MCIMX7D3DVK10SD

Part: MCIMX7D3DVK10SD — NXP Semiconductors

Type: Arm Cortex-A7 / Cortex-M4 heterogeneous multicore applications processor (i.MX 7Dual family)

Description: Dual Arm Cortex-A7 (1 GHz) plus Cortex-M4 applications processor with up to 32-bit DDR3/DDR3L/LPDDR2/LPDDR3-1066 interface, 2x Gigabit Ethernet, and 1x 12-bit ADC, in a 12x12 mm 0.4 mm pitch BGA.

Operating Conditions:

• Operating temperature (Tj): 0 to +95 °C (Consumer tier, per Table 1 for this part number)
• Cortex-A7 CPU speed grade: 1 GHz

Absolute Maximum Ratings:

The provided absolute maximum ratings extract contains only MIPI DSI interface electrical limits and no supply voltage, current, or temperature ratings:

• DSI input signal voltage range: -50 to 1350 mV (transient range limited to -300 mV to 1600 mV)
• DSI ground shift: -50 to 50 mV
• DSI maximum transient output voltage level: 1.45 V (maximum transient time above this level: 20 ns)

Key Specs:

• CPU: two Cortex-A7 cores at 1 GHz, each with 32 KB L1 I-cache and 32 KB L1 D-cache, plus shared 512 KB L2 cache
• Cortex-M4 with FPU and MPU, 16 KB instruction cache, 16 KB data cache, 64 KB TCM
• On-chip memory: 96 KB boot ROM, 256 KB OCRAM, 32 KB secure RAM
• External memory: up to 32-bit LPDDR2/DDR3/DDR3L/LPDDR3-1066, NAND, NOR, QSPI
• Ethernet: 2x 10/100/1000 Mbps with IEEE 1588 and AVB
• USB: 2x HS OTG with PHY, 1x HS host with HSIC; PCIe 2.1 one lane
• ADC: one 2-channel 12-bit ADC (12x12 mm package; ENOB typically 9–10 bits)
• DSI HS transmit differential output voltage |VOD|: 140 / 200 / 270 mV (min/typ/max)

Features:

• Heterogeneous multicore: Linux/Android on Cortex-A7, RTOS on Cortex-M4
• NEON media processing engine and SDMA controller
• Three MMC/SD/SDIO ports (one supports HS400)
• Parallel 24-bit display port and MIPI-DSI; parallel camera port and MIPI-CSI
• Seven UARTs, four eCSPI, four I2C, three SAI, four PWM, quad SPI, 8x8 keypad port
• Security: TrustZone, CAAM, SNVS, CSU, HABv4, secure JTAG controller
• Integrated PMU with multiple LDOs and on-die temperature sensor
• This variant has no EPDC and no CAN, with 4 tamper pins

Applications:

• Audio
• Connected devices
• Access control panels
• Human-machine interfaces (HMI)
• Portable medical and health care
• IP phones
• Smart appliances
• Point of Sale
• eReaders
• Wearables
• Home energy management systems

Package:

• BGA 12 x 12 mm, 0.4 mm pitch (this part)
• BGA 19 x 19 mm, 0.75 mm pitch (other family variants)

The i.MX 7Dual family of processors is based on Arm Cortex-A7 MPCore™ Platform, which has the following features:

• Two Arm Cortex-A7 Cores (with TrustZone ® technology)

• The core configuration is symmetric, where each core includes:

• 32 KByte L1 Instruction Cache

• 32 KByte L1 Data Cache

• Private Timer and Watchdog

• NEON MPE (media processing engine) coprocessor

This section provides the device and module -level electrical characteristics for the i.MX 7Dual family of processors.

Table 8 displays the thermal resistance data.

Per JEDEC JESD51-2, the intent of thermal resistance measurements is solely for a thermal performance comparison of one package to another in a standardized environment. This methodology is not meant to and does not predict the performance of a package in an application-specific environment.

Table 8. Thermal Resistance Data

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

• 6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Plastic Package

BGA 12 x 12 mm, 0.4 mm pitch BGA 19 x 19 mm, 0.75 mm pitch