MAX3232ECDWR.B
MAX3232E 3-V to 5.5-V Multichannel RS-232 Line Driver and Receiver With ±15-kV IEC ESD Protection
Manufacturer
Texas Instruments
Category
Integrated Circuits (ICs)
Overview
Part: MAX3232E, Texas Instruments
Type: 3-V to 5.5-V Multichannel RS-232 Line Driver and Receiver
Key Specs:
- VCC supply: 3-V to 5.5-V
- Data signaling rate: up to 250 kbit/s
- Supply current: 300 μA (typical)
- External capacitors: 4 × 0.1 μF
- Drivers: Two
- Receivers: Two
- ESD protection (HBM): ±15 kV
- ESD protection (IEC61000-4-2, Contact discharge): ±8 kV
- ESD protection (IEC61000-4-2, Air-gap discharge): ±15 kV
Features:
- ESD protection for RS-232 bus pins
- Meets or exceeds the requirements of TIA/ EIA-232-F and ITU V.28 standards
- Operates with 3-V to 5.5-V VCC supply
- Operates up to 250 kbit/s
- Two drivers and two receivers
- Low supply current: 300 μA (typical)
- External capacitors: 4 × 0.1 μF
- Accepts 5-V logic input with 3.3-V supply
- Pin compatible to alternative high-speed devices (1 Mbit/s)
Applications:
- Industrial PCs
- Wired networking
- Data center and enterprise computing
- Battery-powered systems
- Notebooks
- Palmtop PCs
- Hand-held equipment
Package:
- SOIC (D) (16): 9.90 mm × 3.91 mm
- SSOP (DB) (16): 6.20 mm × 5.30 mm
- SOIC (DW) (16): 10.30 mm × 7.50 mm
- TSSOP (PW) (16): 5.00 mm × 4.40 mm
Features
- ESD protection for RS-232 bus pins
- ±15 kV (HBM)
- ±8 kV (IEC61000-4-2, Contact discharge)
- ±15 kV (IEC61000-4-2, Air-gap discharge)
- Meets or exceeds the requirements of TIA/ EIA-232-F and ITU V.28 standards
- Operates with 3-V to 5.5-V VCC supply
- Operates up to 250 kbit/s
- Two drivers and two receivers
- Low supply current: 300 μA (typical)
- External capacitors: 4 × 0.1 μF
- Accepts 5-V logic input with 3.3-V supply
- Pin compatible to alternative high-speed devices (1 Mbit/s)
- SN65C3232E (–40°C to +85°C)
- SN75C3232E (0°C to 70°C)
Applications
Pin Configuration
Figure 5-1. D, DW, DB and PW Package, 16-Pin SOIC, SSOP and TSSOP, Top View
Table 5-1. Pin Functions
| PIN | |
|---|---|
| NAME | NO. |
| C1+ | 1 |
| V+ | 2 |
| C1– | 3 |
| C2+ | 4 |
| C2– | 5 |
| V– | 6 |
| DOUT2 | 7 |
| RIN2 | 8 |
| ROUT2 | 9 |
| DIN2 | 10 |
| DIN1 | 11 |
| ROUT1 | 12 |
| RIN1 | 13 |
| DOUT1 | 14 |
| GND | 15 |
| VCC | 16 |
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Typical Operating Circuit and Capacitor Values).
| PARAMETER | TEST CONDITIONS | MIN TYP(2) MAX | UNIT | ||
|---|---|---|---|---|---|
| ICC | Supply current | No load, VCC = 3.3 V or 5 V | 0.3 | 1 | mA |
- (1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
- (2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
| MIN | MAX | UNIT | ||||
|---|---|---|---|---|---|---|
| VCC | Supply voltage(2) | –0.3 | 6 | V | ||
| V+ | Positive output supply voltage(2) | –0.3 | 7 | V | ||
| V– | Negative output supply voltage(2) | 0.3 | –7 | V | ||
| V+ – V– | Supply voltage difference(2) | 13 | V | |||
| Drivers | –0.3 | 6 | V | |||
| VI | Input voltage | Receivers | –25 | 25 | V | |
| Drivers | –13.2 | 13.2 | V | |||
| VO | Output voltage | Receivers | –0.3 | VCC + 0.3 | V | |
| TJ | Operating virtual junction temperature | 150 | °C | |||
| Tstg | Storage temperature | –65 | 150 | °C |
(2) All voltages are with respect to network GND.
6.2 ESD Ratings
| VALUE | UNIT | ||||
|---|---|---|---|---|---|
| Human body model (HBM), per ANSI/ | All pins except RIN and DOUT | ±2000 | |||
| V(ESD) | Electrostatic discharge | ESDA/JEDEC JS-001(1) | RIN and DOUT Pins | ±15,000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | All pins | ±1500 |
Recommended Operating Conditions
See Typical Operating Circuit and Capacitor Values.
| MIN | NOM | MAX | UNIT | ||||
|---|---|---|---|---|---|---|---|
| VCC = 3.3 V | 3 | 3.3 | 3.6 | ||||
| Supply voltage | VCC = 5 V | 4.5 | 5 | 5.5 | V | ||
| DIN | VCC = 3.3 V | 2 | 5.5 | ||||
| VIH | Driver high-level input voltage | VCC = 5 V | 2.4 | ||||
| VIL | Driver low-level input voltage | DIN | 0 | 0.8 | V | ||
| VI | Receiver input voltage | RIN | –25 | 25 | V |
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Thermal Information
| MAX3232E | |||
|---|---|---|---|
| THERMAL METRIC(1) | PW (TSSOP) | D (SOIC) | |
| 16 PINS | 16 PINS | ||
| RθJA | Junction-to-ambient thermal resistance | 108.2 | 85.9 |
| RθJCtop | Junction-to-case (top) thermal resistance | 39.0 | 43.1 |
| RθJB | Junction-to-board thermal resistance | 54.4 | 44.5 |
| ψJT | Junction-to-top characterization parameter | 3.3 | 10.1 |
| ψJB | Junction-to-board characterization parameter | 53.8 | 44.1 |
| RθJCbot | Junction-to-case (bottom) thermal resistance | N/A | N/A |
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| MAX3232E | Texas Instruments | — |
| MAX3232E-Q1 | Texas Instruments | — |
| MAX3232E-Q1.HTML | Texas Instruments | — |
| MAX3232EC | Texas Instruments | — |
| MAX3232ECD | Texas Instruments | — |
| MAX3232ECDBR | Texas Instruments | — |
| MAX3232ECDBR.A | Texas Instruments | — |
| MAX3232ECDR | Texas Instruments | — |
| MAX3232ECDR.A | Texas Instruments | — |
| MAX3232ECDW | Texas Instruments | — |
| MAX3232ECDWR | Texas Instruments | — |
| MAX3232ECPWR | Texas Instruments | 16-TSSOP (0.173", 4.40mm Width) |
| MAX3232ECPWR.A | Texas Instruments | — |
| MAX3232EI | Texas Instruments | — |
| MAX3232EID | Texas Instruments | — |
| MAX3232EIDBR | Texas Instruments | — |
| MAX3232EIDBR.A | Texas Instruments | — |
| MAX3232EIDR | Texas Instruments | — |
| MAX3232EIDR.A | Texas Instruments | — |
| MAX3232EIDW | Texas Instruments | — |
| MAX3232EIDWR | Texas Instruments | — |
| MAX3232EIDWR.B | Texas Instruments | — |
| MAX3232EIPW | Texas Instruments | — |
| MAX3232EIPWR | Texas Instruments | — |
| MAX3232EIPWR.A | Texas Instruments | — |
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