MC74HC1G14

Part: MC74HC1G14 — onsemi

Type: Single Inverter with Schmitt-Trigger Input

Description: High speed CMOS inverter with Schmitt-Trigger input fabricated with silicon gate CMOS technology, providing high noise immunity and stable output, with 1/2 output drive current compared to MC74HC series.

Operating Conditions:

• Supply voltage: 2.0–6.0 V
• Operating temperature: -55 to +125 °C
• Input voltage: 0.0 to VCC V
• Output voltage: 0.0 to VCC V

Absolute Maximum Ratings:

• Max supply voltage: +6.5 V
• Max continuous current: ±12.5 mA
• Max junction/storage temperature: +150 °C

Key Specs:

• Positive Threshold Voltage (VT+): 3.0 V (Typ) at VCC = 4.5 V, TA = 25 °C
• Negative Threshold Voltage (VT-): 2.3 V (Typ) at VCC = 4.5 V, TA = 25 °C
• Hysteresis Voltage (VH): 0.67 V (Typ) at VCC = 4.5 V, TA = 25 °C
• High-Level Output Voltage (VOH): 4.18 V (Min) at VCC = 4.5 V, IOH = -2 mA, TA = 25 °C
• Low-Level Output Voltage (VOL): 0.26 V (Max) at VCC = 4.5 V, IOL = 2 mA, TA = 25 °C
• Quiescent Supply Current (ICC): 1.0 μA (Max) at VCC = 6.0 V, TA = 25 °C
• Propagation Delay (tPLH, tPHL): 7.5 ns (Typ) at VCC = 4.5 V, CL = 50 pF, TA = 25 °C
• Input Capacitance (CIN): 5 pF (Typ)

Features:

• Low Power Dissipation: ICC = 1 μA (Max) at TA = 25 °C
• High Speed: tPD = 7 ns (Typ) at VCC = 5 V
• High Noise Immunity
• Symmetrical Output Impedance (IOH = IOL = 2 mA)
• Balanced Propagation Delays (tPLH = tPHL)
• Chip Complexity: < 100 FETs
• Pb-Free, Halogen Free/BFR Free and RoHS Compliant

Package:

• SC-88A
• SC-74A

• Low Power Dissipation: ICC = 1 m A (Max) at T A = 25 ° C
• High Speed: t PD = 7 ns (Typ) at V CC = 5 V
• High Noise Immunity
• Symmetrical Output Impedance (IOH = IOL = 2 mA)
• Balanced Propagation Delays (t pLH = t pHL )
• Chip Complexity: < 100 FETs
• These Devices are Pb -Free, Halogen Free/BFR Free and are RoHS Compliant

Figure 1. Pinout

Figure 1. Pinout

Figure 2. Logic Symbol

Figure 2. Logic Symbol

SC

88A

DF SUFFIX

CASE 419A

SC -74A DBV SUFFIX CASE 318BQ

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm -by -1 inch, 20 ounce copper trace with no air flow per JESD51 -7.

2. HBM tested to ANSI/ESDA/JEDEC JS -001 -2017. CDM tested to JESD22 -C101 -F. JEDEC recommends that ESD qualification to EIA/JESD22 -A115A (Machine Model) be discontinued per JEDEC/JEP172A.

3. Tested to EIA/JESD78 Class II.

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.