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MCP2515-I/SOVAO

The MCP2515-I/SOVAO is an electronic component from Microchip Technology. View the full MCP2515-I/SOVAO datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Manufacturer

Microchip Technology

Package

18-SOIC (0.295", 7.50mm Width)

Key Specifications

ParameterValue
Quiescent Current10mA
DigiKey ProgrammableNot Verified
FunctionController
GradeAutomotive
InterfaceSPI
Operating Temperature-40°C ~ 85°C (TA)
Package / Case18-SOIC (0.295\", 7.50mm Width)
ProtocolCANbus
QualificationAEC-Q100
StandardsCAN 2.0
Supplier Device Package18-SOIC
Supply Voltage2.7V ~ 5.5V

Overview

Part: MCP2515 from Microchip Technology

Type: Stand-Alone CAN Controller

Description: The MCP2515 is a stand-alone CAN controller implementing CAN specification 2.0B at up to 1 Mb/s, featuring two receive buffers, six filters, two masks, three transmit buffers, and an SPI interface.

Operating Conditions:

  • Supply voltage: 2.7V-5.5V
  • Operating temperature: -40°C to +125°C (Extended)
  • Max CAN speed: 1 Mb/s
  • Max SPI interface speed: 10 MHz

Absolute Maximum Ratings:

Key Specs:

  • CAN specification: V2.0B
  • Max CAN data length: 0 to 8-byte
  • SPI interface speed: 10 MHz
  • Active current (typical): 5 mA
  • Standby current (typical): 1 μA (Sleep mode)
  • Number of receive buffers: 2
  • Number of transmit buffers: 3
  • Number of acceptance filters: 6 (29-bit)
  • Number of acceptance masks: 2 (29-bit)

Features:

  • Implements CAN V2.0B at 1 Mb/s
  • Two receive buffers with prioritized message storage
  • Six 29-bit filters and two 29-bit masks
  • Three transmit buffers with prioritization and abort features
  • High-Speed SPI Interface (10 MHz)
  • Low-Power CMOS Technology (2.7V-5.5V operation)

Applications:

Package:

  • PDIP
  • SOIC
  • TSSOP
  • QFN

Features

  • Implements CAN V2.0B at 1 Mb/s:
  • -0 to 8-byte length in the data field
  • -Standard and extended data and remote frames
  • Receive Buffers, Masks and Filters:
  • -Two receive buffers with prioritized message storage
  • -Six 29-bit filters
  • -Two 29-bit masks
  • Data Byte Filtering on the First Two Data Bytes (applies to standard data frames)
  • Three Transmit Buffers with Prioritization and Abort Features
  • High-Speed SPI Interface (10 MHz):
  • -SPI modes 0,0 and 1,1
  • One-Shot mode Ensures Message Transmission is Attempted Only One Time
  • Clock Out Pin with Programmable Prescaler:
  • -Can be used as a clock source for other device(s)
  • Start-of-Frame (SOF) Signal is Available for Monitoring the SOF Signal:
  • -Can be used for time slot-based protocols and/or bus diagnostics to detect early bus degradation
  • Interrupt Output Pin with Selectable Enables
  • Buffer Full Output Pins Configurable as:
  • -Interrupt output for each receive buffer
  • -General purpose output
  • Request-to-Send (RTS) Input Pins Individually Configurable as:
  • -Control pins to request transmission for each transmit buffer
  • -General purpose inputs
  • Low-Power CMOS Technology:
  • -Operates from 2.7V-5.5V
  • -5 mA active current (typical)
  • -1 μ A standby current (typical) (Sleep mode)
  • Temperature Ranges Supported:
  • -Industrial (I): -40°C to +85°C
  • -Extended (E): -40°C to +125°C

NOTES:

Pin Configuration

Note 1: The diode, D, helps discharge the capacitor quickly when V DD powers down.

  • 2: R1 = 1 k  to 10 k  will limit any current flowing into RESET from the external capacitor, C, in the event of RESET pin breakdown due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS).

NOTES:

Electrical Characteristics

Note 1: This parameter is periodically sampled and not 100% tested.

DC CharacteristicsDC CharacteristicsDC CharacteristicsV DD = 2.7V to 5.5VV DD = 2.7V to 5.5VIndustrial (I): T AMB = -40°C to +85°C Extended (E): T AMB = -40°C to +125°CIndustrial (I): T AMB = -40°C to +85°C Extended (E): T AMB = -40°C to +125°C
Param. No.SymCharacteristicMinMaxUnitsConditions
V DDSupply Voltage2.75.5V
V RETRegister Retention Voltage2.4-V
V IHHigh-Level Input Voltage RXCAN Pin SCK, CS, SI, TXnRTS Pins OSC1 Pin RESET Pin2 0.7 V DD 0.85 V DD 0.85 V DDV DD + 1 V DD + 1 V DD V DDV V V V
V ILLow-Level Input Voltage RXCAN, TXnRTS Pins SCK, CS, SI Pins OSC1 Pin RESET Pin-0.3 -0.3 V SS V SS0.15 * V DD 0.4 * V DD 0.3 * V DD 0.15 * V DDV V V V
V OLLow-Level Output Voltage TXCAN Pin RXnBF Pin SO, CLKOUT Pins- - - -0.6 0.6 0.6 0.6V V V VI OL = +6.0 mA, V DD = 4.5V I OL = +8.5 mA, V DD = 4.5V I OL = +2.1 mA, V DD = 4.5V I OL = +1.6 mA, V DD = 4.5V
V OHINT Pin High-Level Output Voltage TXCAN, RXnBF Pins SO, CLKOUT Pins INT PinV DD - 0.7 V DD - 0.5 V DD - 0.7- - -V V V VI OH = -3.0 mA, V DD = 4.5V I OH = -400 μ A, V DD = 4.5V I = -1.0 mA, V = 4.5V
I LIInput Leakage Current All I/Os except OSC1 and TXnRTS Pins-1+1μ A μ AOH DD CS = RESET = V DD , V IN = V SS to V DD
OSC1 Pin-5+5 7pF
C INT I DDInternal Capacitance (all inputs and outputs)
Operating Current
- -10
5
mAT AMB = +25°C, f C = 1.0 MHz, V DD = 0V (Note 1) V DD = 5.5V, F OSC = 25
MHz, F CLK = 1 MHz, SO = Open
I DDSStandby Current (Sleep mode)- -8μ A μ ACS, TXnRTS = V DD , inputs tied to V DD or V SS , -40°C TO +85°C CS, TXnRTS = V DD , inputs tied to V DD or V SS , -40°C TO +125°C

Absolute Maximum Ratings

  • All Inputs and Outputs w.r.t. V SS ....................................................................................................... -0.6V to V DD + 1.0V
  • Storage Temperature ..............................................................................................................................-65°C to +150°C
  • Ambient Temperature with Power Applied...............................................................................................-65°C to +125°C
  • Soldering Temperature of Leads (10 seconds) .....................................................................................................+300°C

† Notice: Stresses above those listed under 'Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

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