PCF8574/74A
Remote 8-bit I/O expanderThe PCF8574/74A is a remote 8-bit i/o expander from NXP Semiconductors. View the full PCF8574/74A datasheet below including specifications and datasheet sections.
Manufacturer
NXP Semiconductors
Category
Remote 8-bit I/O expander
Overview
Part: PCF8574; PCF8574A
Type: Remote 8-bit I/O expander for I2C-bus with interrupt
Description: The PCF8574/74A provides general-purpose remote 8-bit quasi-bidirectional I/O expansion via a 100 kHz I2C-bus, featuring three hardware address inputs, an active LOW interrupt output, and operating from 2.5 V to 6 V with a typical standby current of 2.5 μA.
Operating Conditions:
- Supply voltage: 2.5 V to 6 V
- Operating temperature: -40 °C to +85 °C
- I2C-bus frequency: 100 kHz
Absolute Maximum Ratings:
- Max supply voltage: null
- Max continuous current: 80 mA (total package sink capability)
- Max junction/storage temperature: null
Key Specs:
- I/O bits: 8 (quasi-bidirectional)
- I2C-bus interface: 100 kHz (Standard-mode)
- Supply voltage range: 2.5 V to 6 V
- Standby current: 2.5 μA (typical)
- I/O weak pull-up current: 100 μA
- Total package sink capability: 80 mA
- Operating temperature range: -40 °C to +85 °C
- Programmable slave addresses: 8 for PCF8574 (0x20-0x27), 8 for PCF8574A (0x38-0x3F)
Features:
- I2C-bus to parallel port expander
- 100 kHz I2C-bus interface (Standard-mode I2C-bus)
- Operating supply voltage 2.5 V to 6 V with non-overvoltage tolerant I/O held to VDD with 100 μA current source
- 8-bit remote I/O pins that default to inputs at power-up
- Latched outputs directly drive LEDs
- Total package sink capability of 80 mA
- Active LOW open-drain interrupt output
- Eight programmable slave addresses using three address pins
- Low standby current (2.5 μA typical)
- -40 °C to +85 °C operation
- ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per JESD22-C101
- Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
Applications:
- LED signs and displays
- Servers
- Key pads
- Industrial control
- Medical equipment
- PLC
- Cellular telephones
- Mobile devices
- Gaming machines
- Instrumentation and test measurement
Package:
- DIP16 (16 leads (300 mil))
- SO16 (16 leads; body width 7.5 mm)
- SSOP20 (20 leads; body width 4.4 mm)
Features
- I 2 C-bus to parallel port expander
- 100 kHz I 2 C-bus interface (Standard-mode I 2 C-bus)
- Operating supply voltage 2.5 V to 6 V with non-overvoltage tolerant I/O held to VDD with 100 A current source
- 8-bit remote I/O pins that default to inputs at power-up
- Latched outputs directly drive LEDs
- Total package sink capability of 80 mA
- Active LOW open-drain interrupt output
- Eight programmable slave addresses using three address pins
- Low standby current (2.5 A typical)
- 40 C to +85 C operation
- ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per JESD22-C101
Product data sheet
Applications
- LED signs and displays
- Servers
- Key pads
- Industrial control
- Medical equipment
- PLC
- Cellular telephones
- Mobile devices
- Gaming machines
- Instrumentation and test measurement
Pin Configuration
Table 3. Pin description
| Symbol | Pin | Pin | Description |
|---|---|---|---|
| Symbol | DIP16, SO16 | SSOP20 | Description |
| A0 | 1 | 6 | address input 0 |
| A1 | 2 | 7 | address input 1 |
| A2 | 3 | 9 | address input 2 |
| P0 | 4 | 10 | quasi-bidirectional I/O 0 |
| P1 | 5 | 11 | quasi-bidirectional I/O 1 |
| P2 | 6 | 12 | quasi-bidirectional I/O 2 |
| P3 | 7 | 14 | quasi-bidirectional I/O 3 |
| V SS | 8 | 15 | supply ground |
| P4 | 9 | 16 | quasi-bidirectional I/O 4 |
| P5 | 10 | 17 | quasi-bidirectional I/O 5 |
| P6 | 11 | 19 | quasi-bidirectional I/O 6 |
| P7 | 12 | 20 | quasi-bidirectional I/O 7 |
| INT | 13 | 1 | interrupt output (active LOW) |
| SCL | 14 | 2 | serial clock line |
| SDA | 15 | 4 | serial data line |
| V DD | 16 | 5 | supply voltage |
| n.c. | - | 3, 8, 13, 18 | not connected |
Thermal Information
| Table 8. | Thermal characteristics | Thermal characteristics | Thermal characteristics | Thermal characteristics |
|---|---|---|---|---|
| Symbol | Parameter | Conditions | Typ | Unit |
| R th(j-a) | thermal resistance from junction to ambient | SO16 package | 115 | C/W |
| SSOP20 package | 136 | C/W |
Package Information
DIP16: plastic dual in-line package; 16 leads (300 mil)
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| PCF8574 | NXP Semiconductors | — |
| PCF8574/3 | NXP Semiconductors | — |
| PCF8574/74AS | NXP Semiconductors | — |
| PCF8574A | NXP Semiconductors | — |
| PCF8574AP | NXP Semiconductors | — |
| PCF8574AT | NXP Semiconductors | — |
| PCF8574AT/3 | NXP Semiconductors | — |
| PCF8574ATS | NXP Semiconductors | — |
| PCF8574ATS/3 | NXP Semiconductors | — |
| PCF8574P | NXP Semiconductors | — |
| PCF8574T | NXP Semiconductors | — |
| PCF8574T/3 | NXP Semiconductors | — |
| PCF8574TS | NXP Semiconductors | — |
| PCF8574TS/3 | NXP Semiconductors | — |
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