RTL8211FD-CG
The RTL8211FD-CG is an electronic component from Realtek Semiconductor Corp.. View the full RTL8211FD-CG datasheet below including pinout, electrical characteristics, absolute maximum ratings.
Manufacturer
Realtek Semiconductor Corp.
Overview
Part: RTL8211FI-CG — Realtek Semiconductor Corp.
Type: Integrated 10/100/1000M Ethernet Transceiver
Description: Integrated 10/100/1000M Ethernet Transceiver supporting Energy Efficient Ethernet (EEE), Wake-On-LAN (WOL), and RGMII interface.
Operating Conditions:
- Supply voltage (VDD core): 1.00–1.10 V
- Supply voltage (VDDIO I/O): 1.71–3.465 V
- Operating temperature: 0 to +70 °C (suffix-dependent — see Table 10.2 for grade-specific ranges)
Features
- 1000Base-T IEEE 802.3ab Compliant
- 100Base-TX IEEE 802.3u Compliant
- 10Base-T IEEE 802.3 Compliant
- Supports RGMII
- Supports IEEE 802.3az-2010 (Energy Efficient Ethernet)
- Built-in Wake-on-LAN (WOL)
- Supports Interrupt function
- Supports Parallel Detection
- Crossover Detection & Auto-Correction
- Automatic polarity correction
- Supports PHYRSTB core power Turn-Off
- Baseline Wander Correction
- Supports 120m for CAT.5 cable in 1000Base-T
- Selectable 3.3/2.5/1.8/1.5V signaling for RGMII
- Supports 25MHz external crystal or OSC
- Provides 125MHz clock source for MAC
- Provides 3 network status LEDs
- Supports Link Down power saving
- Green Ethernet (1000/100Mbps mode only)
- Built-in Switching Regulator and LDO
- 40-pin QFN Green Package
- 55 nm process with ultra-low power consumption
- Industrial grade manufacturing process (RTL8211FI/RTL8211FDI)
Applications
- DTV (Digital TV)
- MAU (Media Access Unit)
- CNR (Communication and Network Riser)
- Game Console
- Printer and Office Machine
- DVD Player and Recorder
- Ethernet Hub
- Ethernet Switch
In addition, the RTL8211F(I)/RTL8211FD(I) can be used in any embedded system with an Ethernet MAC that needs a UTP physical connection.
Pin Configuration
RTL8211FD-CG Pinout
Package: 40-Pin QFN
| Pin Number | Pin Name | Type | Description |
|---|---|---|---|
| 1 | MDIP0 | I/O | MII Data Input/Output 0 |
| 2 | MDIN0 | I/O | MII Data Input 0 |
| 3 | AVDD10 | P | 1.0V Analog Power Supply |
| 4 | MDIP1 | I/O | MII Data Input/Output 1 |
| 5 | MDIN1 | I/O | MII Data Input 1 |
| 6 | MDIP2 | I/O | MII Data Input/Output 2 |
| 7 | MDIN2 | I/O | MII Data Input 2 |
| 8 | AVDD10 | P | 1.0V Analog Power Supply |
| 9 | MDIP3 | I/O | MII Data Input/Output 3 |
| 10 | MDIN3 | I/O | MII Data Input 3 |
| 11 | AVDD33 | P | 3.3V Analog Power Supply |
| 12 | PHYRSTB | I | PHY Reset (Active Low) |
| 13 | MDC | I | MII Management Data Clock |
| 14 | MDIO | I/O | MII Management Data Input/Output |
| 15 | TXD3 | O | Transmit Data 3 |
| 16 | TXD2 | O | Transmit Data 2 |
| 17 | TXD1 | O | Transmit Data 1 |
| 18 | TXD0 | O | Transmit Data 0 |
| 19 | TXCTL | O | Transmit Control |
| 20 | TXC | O | Transmit Clock |
| 21 | DVDD0 | P | Digital Power Supply 0 |
| 22 | RXD3 / PLUOFF | I | Receive Data 3 / Plug-Off |
| 23 | RXD2 / PLUOFF | I | Receive Data 2 / Plug-Off |
| 24 | RXDV / RXDLY | I | Receive Data Valid / Receive Delay |
| 25 | RXD0 / RXDLY | I | Receive Data 0 / Receive Delay |
| 26 | RXCTL / PHYAD1 | I | Receive Control / PHY Address 1 |
| 27 | RXC / PHYAD2 | I | Receive Clock / PHY Address 2 |
| 28 | DVDD_RG | I | Digital Power Supply RG |
| 29 | DVDD33 | P | 3.3V Digital Power Supply |
| 30 | REEL_OUT | O | Reel Output |
| 31 | INTB / PMEB | I/O | Interrupt (Active Low) / PME (Power Management Event) |
| 32 | LED0 / CFG_EXT | I/O | LED0 / Configuration External |
| 33 | LED1 / CFG_LDO0 | I/O | LED1 / Configuration LDO0 |
| 34 | LED2 / CFG_LDO1 | I/O | LED2 / Configuration LDO1 |
| 35 | CLKOUT | O | Clock Output |
| 36 | XTAL_IN | I | Crystal Input |
| 37 | XTAL_OUT / EXT_CLK | O | Crystal Output / External Clock |
| 38 | AVDD10 | P | 1.0V Analog Power Supply |
| 39 | RSET | I | Reset Set |
| 40 | AVDD33 | P | 3.3V Analog Power Supply |
| 41 | GND (Exposed Pad) | S | Ground (Exposed Pad) |
Notes
- Pin 41 is the exposed thermal/ground pad on the bottom of the QFN package.
- Multiple pins share the same power supply nets (AVDD10, AVDD33, DVDD0, DVDD33, DVDD_RG); all must be properly decoupled.
- Pins 22–27 have alternate functions for configuration and delay control; function selection depends on hardware configuration and strapping.
- Pins 32–34 (LED0–LED2) have alternate configuration functions (CFG_EXT, CFG_LDO0, CFG_LDO1).
- Pin 31 (INTB/PMEB) is open-drain and requires external pull-up.
- PHYRSTB (pin 12) is active-low and must be held low during power-up sequencing.
Electrical Characteristics
Table 56. DC Characteristics
| Symbol | Parameter | Conditions | Minimum | Typical | Maximum | Units |
|---|---|---|---|---|---|---|
| VDD33,AVDD33 | 3.3V Supply Voltage | - | 2.97 | 3.3 | 3.63 | V |
| 1. MDIO (Table 4, page 8) 2. RGMII I/O (Table 3, page 8) | 2.5V RGMII Supply Voltage | - | 2.25 | 2.5 | 2.75 | V |
| 1. MDIO (Table 4, page 8) 2. RGMII I/O (Table 3, page 8) | 1.8V RGMII Supply Voltage | - | 1.62V | 1.8V | 1.98V | V |
| 1. MDIO (Table 4, page 8) 2. RGMII I/O (Table 3, page 8) | 1.5V RGMII Supply Voltage | - | 1.5V | 1.55V | 1.6V | V |
| DVDD10, AVDD10 | 1.0V Supply Voltage | - | 0.95 | 1.0 | 1.05 | V |
| Voh (3.3V) | Minimum High Level Output Voltage | - | 2.4 | - | VDD33+0.3 | V |
| Voh (2.5V) | Minimum High Level Output Voltage | - | 2.0 | - | VDD25+0.3 | V |
| Voh (1.8V) | Minimum High Level Output Voltage | - | 0.9*VDD18 | - | VDD18+0.3 | V |
| Voh (1.5V) | Minimum High Level Output Voltage | - | 0.9*VDD15 | - | VDD15+0.3 | V |
| Vol (3.3V) | Maximum Low Level Output Voltage | - | -0.3 | - | 0.4 | V |
| Vol (2.5V) | Maximum Low Level Output Voltage | - | -0.3 | - | 0.4 | V |
| Vol (1.8V) | Maximum Low Level Output Voltage | - | -0.3 | - | 0.1*VDD18 | V |
| Vol (1.5V) | Maximum Low Level Output Voltage | - | -0.3 | - | 0.1*VDD15 | V |
| Vih (3.3V) | Minimum High Level Input Voltage | - | 2.0 | - | - | V |
| Vil (3.3V) | Maximum Low Level Input Voltage | - | - | - | 0.8 | V |
| Vih (2.5V) | Minimum High Level Input Voltage | - | 1.7 | - | - | V |
| Vil (2.5V) | Maximum Low Level Input Voltage | - | - | - | 0.7 | V |
| Vih (1.8V) | Minimum High Level Input Voltage | - | 1.2 | - | - | V |
| Vil (1.8V) | Maximum Low Level Input Voltage | - | - | - | 0.5 | V |
| Vih (1.5V) | Minimum High Level Input Voltage | - | 1.0 | - | - | V |
| Vil (1.5V) | Maximum Low Level Input Voltage | - | - | - | 0.3 | V |
| Iin | Input Current | Vin=VDD33 or GND | 0 | - | 0.5 | μA |
Note: Pins not mentioned above remain at 3.3V.
Table 56. DC Characteristics
Absolute Maximum Ratings
WARNING: Absolute maximum ratings are limits beyond which permanent damage may be caused to the device, or device reliability will be affected. All voltages are specified reference to GND unless otherwise specified.
Table 52. Absolute Maximum Ratings
| Symbol | Description | Minimum | Maximum | Unit |
|---|---|---|---|---|
| VDD33,AVDD33 | Supply Voltage 3.3V | -0.3 | 3.6 | V |
| AVDD10, DVDD10 | Supply Voltage 1.0V | -0.3 | 1.2 | V |
| 2.5V RGMII/GMII | Supply Voltage 2.5V | -0.2 | 2.8 | V |
| 1.8V RGMII | Supply Voltage 1.8V | -0.2 | 2.3 | V |
| 1.5V RGMII | Supply Voltage 1.5V | -0.2 | 2 | V |
| 3.3V DCinput 3.3V DCoutput | Input Voltage Output Voltage | -0.3 | 3.6 | V |
| 1.0V DCinput 1.0V DCoutput | Input Voltage Output Voltage | -0.3 | 1.2 | V |
| NA | Storage Temperature | -55 | 125 | ° C |
Note: Refer to the most updated schematic circuit for correct configuration.
Recommended Operating Conditions
Table 53. Recommended Operating Conditions
| Description | Pins | Minimum | Typical | Maximum | Unit |
|---|---|---|---|---|---|
| Supply VoltageVDD | DVDD33,AVDD33 | 2.97 | 3.3 | 3.63 | V |
| Supply VoltageVDD | AVDD10, DVDD10 | 0.95 | 1.0 | 1.05 | V |
| Supply VoltageVDD | 2.5V RGMII/GMII | 2.25 | 2.5 | 2.75 | V |
| Supply VoltageVDD | 1.8V RGMII | 1.62 | 1.8 | 1.98 | V |
| Supply VoltageVDD | 1.5V RGMII | 1.5 | 1.55 | 1.6 | V |
| Ambient Operating Temperature T A (RTL8211F/RTL8211FD) | - | 0 | - | 70 | ° C |
| Ambient Operating Temperature T A (RTL8211FI/RTL8211FDI) | - | -40 | - | 85 | ° C |
| Maximum Junction Temperature | - | - | - | 125 | ° C |
Table 53. Recommended Operating Conditions
Typical Application
Figure 1. Application Diagram - RTL8211F(I)
Figure 1. Application Diagram - RTL8211F(I)
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| RTL8211F | Realtek Semiconductor Corp. | — |
| RTL8211F-CG | Realtek Semiconductor Corp. | — |
| RTL8211FD | Realtek Semiconductor Corp. | — |
| RTL8211FDI | Realtek Semiconductor Corp. | — |
| RTL8211FDI-CG | Realtek Semiconductor Corp. | — |
| RTL8211FI | Realtek Semiconductor Corp. | — |
| RTL8211FI-CG | Realtek Semiconductor Corp. | 40-pin QFN |
| RTL8211XX | Realtek Semiconductor Corp. | — |
| RTL8211XX-XX | Realtek Semiconductor Corp. | — |
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