S32K312
The S32K312 is an electronic component from NXP USA Inc.. View the full S32K312 datasheet below including electrical characteristics.
Manufacturer
NXP USA Inc.
Category
Microcontrollers
Overview
The tables in the following sections describe the thermal characteristics of the device.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting side (board) temperature, ambient temperature, air flow, power dissipation or other components on the board, and board thermal resistance.
Electrical Characteristics
Some devices (S32K358, S32K348, S32K338, S32K328, S32K388 and S32K389) support a SMPS, DC-DC buck converter stage, with a dedicated pin to control an external Power P-channel MOSFET. In addition to the PMOS, an external inductor and a Schottky diode are required. See related figures in section "Recommended decoupling capacitors".
The chip hardware design guidelines document lists the recommended part numbers for PMOS, Schottky diode and inductor.
Table 12. V15 regulator (SMPS option) electrical specifications
| Symbol | Description | Min | Typ | Max | Unit | Condition | Spec Number |
|---|---|---|---|---|---|---|---|
| V15 | V15 output | - | 1.5 | - | V | - | - |
| L_SMPS | External coil inductance | - | 4.7 | - | μH | - | - |
| COUT_V15_SMPS | External bypass capacitor | - | 20-22 | - | μF | - | - |
| D_SMPS | External Schottky diode average forward current | - | 2 | - | A | - | - |
| VR | Schottky diode reverse voltage | 5.0 | - | - | V | - | - |
| IF | Schottky diode forward current | 1.0 | - | - | A | - | - |
| - | External P-channel MOSFET total gate charge | - | - | 10 | nC | VDD_DCDC = 5V | - |
| - | External P-channel MOSFET threshold voltage | - | - | 2 | V | - | - |
| CBULK_SMPS | Input supply bulk capacitor for internal SMPS 1 | - | 22 | - | μF | - | - |
Table 12. V15 regulator (SMPS option) electrical specifications
S32K3xx Data Sheet
Thermal Information
| Symbol | Description | Min | Typ | Max | Unit | Condition | Spec Number |
|---|---|---|---|---|---|---|---|
| Tamb | Ambient temperature | -40 | - | 105 | °C | V- Grade | - |
| Tamb | Ambient temperature | -40 | - | 125 | °C | M- Grade | - |
| TJ | Junction temperature | -40 | - | 150 | °C | - | - |
For S32K388 and S32K389, applications running at 125°C Tamb, thermal management schemes at PCB level will have to be deployed to keep TJ below 150°C.
Package Information
Package dimensions are provided in the package drawings. To find a package drawing, go to nxp.com and perform a keyword search for the drawing's document number:
| Package option | Document Number |
|---|---|
| 48-pin LQFP | 98ASH00962A |
| 257-ball MAPBGA | 98ASA01483D |
| 172-pin HDQFP | 98ASA01107D |
| 100-pin HDQFP | 98ASA01570D |
| 172-pin HDQFP_EP | 98ASA01667D |
| 289-ball MAPBGA | 98ASA01216D |
| 437-BGA | 98ASA01918D |
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