (min), 2.5 V (max) @ VDS = 10 V, ID = 0.1 mA
  • Input capacitance: 436 pF (typ) @ VDS = 15V, VGS = 0 V, f = 1 MHz
  • Total gate charge: 3.4 nC (typ) @ VDD = 15V, ID = 6.0 A, VGS = 4.5V
  • Turn-on time: 12 ns (typ) @ VDD = 15 V, ID = 3.0 A, VGS = 0 to 4.5 V, RG = 10 Ω
  • Turn-off time: 9 ns (typ) @ VDD = 15 V, ID = 3.0 A, VGS = 0 to 4.5 V, RG = 10 Ω

Features:

  • Power Management Switch Applications
  • High-Speed Switching Applications
  • 4.5V drive
  • Low ON-resistance: RDS(ON) = 42 mΩ (max) (@VGS = 4.5 V)
  • RDS(ON) = 28 mΩ (max) (@VGS = 10 V)

Applications:

  • Power Management Switch Applications
  • High-Speed Switching Applications

Package:

Pin Configuration

SSM3K333R,LF(T) – KFK Package (3-Pin)

Pin NumberPin NameTypeDescription
1Source (S)I/OSource terminal
2Drain (D)I/ODrain terminal
3Gate (G)I/OGate terminal

Notes

  • Package: KFK (3-pin, surface-mount)
  • Device Type: N-Channel MOSFET (U-MOS VII-H)
  • Key Specifications: RDS(ON) = 42 mΩ max @ VGS = 4.5V; 28 mΩ max @ VGS = 10V; VDS(max) = 30V
  • Pin diagram shows top view with Gate (3) at top center, Source (1) at bottom left, and Drain (2) at bottom right.

Electrical Characteristics

Note 3: Pulse test

CharacteristicSymbolTest ConditionsMinTyp.MaxUnit
V (BR) DSSI D = 10 mA, V GS = 0 V30V
Drain-source breakdown voltageV (BR) DSXI D = 10 mA, V GS = - 20 V15
Drain cut-off currentI DSSV DS = 30 V, V GS = 0 V1μ A
Gate leakage currentI GSSV GS = ± 20 V, V DS = 0 V± 0.1μ A
Gate threshold voltageV thV DS = 10 V, I D = 0.1 mA1.32.5V
Forward transfer admittance⏐ Y fs ⏐V DS = 10 V, I D = 5 A(Note 3)1224S
R DS (ON)I D = 3.0 A, V GS = 4.5 V(Note 3)25.742m Ω
Drain-source ON-resistanceI D = 5.0 A, V GS = 10 V(Note 3)18.728
Input capacitanceC iss436pF
Output capacitanceC ossV DS = 15V, V GS = 0 V, f = 1MHz77
Reverse transfer capacitanceC rss28
Total gate chargeQ gV DD = 15V, I D = 6.0 A3.4nC
Gate-source chargeQ gs1V = 4.5V1.8
Gate-drain chargeQ gdGS1.0
Switching timeTurn-on timet onV DD = 15 V, I D = 3.0 A,12ns
Turn-off timet offV GS = 0 to 4.5 V, R G = 10 Ω9
Drain-source forward voltageV DSFI D = -6.0 A, V GS = 0 V(Note 3)-0.85-1.2V

Absolute Maximum Ratings

CharacteristicCharacteristicSymbolRatingUnit
Drain-source voltageDrain-source voltageV DSS30V
Gate-source voltageGate-source voltageV GSS± 20V
DCI D (Note1)6A
PulseI DP (Note1)12A
Power dissipationPower dissipationP D (Note 2)1W
T ch150° C
Storage temperature rangeStorage temperature rangeT stg- 55 to 150° C

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the

reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ('Handling Precautions'/'Derating Concept and Methods') and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Note 1: The channel temperature should not exceed 150 ° C during use.

Note 2: Mounted on a FR4 board.

(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm 2 )

Ordering Information

MPNPackageTemperature RangePacking
SSM3K333Rnullnullnull
SSM3K333R,LF(Tnullnullnull

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
SSM3K333RToshiba
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