Overview

Part: EFM32GG11 Family

Type: ARM Cortex-M4 MCU

Key Specs:

CPU Clock Speed: 72 MHz
Active Mode Current (EM0): 80 μA/MHz
Deep Sleep Current (EM2): 2.1 μA (with 16 kB RAM retention and RTCC running)
Flash Program Memory: Up to 2048 kB
RAM Data Memory: Up to 512 kB
Operating Voltage: 1.8 V to 3.8 V
Integrated DC-DC Output Current: Up to 200 mA

Features:

32-bit ARM Cortex-M4 processor with DSP instruction support and Floating Point Unit
Hardware cryptographic engine supporting AES, ECC, SHA, and TRNG
Octal/Quad-SPI memory interface with Execute In Place (XIP)
SD/MMC/SDIO Host Controller
10/100 Ethernet MAC with 802.3az EEE and IEEE1588
Dual CAN 2.0 Bus Controller
Low-energy USB with Device and Host support, crystal-free device mode
Up to 144 General Purpose I/O Pins with 5 V tolerance on select pins
Integrated DC-DC buck converter
Up to 24 Channel DMA Controller
Up to 24 Channel Peripheral Reflex System (PRS)
External Bus Interface with TFT Controller and per-pixel alpha-blending engine
Security Management Unit (SMU) for fine-grained access control
Integrated Low-energy LCD Controller with up to 8x36 segments
Backup Power Domain with RTCC and retention registers
2x 12-bit

Applications

Smart energy meters
Industrial and factory automation
Home automation and security
Mid- and high-tier wearables
IoT devices
ARM Cortex-M4 at 72 MHz
Ultra low energy operation
80 μA/MHz in Energy Mode 0 (EM0)
2.1 μA EM2 Deep Sleep current (RTCC running with state and RAM retention)
Octal/Quad-SPI memory interface w/ XIP
SD/MMC/SDIO Host Controller
10/100 Ethernet MAC with 802.3az EEE, IEEE1588
Dual CAN 2.0 Bus Controller
Crystal-free low-energy USB
Hardware cryptographic engine supports AES, ECC, SHA, and TRNG
Robust capacitive touch sense
Footprint compatible with select EFM32 packages
5 V tolerant I/O

Electrical Characteristics

4.1 Electrical Characteristics

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

Typical values are based on TAMB=25 °C and VDD= 3.3 V, by production test and/or technology characterization.
Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise.

Refer to 4.1.2.1 General Operating Conditions for more details about operational supply and temperature limits.

4.1.1 Absolute Maximum Ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report athttp://www.silabs.com/support/quality/pages/default.aspx.

Table 4.1. Absolute Maximum Ratings

Parameter	Symbol	Test Condition	Min	Typ	Max	Unit
Storage temperature range	TSTG		-50	—	150	°C
Voltage on supply pins other than VREGI and VBUS	VDDMAX		-0.3	—	3.8	V
Voltage ramp rate on any supply pin	VDDRAMPMAX		—	—	1	V / μs
DC voltage on any GPIO pin	VDIGPIN	5V tolerant GPIO pins1 2 3	-0.3	—	Min of 5.25 and IOVDD +2	V
		LCD pins3	-0.3	—	Min of 3.8 and IOVDD +2	V
		Standard GPIO pins	-0.3	—	IOVDD+0.3	V
Total current into VDD power lines	IVDDMAX	Source	—	—	200	mA
Total current into VSS ground lines	IVSSMAX	Sink	—	—	200	mA
Current per I/O pin	IIOMAX	Sink	—	—	50	mA
		Source	—	—	50	mA
Current for all I/O pins	IIOALLMAX	Sink	—	—	200	mA
		Source	—	—	200	mA
Junction temperature	TJ	-G grade devices	-40	—	105	°C
		-I grade devices	-40	—	125	°C
Voltage on regulator supply pins VREGI and VBUS	VVREGI		-0.3	—	5.5	V

1. When a GPIO pin is routed to the analog module through the APORT, the maximum voltage = IOVDD.
1. Valid for IOVDD in valid operating range or when IOVDD is undriven (high-Z). If IOVDD is connected to a low-impedance source below the valid operating range (e.g. IOVDD shorted to VSS), the pin voltage maximum is IOVDD + 0.3 V, to avoid exceeding the maximum IO current specifications.
1. To operate above the IOVDD supply rail, over-voltage tolerance must be enabled according to the GPIO_Px_OVTDIS register. Pins with over-voltage tolerance disabled have the same limits as Standard GPIO.

4.1.2 Operating Conditions

When assigning supply sources, the following requirements must be observed:

VREGVDD must be greater than or equal to AVDD, DVDD and all IOVDD supplies.
VREGVDD = AVDD
DVDD ≤ AVDD
IOVDD ≤ AVDD

4.1.2.1 General Operating Conditions

Table 4.2. General Operating Conditions

Parameter	Symbol	Test Condition	Min	Typ	Max	Unit
Operating ambient tempera	TA	-G temperature grade	-40	25	85	°C
ture range6		-I temperature grade	-40	25	125	°C
AVDD supply voltage2	VAVDD		1.8	3.3	3.8	V
VREGVDD operating supply	VVREGVDD	DCDC in regulation	2.4	3.3	3.8	V
voltage2 1		DCDC in bypass, 50mA load	1.8	3.3	3.8	V
		DCDC not in use. DVDD external ly shorted to VREGVDD	1.8	3.3	3.8	V
VREGVDD current	IVREGVDD	DCDC in bypass, T ≤ 85 °C	—	—	200	mA
		DCDC in bypass, T > 85 °C	—	—	100	mA
DVDD operating supply volt age	VDVDD		1.62	—	VVREGVDD	V
IOVDD operating supply volt age	VIOVDD	All IOVDD pins5	1.62	—	VVREGVDD	V
DECOUPLE output capaci tor3 4	CDECOUPLE		0.75	1.0	2.75	μF
HFCORECLK frequency	fCORE	VSCALE2, MODE = WS3	—	—	72	MHz
		VSCALE2, MODE = WS2	—	—	54	MHz
		VSCALE2, MODE = WS1	—	—	36	MHz
		VSCALE2, MODE = WS0	—	—	18	MHz
		VSCALE0, MODE = WS2	—	—	20	MHz
		VSCALE0, MODE = WS1	—	—	14	MHz
		VSCALE0, MODE = WS0	—	—	7 72 20 72 20 50 20 50 20 72 20 50	MHz
HFCLK frequency	fHFCLK	VSCALE2	—	—		MHz
		VSCALE0	—	—		MHz
HFSRCCLK frequency	fHFSRCCLK	VSCALE2	—	—		MHz
		VSCALE0	—	—		MHz
HFBUSCLK frequency	fHFBUSCLK	VSCALE2	—	—		MHz
		VSCALE0	—	—		MHz
HFPERCLK frequency	fHFPERCLK	VSCALE2	—	—		MHz
		VSCALE0	—	—		MHz
HFPERBCLK frequency	fHFPERBCLK	VSCALE2	—	—		MHz
		VSCALE0	—	—		MHz
HFPERCCLK frequency	fHFPERCCLK	VSCALE2	—	—		MHz
		VSCALE0	—	—	20	MHz

Parameter	Symbol	Test Condition	Min	Typ	Max	Unit

4.1.3 Thermal Characteristics

Table 4.3. Thermal Characteristics

Parameter	Symbol	Test Condition	Min	Typ	Max	Unit
Thermal resistance, QFN64	THETAJA_QFN64	4-Layer PCB, Air velocity = 0 m/s	—	17.8	—	°C/W
Package		4-Layer PCB, Air velocity = 1 m/s	—	15.4	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	13.8	—	°C/W
Thermal resistance, TQFP64	THE	4-Layer PCB, Air velocity = 0 m/s	—	33.9	—	°C/W
Package	TAJA_TQFP64	4-Layer PCB, Air velocity = 1 m/s	—	32.1	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	30.1	—	°C/W
Thermal resistance,	THE	4-Layer PCB, Air velocity = 0 m/s	—	44.1	—	°C/W
TQFP100 Package	TAJA_TQFP100	4-Layer PCB, Air velocity = 1 m/s	—	37.7	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	35.5	—	°C/W
Thermal resistance, BGA112	THE	4-Layer PCB, Air velocity = 0 m/s	—	42.0	—	°C/W
Package	TAJA_BGA112	4-Layer PCB, Air velocity = 1 m/s	—	37.0	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	35.3	—	°C/W
Thermal resistance, BGA120	THE	4-Layer PCB, Air velocity = 0 m/s	—	47.9	—	°C/W
Package	TAJA_BGA120	4-Layer PCB, Air velocity = 1 m/s	—	41.8	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	39.6	—	°C/W
Thermal resistance, BGA152	THE	4-Layer PCB, Air velocity = 0 m/s	—	35.7	—	°C/W
Package	TAJA_BGA152	4-Layer PCB, Air velocity = 1 m/s	—	31.0	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	29.5	—	°C/W
Thermal resistance, BGA192	THE	4-Layer PCB, Air velocity = 0 m/s	—	47.9	—	°C/W
Package	TAJA_BGA192	4-Layer PCB, Air velocity = 1 m/s	—	41.8	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	39.6	—	°C/W

Absolute Maximum Ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report athttp://www.silabs.com/support/quality/pages/default.aspx.