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NTMD4184P

P-Channel MOSFET with Integrated Schottky Diode

The NTMD4184P is a p-channel mosfet with integrated schottky diode from UNI-ROYAL. View the full NTMD4184P datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

UNI-ROYAL

Category

P-Channel MOSFET with Integrated Schottky Diode

Overview

Part: NTMD4184PFR2G — onsemi

Type: P-Channel MOSFET with Integrated Schottky Diode

Description: -30 V, -4.0 A P-Channel MOSFET with an integrated 20 V, 2.2 A Schottky diode in a surface mount package.

Operating Conditions:

  • Operating temperature: -55 to +150 °C

Absolute Maximum Ratings:

  • Max Drain-to-Source Voltage (MOSFET): -30 V
  • Max Gate-to-Source Voltage (MOSFET): 20 V
  • Max Peak Repetitive Reverse Voltage (Schottky): 20 V
  • Max continuous Drain Current (MOSFET): -4.0 A (t < 10 s, T A = 25 °C)
  • Max Average Rectified Forward Current (Schottky): 2.2 A (Steady State)
  • Max Junction and Storage Temperature: -55 to +150 °C

Key Specs:

  • Drain-to-Source Breakdown Voltage V(BR)DSS: -30 V (min, V GS = 0 V, I D = 250 μA)
  • Drain-to-Source On Resistance R DS(on): 95 mΩ (max, V GS = -10 V, I D = -3.0 A)
  • Gate Threshold Voltage V GS(TH): -1.0 V (min) to -3.0 V (max, V GS = V DS , I D = 250 μA)
  • Total Gate Charge Q G(TOT): 8.8 nC (max, V GS = -10 V, V DS = -10 V, I D = -3.0 A)
  • Input Capacitance C ISS: 360 pF (max, V GS = 0 V, V DS = -10 V, f = 1.0 MHz)
  • Maximum Instantaneous Forward Voltage V F (Schottky): 0.58 V (max, I F = 2.0 A, T J = 25 °C)
  • Maximum Instantaneous Reverse Current I R (Schottky): 0.05 mA (max, V R = 20 V, T J = 25 °C)
  • Turn-On Delay Time t d(ON): 15 ns (max, V GS = -10 V, V DS = -10 V, I D = -1.0 A, R G = 6.0 Ω)

Features:

  • FETKY Surface Mount Package Saves Board Space
  • Independent Pin-Out for MOSFET and Schottky Allowing for Design Flexibility
  • Low R DS(on) MOSFET and Low V F Schottky to Minimize Conduction Losses
  • Optimized Gate Charge to Minimize Switching Losses
  • Pb-Free Device

Applications:

  • Disk Drives
  • DC-DC Converters
  • Printers

Package:

  • SOIC-8 NB

Features

  • FETKY t Surface Mount Package Saves Board Space
  • Independent Pin -Out for MOSFET and Schottky Allowing for Design Flexibility
  • Low RDS(on) MOSFET and Low VF Schottky to Minimize Conduction Losses
  • Optimized Gate Charge to Minimize Switching Losses
  • This is a Pb -Free Device

Pin Configuration

4184P = Device Code

A

= Assembly Location

Y = Year

WW

= Work Week

G

= Pb - Free Package

Electrical Characteristics

CharacteristicSymbolTest ConditionTest ConditionMinTypMaxUnit
OFF CHARACTERISTICS
Drain - to - Source Breakdown VoltageV (BR)DSSV GS = 0 V, I D = 250 m AV GS = 0 V, I D = 250 m A- 30V
Drain - to - Source Breakdown Voltage Temperature CoefficientV (BR)DSS /T J30mV/ C
Zero Gate Voltage Drain CurrentI DSSV GS = 0 V, V DS = - 24 VT J = 25 C- 1.0m A
Zero Gate Voltage Drain CurrentI DSSV GS = 0 V, V DS = - 24 VT J = 125 C- 10m A
Gate - to - Source Leakage CurrentI GSSV DS = 0 V, V GS = 20 VV DS = 0 V, V GS = 20 V100nA
ON CHARACTERISTICS (Note 3)
Gate Threshold VoltageV GS(TH)V GS = V DS , I D = 250 m AV GS = V DS , I D = 250 m A- 1.0- 3.0V
Negative Threshold Temperature CoefficientV GS(TH) /T J4.4mV/ C
Drain - to - Source On ResistanceR DS(on)V GS = - 10 VI D = - 3.0 A7095m W
Drain - to - Source On ResistanceR DS(on)V GS = - 4.5 VI D = - 1.5 A120165m W
Forward Transconductanceg FSV DS = - 1.5 V, I D = - 3.0 AV DS = - 1.5 V, I D = - 3.0 A5.0S
CHARGES, CAPACITANCES AND GATE RESISTANCECHARGES, CAPACITANCES AND GATE RESISTANCE
Input CapacitanceC ISS280360pF
Output CapacitanceC OSSV GS = 0 V, f = 1.0 MHz,V GS = 0 V, f = 1.0 MHz,80110pF
Reverse Transfer CapacitanceC RSSV DS = - 10 VV DS = - 10 V5280pF
Total Gate ChargeQ G(TOT)2.84.2nC
Threshold Gate ChargeQ G(TH)V = - 4.5 V, V = - 10 V,V = - 4.5 V, V = - 10 V,0.4nC
Gate - to - Source ChargeQ GSGS DS I D = - 3.0 AGS DS I D = - 3.0 A1.1nC
Gate - to - Drain ChargeQ GD1.1nC
Total Gate ChargeQ G(TOT)V GS = - 10 V, V DS = - 10 V, I D = - 3.0 AV GS = - 10 V, V DS = - 10 V, I D = - 3.0 A5.88.8nC
SWITCHING CHARACTERISTICS (Note 4)
Turn - On Delay Timet d(ON)7.215ns
Rise Timet rV GS = - 10 V, V DS = - 10 V,V GS = - 10 V, V DS = - 10 V,1224ns
Turn - Off Delay Timet d(OFF)I D = - 1.0 A, R G = 6.0 WI D = - 1.0 A, R G = 6.0 W1836ns
Fall Timet f2.66.0ns
DRAIN - TO - SOURCE CHARACTERISTICS
Forward Diode VoltageV SDV GS = 0 VT J = 25 C- 0.8- 1.0V
Forward Diode VoltageV SDI D = - 1.3AT J = 125 C0.7
Reverse Recovery Timet RR12.8ns
Charge Timet aV = 0 V, d /d = 100 A/ m s,V = 0 V, d /d = 100 A/ m s,10
Discharge Timet bGS IS t I S = - 1.3AGS IS t I S = - 1.3A2.8
Reverse Recovery TimeQ RR7.4nC

ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted) (continued)

CharacteristicSymbolTest ConditionTest ConditionMinTypMaxUnit
SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted)SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted)SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted)SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted)SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted)SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted)SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted)SCHOTTKY DIODE ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted)
ParameterSymbolTest ConditionsTest ConditionsMinTypMaxUnit
Maximum Instantaneous Forward VoltageV FI F = 1.0 AT J = 25 C0.430.50V
Maximum Instantaneous Forward VoltageV FT J = 125 C0.350.39
Maximum Instantaneous Forward VoltageV FI F = 2.0 AT J = 25 C0.50.58
Maximum Instantaneous Forward VoltageV FT J = 125 C0.450.53
Maximum Instantaneous Reverse CurrentI RV R = 10 VT J = 25 C0.0010.02mA
Maximum Instantaneous Reverse CurrentI RT J = 125 C1.214
Maximum Instantaneous Reverse CurrentI RV R = 20 VT J = 25 C0.0040.05
Maximum Instantaneous Reverse CurrentI RT J = 125 C2.018
  1. Pulse Test: pulse width v 300 m s, duty cycle v 2%.
  2. Switching characteristics are independent of operating junction temperatures.

Absolute Maximum Ratings

RatingRatingRatingSymbolValueUnit
Drain - to - Source VoltageDrain - to - Source VoltageDrain - to - Source VoltageV DSS- 30V
Gate - to - Source VoltageGate - to - Source VoltageGate - to - Source VoltageV GS20V
Continuous Drain Current R q JA (Note 1)T A = 25 CI D- 3.3A
Continuous Drain Current R q JA (Note 1)T A = 70 CI D- 2.6A
Power Dissipation R q JA (Note 1)T A = 25 CP D1.6W
Continuous Drain Current R q JA (Note 2)T A = 25 CI D- 2.3A
Continuous Drain Current R q JA (Note 2)T A = 70 CI D- 1.8A
Power Dissipation R q JA (Note 2)T A = 25 CP D0.77W
Continuous Drain Current R q JA t < 10 s (Note 1)T A = 25 CI D- 4.0A
Continuous Drain Current R q JA t < 10 s (Note 1)T A = 70 CI D- 3.2A
Power Dissipation R q JA t < 10 s (Note 1)T A = 25 CP D2.31W
Pulsed Drain CurrentT A = 25 C, t p = 10 m sT A = 25 C, t p = 10 m sI DM- 10A
Operating Junction and Storage TemperatureOperating Junction and Storage TemperatureOperating Junction and Storage TemperatureT J , T STG- 55 to +150C
Source Current (Body Diode)Source Current (Body Diode)Source Current (Body Diode)I S- 1.3A
Lead Temperature for Soldering Purposes (1/8 from case for 10 s)Lead Temperature for Soldering Purposes (1/8 from case for 10 s)Lead Temperature for Soldering Purposes (1/8 from case for 10 s)T L260C

Thermal Information

Parameter MOSFET & SchottkySymbolMaxUnit
Junction - to - Ambient - Steady State (Note 1)R q JA79C/W
Junction - to - Ambient - t 10 s Steady State (Note 1)R q JA54C/W
Junction - to - FOOT (Drain) Equivalent to R q JCR q JF50C/W
Junction - to - Ambient - Steady State (Note 2)R q JA163C/W

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
C4184UNI-ROYALSOIC-8
NTMD4184PFR2GUNI-ROYALSOIC - 8 (Pb - Free)
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