MCIMX7D2DVM12SD

Part: MCIMX7D2DVM12SD — NXP Semiconductors

Type: Arm Cortex-A7 / Cortex-M4 Heterogeneous Multicore Applications Processor

Description: i.MX 7Dual applications processor with two Arm Cortex-A7 cores at up to 1.2 GHz plus a Cortex-M4 core, 32-bit DDR3/DDR3L/LPDDR2/LPDDR3-1066 interface, in a 19x19 mm, 0.75 mm pitch BGA.

Operating Conditions:

• Supply voltage: not applicable (multiple supply rails; see datasheet tables)
• Operating temperature (Tj): 0 to 85 °C (consumer grade)
• Cortex-A7 CPU speed grade: 1.2 GHz
• External memory: up to 32-bit LPDDR2/DDR3/DDR3L/LPDDR3-1066

Absolute Maximum Ratings:

The provided absolute maximum ratings extract contains only MIPI DSI interface DC specifications; no chip-level supply voltage, current, or temperature ratings are available in it.

• DSI input signal voltage range: -50 to 1350 mV (transient range limited to -300 to 1600 mV)
• DSI ground shift: -50 to 50 mV
• DSI maximum transient output voltage level (VOH(absmax)): 1.45 V, for up to 20 ns

Key Specs:

• CPU: two Cortex-A7 cores (1.2 GHz grade) with 32 KB L1 I-cache and 32 KB L1 D-cache per core, and 512 KB shared L2 cache
• Cortex-M4 with FPU and MPU, 16 KB I-cache, 16 KB D-cache, and 64 KB TCM
• On-chip memory: 96 KB boot ROM, 256 KB OCRAM, 32 KB secure RAM
• Two 10/100/1000 Mbps Ethernet controllers with IEEE 1588 and AVB support
• USB: two HS USB 2.0 OTG with PHY and one HS USB 2.0 host with HSIC
• PCIe 2.1, one lane
• Two 12-bit ADCs (2 channels each) in the 19x19 package
• Three MMC/SD/SDIO ports, up to 208 MHz (SD/SDIO) and 200 MHz (MMC)

Features:

• Heterogeneous multicore: Linux/Android on Cortex-A7 and RTOS on Cortex-M4
• NEON media processing engine and TrustZone
• Parallel display port and two-lane MIPI-DSI; parallel camera port and two-lane MIPI-CSI
• Seven UARTs, four eCSPI, four I2C, three SAI, four PWM, one quad SPI, and four watchdog timers
• Security: CAAM crypto accelerator, SNVS, CSU, HAB v4, and System JTAG Controller
• Integrated PMU with multiple LDO regulators and an on-die temperature sensor
• This part: no EPDC and no CAN, 10 tamper pins

Applications:

• Audio
• Connected devices
• Access control panels
• Human-machine interfaces (HMI)
• Portable medical and health care
• IP phones
• Smart appliances
• Point of Sale
• eReaders
• Wearables
• Home energy management systems

Package:

• 19 x 19 mm BGA, 0.75 mm pitch (MCIMX7D2DVM12SD)

The i.MX 7Dual family of processors is based on Arm Cortex-A7 MPCore™ Platform, which has the following features:

• Two Arm Cortex-A7 Cores (with TrustZone ® technology)

• The core configuration is symmetric, where each core includes:

• 32 KByte L1 Instruction Cache

• 32 KByte L1 Data Cache

• Private Timer and Watchdog

• NEON MPE (media processing engine) coprocessor

This section provides the device and module -level electrical characteristics for the i.MX 7Dual family of processors.

Table 8 displays the thermal resistance data.

Per JEDEC JESD51-2, the intent of thermal resistance measurements is solely for a thermal performance comparison of one package to another in a standardized environment. This methodology is not meant to and does not predict the performance of a package in an application-specific environment.

Table 8. Thermal Resistance Data

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

• 6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Plastic Package

BGA 12 x 12 mm, 0.4 mm pitch BGA 19 x 19 mm, 0.75 mm pitch