NTMD4184P
P-Channel MOSFET with Integrated Schottky DiodeThe NTMD4184P is a p-channel mosfet with integrated schottky diode from UNI-ROYAL. View the full NTMD4184P datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
UNI-ROYAL
Category
P-Channel MOSFET with Integrated Schottky Diode
Overview
Part: NTMD4184PFR2G — onsemi
Type: P-Channel MOSFET with Integrated Schottky Diode
Description: -30 V, -4.0 A P-Channel MOSFET with an integrated 20 V, 2.2 A Schottky diode in a surface mount package.
Operating Conditions:
- Operating temperature: -55 to +150 °C
Absolute Maximum Ratings:
- Max Drain-to-Source Voltage (MOSFET): -30 V
- Max Gate-to-Source Voltage (MOSFET): 20 V
- Max Peak Repetitive Reverse Voltage (Schottky): 20 V
- Max continuous Drain Current (MOSFET): -4.0 A (t < 10 s, T A = 25 °C)
- Max Average Rectified Forward Current (Schottky): 2.2 A (Steady State)
- Max Junction and Storage Temperature: -55 to +150 °C
Key Specs:
- Drain-to-Source Breakdown Voltage V(BR)DSS: -30 V (min, V GS = 0 V, I D = 250 μA)
- Drain-to-Source On Resistance R DS(on): 95 mΩ (max, V GS = -10 V, I D = -3.0 A)
- Gate Threshold Voltage V GS(TH): -1.0 V (min) to -3.0 V (max, V GS = V DS , I D = 250 μA)
- Total Gate Charge Q G(TOT): 8.8 nC (max, V GS = -10 V, V DS = -10 V, I D = -3.0 A)
- Input Capacitance C ISS: 360 pF (max, V GS = 0 V, V DS = -10 V, f = 1.0 MHz)
- Maximum Instantaneous Forward Voltage V F (Schottky): 0.58 V (max, I F = 2.0 A, T J = 25 °C)
- Maximum Instantaneous Reverse Current I R (Schottky): 0.05 mA (max, V R = 20 V, T J = 25 °C)
- Turn-On Delay Time t d(ON): 15 ns (max, V GS = -10 V, V DS = -10 V, I D = -1.0 A, R G = 6.0 Ω)
Features:
- FETKY Surface Mount Package Saves Board Space
- Independent Pin-Out for MOSFET and Schottky Allowing for Design Flexibility
- Low R DS(on) MOSFET and Low V F Schottky to Minimize Conduction Losses
- Optimized Gate Charge to Minimize Switching Losses
- Pb-Free Device
Applications:
- Disk Drives
- DC-DC Converters
- Printers
Package:
- SOIC-8 NB
Features
- FETKY t Surface Mount Package Saves Board Space
- Independent Pin -Out for MOSFET and Schottky Allowing for Design Flexibility
- Low RDS(on) MOSFET and Low VF Schottky to Minimize Conduction Losses
- Optimized Gate Charge to Minimize Switching Losses
- This is a Pb -Free Device
Pin Configuration
4184P = Device Code
A
= Assembly Location
Y = Year
WW
= Work Week
G
= Pb - Free Package
Electrical Characteristics
| Characteristic | Symbol | Test Condition | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|
| OFF CHARACTERISTICS | |||||||
| Drain - to - Source Breakdown Voltage | V (BR)DSS | V GS = 0 V, I D = 250 m A | V GS = 0 V, I D = 250 m A | - 30 | V | ||
| Drain - to - Source Breakdown Voltage Temperature Coefficient | V (BR)DSS /T J | 30 | mV/ C | ||||
| Zero Gate Voltage Drain Current | I DSS | V GS = 0 V, V DS = - 24 V | T J = 25 C | - 1.0 | m A | ||
| Zero Gate Voltage Drain Current | I DSS | V GS = 0 V, V DS = - 24 V | T J = 125 C | - 10 | m A | ||
| Gate - to - Source Leakage Current | I GSS | V DS = 0 V, V GS = 20 V | V DS = 0 V, V GS = 20 V | 100 | nA | ||
| ON CHARACTERISTICS (Note 3) | |||||||
| Gate Threshold Voltage | V GS(TH) | V GS = V DS , I D = 250 m A | V GS = V DS , I D = 250 m A | - 1.0 | - 3.0 | V | |
| Negative Threshold Temperature Coefficient | V GS(TH) /T J | 4.4 | mV/ C | ||||
| Drain - to - Source On Resistance | R DS(on) | V GS = - 10 V | I D = - 3.0 A | 70 | 95 | m W | |
| Drain - to - Source On Resistance | R DS(on) | V GS = - 4.5 V | I D = - 1.5 A | 120 | 165 | m W | |
| Forward Transconductance | g FS | V DS = - 1.5 V, I D = - 3.0 A | V DS = - 1.5 V, I D = - 3.0 A | 5.0 | S | ||
| CHARGES, CAPACITANCES AND GATE RESISTANCE | CHARGES, CAPACITANCES AND GATE RESISTANCE | ||||||
| Input Capacitance | C ISS | 280 | 360 | pF | |||
| Output Capacitance | C OSS | V GS = 0 V, f = 1.0 MHz, | V GS = 0 V, f = 1.0 MHz, | 80 | 110 | pF | |
| Reverse Transfer Capacitance | C RSS | V DS = - 10 V | V DS = - 10 V | 52 | 80 | pF | |
| Total Gate Charge | Q G(TOT) | 2.8 | 4.2 | nC | |||
| Threshold Gate Charge | Q G(TH) | V = - 4.5 V, V = - 10 V, | V = - 4.5 V, V = - 10 V, | 0.4 | nC | ||
| Gate - to - Source Charge | Q GS | GS DS I D = - 3.0 A | GS DS I D = - 3.0 A | 1.1 | nC | ||
| Gate - to - Drain Charge | Q GD | 1.1 | nC | ||||
| Total Gate Charge | Q G(TOT) | V GS = - 10 V, V DS = - 10 V, I D = - 3.0 A | V GS = - 10 V, V DS = - 10 V, I D = - 3.0 A | 5.8 | 8.8 | nC | |
| SWITCHING CHARACTERISTICS (Note 4) | |||||||
| Turn - On Delay Time | t d(ON) | 7.2 | 15 | ns | |||
| Rise Time | t r | V GS = - 10 V, V DS = - 10 V, | V GS = - 10 V, V DS = - 10 V, | 12 | 24 | ns | |
| Turn - Off Delay Time | t d(OFF) | I D = - 1.0 A, R G = 6.0 W | I D = - 1.0 A, R G = 6.0 W | 18 | 36 | ns | |
| Fall Time | t f | 2.6 | 6.0 | ns | |||
| DRAIN - TO - SOURCE CHARACTERISTICS | |||||||
| Forward Diode Voltage | V SD | V GS = 0 V | T J = 25 C | - 0.8 | - 1.0 | V | |
| Forward Diode Voltage | V SD | I D = - 1.3A | T J = 125 C | 0.7 | |||
| Reverse Recovery Time | t RR | 12.8 | ns | ||||
| Charge Time | t a | V = 0 V, d /d = 100 A/ m s, | V = 0 V, d /d = 100 A/ m s, | 10 | |||
| Discharge Time | t b | GS IS t I S = - 1.3A | GS IS t I S = - 1.3A | 2.8 | |||
| Reverse Recovery Time | Q RR | 7.4 | nC |
ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted) (continued)
| Characteristic | Symbol | Test Condition | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|
| SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted) | SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted) | SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted) | SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted) | SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted) | SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted) | SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted) | SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted) |
| Parameter | Symbol | Test Conditions | Test Conditions | Min | Typ | Max | Unit |
| Maximum Instantaneous Forward Voltage | V F | I F = 1.0 A | T J = 25 C | 0.43 | 0.50 | V | |
| Maximum Instantaneous Forward Voltage | V F | T J = 125 C | 0.35 | 0.39 | |||
| Maximum Instantaneous Forward Voltage | V F | I F = 2.0 A | T J = 25 C | 0.5 | 0.58 | ||
| Maximum Instantaneous Forward Voltage | V F | T J = 125 C | 0.45 | 0.53 | |||
| Maximum Instantaneous Reverse Current | I R | V R = 10 V | T J = 25 C | 0.001 | 0.02 | mA | |
| Maximum Instantaneous Reverse Current | I R | T J = 125 C | 1.2 | 14 | |||
| Maximum Instantaneous Reverse Current | I R | V R = 20 V | T J = 25 C | 0.004 | 0.05 | ||
| Maximum Instantaneous Reverse Current | I R | T J = 125 C | 2.0 | 18 |
- Pulse Test: pulse width v 300 m s, duty cycle v 2%.
- Switching characteristics are independent of operating junction temperatures.
Absolute Maximum Ratings
| Rating | Rating | Rating | Symbol | Value | Unit |
|---|---|---|---|---|---|
| Drain - to - Source Voltage | Drain - to - Source Voltage | Drain - to - Source Voltage | V DSS | - 30 | V |
| Gate - to - Source Voltage | Gate - to - Source Voltage | Gate - to - Source Voltage | V GS | 20 | V |
| Continuous Drain Current R q JA (Note 1) | T A = 25 C | I D | - 3.3 | A | |
| Continuous Drain Current R q JA (Note 1) | T A = 70 C | I D | - 2.6 | A | |
| Power Dissipation R q JA (Note 1) | T A = 25 C | P D | 1.6 | W | |
| Continuous Drain Current R q JA (Note 2) | T A = 25 C | I D | - 2.3 | A | |
| Continuous Drain Current R q JA (Note 2) | T A = 70 C | I D | - 1.8 | A | |
| Power Dissipation R q JA (Note 2) | T A = 25 C | P D | 0.77 | W | |
| Continuous Drain Current R q JA t < 10 s (Note 1) | T A = 25 C | I D | - 4.0 | A | |
| Continuous Drain Current R q JA t < 10 s (Note 1) | T A = 70 C | I D | - 3.2 | A | |
| Power Dissipation R q JA t < 10 s (Note 1) | T A = 25 C | P D | 2.31 | W | |
| Pulsed Drain Current | T A = 25 C, t p = 10 m s | T A = 25 C, t p = 10 m s | I DM | - 10 | A |
| Operating Junction and Storage Temperature | Operating Junction and Storage Temperature | Operating Junction and Storage Temperature | T J , T STG | - 55 to +150 | C |
| Source Current (Body Diode) | Source Current (Body Diode) | Source Current (Body Diode) | I S | - 1.3 | A |
| Lead Temperature for Soldering Purposes (1/8 from case for 10 s) | Lead Temperature for Soldering Purposes (1/8 from case for 10 s) | Lead Temperature for Soldering Purposes (1/8 from case for 10 s) | T L | 260 | C |
Thermal Information
| Parameter MOSFET & Schottky | Symbol | Max | Unit |
|---|---|---|---|
| Junction - to - Ambient - Steady State (Note 1) | R q JA | 79 | C/W |
| Junction - to - Ambient - t 10 s Steady State (Note 1) | R q JA | 54 | C/W |
| Junction - to - FOOT (Drain) Equivalent to R q JC | R q JF | 50 | C/W |
| Junction - to - Ambient - Steady State (Note 2) | R q JA | 163 | C/W |
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| C4184 | UNI-ROYAL | SOIC-8 |
| NTMD4184PFR2G | UNI-ROYAL | SOIC - 8 (Pb - Free) |
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