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PIC32MX270F256D

32-bit Microcontroller

The PIC32MX270F256D is a 32-bit microcontroller from Microchip Technology. View the full PIC32MX270F256D datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

PIC32MX270F256D shares its datasheet with PIC32MX270F256B, whose page lists every part number it covers.

Official PIC32MX270F256D datasheet (PDF) — the source this page was extracted from.

PIC32MX270F256D Key Specifications

ParameterValue
ADC10-bit, 1.1 Msps, 13 channels
I2C2 (up to 1 Mbaud, SMBus)
USBUSB 2.0 Full-speed OTG
UART2 (up to 12.5 Mbps)
SPI/I2S2 (up to 25 Mbps)
CPU CoreMIPS32 M4K, 50 MHz / 83 DMIPS
I/O Pins34
Pin Count44
DMA Channels4 programmable + 2 dedicated USB
Supply Voltage2.3V to 3.6V
Dynamic Current0.5 mA/MHz (typical)
Remappable Pins31
Analog Comparators3
Data Memory (SRAM)64 KB
Power-Down Current20 µA (typical)
Program Flash Memory256 KB + 3 KB boot Flash
Operating Temperature-40°C to +105°C (DC to 40 MHz); -40°C to +85°C (DC to 50 MHz)
Timers/Capture/Compare5/5/5
Internal Oscillator Accuracy0.9%

PIC32MX270F256D Overview

Part: PIC32MX270F256B — Microchip Technology Inc.

Type: 32-bit Microcontroller

Description: 32-bit MIPS32 M4K MCU operating up to 50 MHz (83 DMIPS) with 256 KB Flash, 64 KB SRAM, Full-Speed USB 2.0 OTG, and advanced analog peripherals.

Operating Conditions:

  • Supply voltage: 2.3 to 3.6 V
  • Operating temperature: -40 to +85 °C
  • Max clock frequency: 50 MHz (DC to 50 MHz at -40 to +85 °C; DC to 40 MHz at -40 to +105 °C)

Key Specs:

  • Core: MIPS32 M4K running at up to 50 MHz (83 DMIPS)
  • Dynamic current: 0.5 mA/MHz (typical)
  • Power-down current (IPD): 44 μA (typical)
  • ADC: 10-bit resolution, 1.1 Msps sample rate with 1 S&H (9 analog input channels)
  • Internal oscillator accuracy: 0.9%
  • I/O current drive: 10 mA source/sink on all I/O pins (up to 14 mA on non-standard VOH)
  • UART data rate: up to 12.5 Mbps
  • SPI data rate: up to 25 Mbps

Features:

  • MIPS16e mode for up to 40% code size reduction
  • USB 2.0-compliant Full-Speed OTG controller with 2 dedicated DMA channels
  • 4 hardware DMA channels with automatic data size detection
  • Charge Time Measurement Unit (CTMU) supporting mTouch capacitive touch sensing and 1 ns time measurement
  • Peripheral Pin Select (PPS) for remappable digital I/O functions
  • Up to 3 analog comparators with programmable 32-point voltage references
  • Audio interface supporting I2S, Left-Justified, Right-Justified, and DSP modes
  • 5V-tolerant digital inputs

Applications:

  • Audio and graphics interfaces
  • Embedded USB applications
  • Capacitive touch sensing interfaces
  • General-purpose 32-bit embedded control

Package:

  • 28-pin SOIC (17.90 x 7.50 x 2.65 mm)
  • 28-pin SSOP (10.2 x 5.3 x 2 mm)
  • 28-pin SPDIP (1.365" x 0.285" x 0.135")
  • 28-pin QFN (6 x 6 x 0.9 mm)

PIC32MX270F256D Features

  • Data communication: I 2 S, LJ, RJ, and DSP modes
  • Control interface: SPI and I 2 C
  • Master clock:
  • -Generation of fractional clock frequencies
  • -Can be synchronized with USB clock
  • -Can be tuned in run-time

PIC32MX270F256D Electrical Characteristics

This section provides an overview of the PIC32MX1XX/2XX 28/36/44-pin Family electrical characteristics for devices that operate at 40 MHz. Refer to Section 31.0 '50 MHz Electrical Characteristics' for additional specifications for operations at higher frequency. Additional information will be provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the PIC32MX1XX/2XX 28/36/44-pin Family devices are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied.

PIC32MX270F256D Absolute Maximum Ratings

(See Note 1)

Ambient temperature under bias...............................................................................................................-40°Cto +85°C
Storage temperature ..............................................................................................................................-65°C to +150°C
Voltage on VDD with respect to VSS .........................................................................................................-0.3V to +4.0V
Voltage on any pin that is not 5V tolerant, with respect to VSS (Note 3) ......................................... -0.3Vto (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD 2.3V (Note 3) ........................................-0.3V to +5.5V
Voltage on any 5V tolerant pin with respect to VSS when VDD < 2.3V (Note 3) ........................................-0.3V to +3.6V
Voltage on D+ or D- pin with respect to VUSB3V3 ..................................................................... -0.3V to (VUSB3V3 + 0.3V)
Voltage on VBUS with respect to VSS .......................................................................................................-0.3V to +5.5V
Maximum current out of VSS pin(s) .......................................................................................................................300mA
Maximum current into VDD pin(s) (Note 2) ............................................................................................................300mA
Maximum output current sunk by any I/O pin..........................................................................................................15mA
Maximum output current sourced by any I/O pin ....................................................................................................15mA
Maximum current sunk by all ports .......................................................................................................................200mA
Maximum current sourced by all ports (Note 2) ....................................................................................................200mA
  • Note 1: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
  • 2: Maximum allowable current is a function of device maximum power dissipation (see Table 30-2).
  • 3: See the 'Pin Diagrams' section for the 5V tolerant pins.

PIC32MX270F256D Thermal Information

RatingSymbolMin.TypicalMax.Unit
Industrial Temperature Devices
Operating Junction Temperature RangeTJ-40-+125°C
Operating Ambient Temperature RangeT A-40-+85°C
V-temp Temperature Devices
Operating Junction Temperature RangeTJ-40-+140°C
Operating Ambient Temperature RangeT A-40-+105°C
Power Dissipation:
Internal Chip Power Dissipation: PINT = VDD x (IDD - S I OH)PDPINT + PI /OPINT + PI /OPINT + PI /OW
I/O Pin Power Dissipation: I/O = S (({VDD - VOH} x I OH) + S (V OL x I
Maximum Allowed Power DissipationPDMAX(T J - T A )/ JA(T J - T A )/ JA(T J - T A )/ JAW

PIC32MX270F256D Typical Application

Examples of typical application connections are shown

in Figure 2-5 and Figure 2-6.

FIGURE 2-5: CAPACITIVE TOUCH SENSING WITH GRAPHICS APPLICATION

FIGURE 2-6: AUDIO PLAYBACK APPLICATION

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
PIC32MX270F256BMicrochip TechnologySOIC-28

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