PAC1710/20

Part: PAC1710-1-AIA-TR — Microchip Technology

Type: High-Side Current-Sense Monitor with Power Calculation

Description: Single-channel (PAC1710) high-side bidirectional current-sense monitor with 0–40 V source voltage range, 3.0–5.5 V supply, programmable ±10 to ±80 mV sense range, SMBus 2.0 interface, and power calculation in a 10-lead 3 x 3 mm VDFN.

Operating Conditions:

• Supply voltage (VDD): 3.0–5.5 V
• Operating temperature: -40 to +85 °C
• VSOURCE (SENSE+) voltage range: 0–40 V
• SMBus clock frequency: 10–400 kHz

Absolute Maximum Ratings:

• VDD pin: -0.3 to 6.0 V
• SENSE+ and SENSE- pins: -42 to 42 V
• Voltage between sense pins |SENSE+ − SENSE-|: 40 V
• Voltage on any other pin to GND: -0.3 V to VDD + 0.3 V
• Input current to any pin except VDD: ±10 mA
• Storage temperature: -55 to 150 °C
• ESD HBM: 8000 V (SMCLK, SMDATA, ALERT); 2000 V (all other pins)

Key Specs:

• Supply current (PAC1710), continuous conversions: 360 μA typ, 900 μA max
• Supply current (PAC1710), one conversion per second: 10 μA typ, 35 μA max
• Standby current: 5.5 μA typ, 15 μA max
• Current-sense total error (positive range, FSR 0 to +80 mV): ±0.2% FSR typ, ±0.4% FSR max
• Current-sense total error (positive range, FSR 0 to +10 mV): ±0.5% FSR typ, ±1% FSR max
• Offset error voltage (referred to input): ±15 μV typ (FSR ±10 mV), ±40 μV typ (FSR ±80 mV)
• VSOURCE measurement error: ±0.15% FSV typ, ±0.3% FSV max
• Common-mode rejection: 100 dB typ, 80 dB min (0 V < VSOURCE < 40 V)
• Current-sense resolution: 11-bit; LSB 4.885 μV (±10 mV) to 39.08 μV (±80 mV)
• Time to first communications: 25 ms max

Features:

• Single high-side bidirectional current sensor with VSOURCE voltage measurement and power calculation
• Current measurement integrated over 2.5 ms to 2.6 s with up to 11-bit resolution
• Programmable sense range: ±10, ±20, ±40, ±80 mV
• Auto-zero input offset voltage and digital averaging
• Adjustable sampling time (2.5 ms to 320 ms) and resolution
• ALERT output for voltage and current limit violations between sampling intervals
• SMBus 2.0 interface with block read/write; address selectable by resistor decode
• 5 μA typical standby current

Applications:

• Notebook and desktop computers
• Industrial
• Power management systems
• Embedded applications
• Servers

Package:

• 10-lead VDFN, 3 x 3 mm (RoHS compliant)

• Single and Dual High-Side Current Sensor
• -Current measurement is integrated over 2.5 ms to 2.6 seconds with up to 11-bit resolution
• -1% current measurement accuracy in positive range
• -Measures V SOURCE voltages
• Calculates Power
• VSOURCE Voltage Range 0V to 40V
• Bidirectional Current Sensing
• Auto-Zero Input Offset Voltage
• Digital Averaging
• -Adjustable sampling time and resolution
• 5 μA Typical Standby Current
• Programmable Sense Voltage Range
• -±10 mV, ±20 mV, ±40 mV, and ±80 mV
• Power Supply Range 3.0V to 5.5V
• Wide Temperature Operating Range: -40°C to +85°C
• ALERT Output for Voltage and Current out of Limit Transients Between Sampling Interval
• SMBus 2.0 Communications Interface
• -Block Read and Block Write
• -Address selectable by resistor decode
• Sample Time Configurable from 2.5 ms to 320 ms
• -With averaging effective sampling times up to 2.6 seconds
• 10-Lead 3 x 3 mm VDFN package

• Notebook and Desktop Computers
• Industrial
• Power Management Systems
• Embedded Applications
• Servers

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN DESCRIPTIONS

† Notice : Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability.

Note: The Package Power Dissipation specification assumes a recommended thermal via design consisting of a 2 x 3 matrix of 0.3 mm (12 mil) vias at 0.9 mm pitch connected to the ground plane with a 1.6 mm x 2.3 mm thermal landing.

This pad should be connected to ground for noise immunity.

NOTES: