PIC24FJ64GA705

Part: PIC24FJ64GA705 (PIC24FJ256GA705 family) — Microchip Technology

Type: 16-bit General Purpose Microcontroller (PIC24F)

Description: 16-bit PIC24F MCU with up to 16 MIPS at 32 MHz, 2.0–3.6 V supply, 64 KB Flash and 16 KB SRAM in the PIC24FJ64GA705 (48-pin), with a 12-bit 200 ksps ADC, three comparators and CTMU.

Operating Conditions:

• Supply voltage: 2.0–3.6 V
• Operating temperature: -40 to +85 °C (Industrial); -40 to +125 °C (Extended)
• Max CPU speed: 32 MHz (16 MIPS)

Absolute Maximum Ratings:

• Max supply voltage (VDD with respect to VSS): -0.3 V to +4.0 V
• Max current into VDD pin: 250 mA
• Max current out of VSS pin: 300 mA
• Max current sunk or sourced by any I/O pin: 25 mA each
• Max current sunk or sourced by all ports: 200 mA each
• Ambient temperature under bias: -40 to +125 °C
• Storage temperature: -65 to +150 °C

Key Specs:

• Flash: 64 KB (PIC24FJ64GA705); SRAM: 16 KB
• ADC: up to 14 channels, 10/12-bit, 200 ksps
• Comparator input offset: 12 mV typ, 50 mV max; response time 300 ns typ; 27 μA typ quiescent current per comparator
• Comparator input common-mode range: 0 to VDD; CMRR 55 dB min
• Comparator voltage reference: absolute accuracy ±100 mV; settling time 10 μs max
• CTMU current source ranges: 550 nA (base), 5.5 μA, 55 μA, 550 μA, 2.2 mA (high range), at 2.5 V < VDD < VDDMAX
• I/O: 40 GPIO on 48-pin devices; 18 mA sink/source on all I/O pins
• Flash endurance 10,000 erase/write cycles typ; 20-year data retention min

Features:

• Modified Harvard architecture, 8 MHz internal FRC oscillator with 96 MHz PLL option
• 17x17 single-cycle multiplier and 32/16 hardware divider
• Six-channel DMA controller
• Three comparators, CTMU, and LVD interrupt
• Dual voltage regulators (1.8 V core, 1.2 V for Retention Sleep)
• ECC Flash memory
• Sleep, Idle and Doze low-power modes
• Four MCCP modules, three IC and three OC/PWM modules
• Three SPI ports (with I²S mode), two I²C modules, two UARTs (LIN/J2602, IrDA)
• Enhanced parallel master port (EPMP), CRC, two CLC blocks, RTCC
• Peripheral Pin Select
• JTAG boundary scan, ICSP and ICE
• AEC-Q100 REVG Grade 1 qualification and Class B safety library (IEC 60730)

Applications:

• General purpose embedded control
• Automotive-qualified designs (AEC-Q100 Grade 1)

Package:

• 48-pin UQFN and TQFP (PIC24FJ64GA705)
• 44-pin TQFP (GA704 variants)
• 28-pin QFN, UQFN, SOIC, SSOP and SPDIP (GA702 variants)

• Up to 14-Channel, Software-Selectable, 10/12-Bit Analog-to-Digital Converter:
• -12-bit, 200K samples/second conversion rate (single Sample-and-Hold)
• -Sleep mode operation
• -Charge pump for operating at lower AVDD
• -Band gap reference input feature
• -Windowed threshold compare feature
• -Auto-scan feature
• Three Analog Comparators with Input Multiplexing:
• -Programmable reference voltage for comparators
• LVD Interrupt Above/Below Programmable VLVD Level
• Charge Time Measurement Unit (CTMU):
• -Allows measurement of capacitance and time
• -Operational in Sleep

This section provides an overview of the PIC24FJ256GA705 family electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the PIC24FJ256GA705 family are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these, or any other conditions above the parameters indicated in the operation listings of this specification, is not implied.

Note 1: Maximum allowable current is a function of device maximum power dissipation (see Table 32-1).

† NOTICE: Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

• Dimensioning and tolerancing per ASME Y14.5M 1.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

• For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 2.

Microchip Technology Drawing C04-2442A-M4