RT6150A
Current Mode Buck-Boost Converter
Manufacturer
unknown
Overview
Part: RT6150A/B from Richtek Technology Corporation
Type: Current Mode Buck-Boost DC/DC Converter
Key Specs:
- Input Voltage Range: 1.8V to 5.5V
- Continuous Output Current: Up to 800mA
- Switching Frequency: 1MHz
- Quiescent Current (Power Save Mode): 60μA (typical)
- Shutdown Current: 0.1μA (typical)
- Efficiency: Up to 90%
- Output Voltage Options: Fixed 3.3V, Adjustable 1.8V to 5.5V
Features:
- Single Inductor
- Fixed Frequency Operation
- Synchronous Rectification
- VOUT Disconnected from VIN during Shutdown
- Power Save Mode (PSM) Enable Control
- Internal soft-start control
- Thermal shutdown protection
- Current limit
- RoHS Compliant and Halogen Free
Applications:
- Portable Products
- Handheld Instrumentation
Package:
- WDFN-10L 3x3 (for RT6150A)
- WDFN-10L 2.5x2.5 (for RT6150B)
Features
- Single Inductor
- Fixed Frequency Operation with Battery Voltages
- Synchronous Rectification : Up to 90% Efficiency
- Up to 800mA Continuous Output Current
- VOUT Disconnected from VIN during Shutdown
- Power Save Mode (PSM) Enable Control
- <1μA Shutdown Current
- Input Voltage Range: 1.8V to 5.5V
- Fixed 3.3V and Adjustable Output Voltage Options from 1.8V to 5.5V
- 10-Lead WDFN Packages
- RoHS Compliant and Halogen Free
Applications
- Portable Products
- Handheld Instrumentation
Features
- Single Inductor
- Fixed Frequency Operation with Battery Voltages
- Synchronous Rectification : Up to 90% Efficiency
- Up to 800mA Continuous Output Current
- VOUT Disconnected from VIN during Shutdown
- Power Save Mode (PSM) Enable Control
- <1μA Shutdown Current
- Input Voltage Range: 1.8V to 5.5V
- Fixed 3.3V and Adjustable Output Voltage Options from 1.8V to 5.5V
- 10-Lead WDFN Packages
- RoHS Compliant and Halogen Free
Pin Configuration
WDFN-10L 3x3 / WDFN-10L 2.5x2.5
RT6150BGQW
00 : Product Code W : Date Code
RT6150B-33GQW
03: Product Code W: Date Code
Functional Pin Description
| Pin No. | Pin Name | Pin Function |
|---|---|---|
| 1 | VOUT | Output of the Buck-Boost Converter. Connect a capacitor between the VOUT and GND. |
| 2 | LX2 | Second Switch Node. Connect this pin to the inductor. |
| 3, 9, 11 (Exposed Pad) | GND | Power Ground. The exposed pad must be soldered to a large PCB and connected to GND for maximum power dissipation. |
| 4 | LX1 | First Switch Node. Connect this pin to the inductor. |
| 5 | VIN | Power Input. Connect an at least 10μ F capacitor between the VIN pin and GND. |
| 6 | EN | Enable Control Input for the Buck-Boost Converter. |
| 7 | PS | PSM Control Input. Pull low for PSM operation and pull high for fixed switching frequency operation. |
| 8 | VINA | Supply Voltage Input for Control Circuit. |
| 10 | FB | Feedback Input. For adjustable versions, connect a resistive divider to set the output voltage and it can be adjusted from 1.8V to 5.5V; For fixed version, must be connected to VOUT. |
Function Block Diagram
Operation
The RT6150A/B is a synchronous average current mode switching Buck-Boost converter designed to maintain a fixed output voltage from an input supply that can be above, equal, or below the output voltage. The average inductor current is regulated by a fast current regulator which is controlled by a voltage control loop. The voltage error amplifier gets its feedback input from the FB pin. For adjustable output voltage, a resistive voltage divider must be connected to the FB pin. When VIN is greater than VOUT, the device operates in Buck mode. When VIN is lower than VOUT, the device operates in Boost mode. When VIN is close to VOUT, the RT6150A/B automatically enters Buck-Boost mode. In Buck-Boost mode, the converter will maintain the regulation for output voltage and keep a minimum current ripple in the inductor to guarantee good performance.
Electrical Characteristics
( VIN = VOUT = 3.6V , TA = 25 °C, unless otherwise specified.)
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit | |
|---|---|---|---|---|---|---|---|
| Input Voltage UVLO | High-Level | 1.65 | 1.8 | 1.8 V | |||
| Low-Level | 1.4 | 1.55 | V | ||||
| Feedback Volta | ge | V FB | VPS = VIN | 0.495 | 0.5 | 0.505 | V |
| Feedback Input | Current | V FB = 0.5V | 1 | 50 | nA | ||
| Quiescent Current | I OUT = 0mA, PS = 0V (Note 5) Power Save Mode | 60 | μA | ||||
| EN = 0V, Not Including Switch Leakage Shutdown | 0.1 | 1 | |||||
| N-MOSFET Switch Leakage | 0.1 | 5 | μA | ||||
| P-MOSFET Sw | P-MOSFET Switch Leakage | 0.1 | 10 | μA | |||
| N-MOSFET Switch On Resistance | R DS(ON)_N | 0.15 | Ω | ||||
| P-MOSFET Switch On Resistance | R DS(ON) _P | 0.15 | Ω | ||||
| Switch Current Limit | I LIM | V IN = 3.6V | 1.6 | Α | |||
| Oscillator Frequency | fosc | 0.8 | 1 | 1.2 | MHz | ||
| Soft-Start Time | tss | Time from when EN signal asserts to output voltage IOUT = 0mA | 0.65 | 1 | ms | ||
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit | |
|---|---|---|---|---|---|---|---|
| EN and PS Input | Logic-High | 1.2 | |||||
| Voltage | Logic-Low | 0.4 | V | ||||
| EN and PS Input Current | VEN = VPS = VIN | 0.01 | 1 | A | |||
| Thermal Shutdown | TSD | 140 | C |
- Note 1. Stresses beyond those listed "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
- Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is measured at the exposed pad of the package.
- Note 3. Devices are ESD sensitive. Handling precaution is recommended.
- Note 4. The device is not guaranteed to function outside its operating conditions.
- Note 5. Current measurements are performed when the output are not switching.
Absolute Maximum Ratings
| • VOUT, VIN, EN, PS, VINA, FB Pin | -0.3V to 6V |
|---|---|
| Switch Output Voltage, LX1, LX2 Pin | -0.3V to 6V |
| < 10ns | -2V to 7.5V |
| |
| WDFN-10 3x3 | |
| WDFN-10 2.5x2.5 | 2.44W |
| Package Thermal Resistance (Note 2) | |
| WDFN-10 3x3, θJA | 30.5°C/W |
| WDFN-10 3x3, θJC | 7.5°C/W |
| WDFN-10 2.5x2.5, θJA | |
| WDFN-10 2.5x2.5, θJC | 18.6°C/W |
| • Lead Temperature (Soldering, 10 sec.) | 260°C |
| • Junction Temperature | 150°C |
| Storage Temperature Range | –65°C to 150°C |
| ESD Susceptibility (Note 3) | |
| HBM (Human Body Model) | |
| MM (Machine Model) | 200V |
| Recommended Operating Conditions (Note 4) | |
| Supply Input Voltage, VIN | |
| Junction Temperature Range | -40°C to 125°C |
• Ambient Temperature Range ----- ---- -40°C to 85°C
Electrical Characteristics
( VIN = VOUT = 3.6V , TA = 25 °C, unless otherwise specified.)
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit | |
|---|---|---|---|---|---|---|---|
| Input Voltage UVLO | High-Level | 1.65 | 1.8 | 1.8 V | |||
| Low-Level | 1.4 | 1.55 | V | ||||
| Feedback Volta | ge | V FB | VPS = VIN | 0.495 | 0.5 | 0.505 | V |
| Feedback Input | Current | V FB = 0.5V | 1 | 50 | nA | ||
| Quiescent Current | I OUT = 0mA, PS = 0V (Note 5) Power Save Mode | 60 | μA | ||||
| EN = 0V, Not Including Switch Leakage Shutdown | 0.1 | 1 | |||||
| N-MOSFET Switch Leakage | 0.1 | 5 | μA | ||||
| P-MOSFET Sw | P-MOSFET Switch Leakage | 0.1 | 10 | μA | |||
| N-MOSFET Switch On Resistance | R DS(ON)_N | 0.15 | Ω | ||||
| P-MOSFET Switch On Resistance | R DS(ON) _P | 0.15 | Ω | ||||
| Switch Current Limit | I LIM | V IN = 3.6V | 1.6 | Α | |||
| Oscillator Frequency | fosc | 0.8 | 1 | 1.2 | MHz | ||
| Soft-Start Time | tss | Time from when EN signal asserts to output voltage IOUT = 0mA | 0.65 | 1 | ms | ||
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit | |
|---|---|---|---|---|---|---|---|
| EN and PS Input | Logic-High | 1.2 | |||||
| Voltage | Logic-Low | 0.4 | V | ||||
| EN and PS Input Current | VEN = VPS = VIN | 0.01 | 1 | A | |||
| Thermal Shutdown | TSD | 140 | C |
- Note 1. Stresses beyond those listed "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
- Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is measured at the exposed pad of the package.
- Note 3. Devices are ESD sensitive. Handling precaution is recommended.
- Note 4. The device is not guaranteed to function outside its operating conditions.
- Note 5. Current measurements are performed when the output are not switching.
Thermal Information
The device has a built-in temperature sensor which monitors the internal junction temperature. If the temperature exceeds the threshold, the device stops operating. As soon as the IC temperature has decreased below the threshold with a hysteresis, it starts operating again. The built-in hysteresis is designed to avoid unstable operation at IC temperatures near the over temperature threshold.

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