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MAX20361AEWC+T

Solar Energy Harvester

The MAX20361AEWC+T is a solar energy harvester from Analog Devices Inc./Maxim Integrated. View the full MAX20361AEWC+T datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Manufacturer

Analog Devices Inc./Maxim Integrated

Category

Solar Energy Harvester

Package

12-WFBGA, WLBGA

Lifecycle

Active

Key Specifications

ParameterValue
ApplicationsEnergy Harvesting
Quiescent Current1.43µA
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C
Package / Case12-WFBGA, WLBGA
PackagingReel
Standard Pack Qty2500
Supplier Device Package12-WLP (1.63x1.23)
Supplier Device Package12-WLP (1.63x1.23)
Supply Voltage0V ~ 2.5V

Overview

Part: MAX20361AEWC+T — Maxim Integrated Type: Solar Energy Harvester with Boost Converter and Battery Charger Description: A fully integrated solution for harvesting energy from single-/multi-cell solar sources, featuring an ultra-low quiescent current (360 nA) boost converter capable of starting from 225 mV input, efficient harvesting from 15 μW to over 300 mW, and an integrated Li-ion battery charger with I2C programmable features.

Operating Conditions:

  • Supply voltage (SYS): +3.0V to +4.2V
  • Input operating voltage (SRC): 0V to 2.5V
  • Operating temperature: -40 °C to +85 °C

Absolute Maximum Ratings:

  • Max supply voltage (SYS, VCC): +6V
  • Max continuous current into LX, GND or SYS: ±0.5A
  • Max junction temperature: +150 °C
  • Max storage temperature: +150 °C

Key Specs:

  • SYS Sleep Supply Current: 360 nA (typ)
  • Minimum Cold-Start Voltage: 225 mV (typ, at TA = 25°C)
  • Boost Efficiency: 86% (typ, at V SRC = 0.75V, V SYS = 3.8V, I SRC = 30mA)
  • System Termination Voltage-Programmable Range: 4 to 4.7 V (50mV steps, programmable through I2C)
  • Fractional Open Circuit Voltage-Programmable Range: 42.5 to 89.0 % (1.5% steps, programmable through I2C)
  • LX Low-Side On Resistance: 0.1 Ω (typ)
  • LX SYS High-Side On Resistance: 0.29 Ω (typ)
  • Serial Operating Frequency (I2C): 400 kHz (max)

Features:

  • Single-/Multi-Cell Solar Energy Harvester
  • Efficient Harvesting from 15μW to Over 300mW of Available Input Power
  • Maximum Power Point Tracking (MPPT) Technique Using Fractional VOC Method
  • Programmable Fractional VOC Regulation Point through I2C Interface
  • Battery/Supercapacitor Charger
  • Programmable Battery Termination Voltage through I2C Interface
  • Programmable Power Good Wake-Up Signal Output Threshold through I2C Interface

Applications:

  • Wearable Fitness
  • Medical Devices
  • Industrial IoT Sensors
  • Asset Tracking Devices
  • Wireless Sensor Networks

Package:

  • 12-bump WLP (1.63mm x 1.23mm, 0.4mm pitch)

Features

  • Single-/Multi-Cell Solar Energy Harvester
  • 225mV to 2.5V (typ) Input-Voltage Range
  • Efficient Harvesting from 15μW to Over 300mW of Available Input Power
  • -86% Efficiency at V SYS = 3.8V, I SRC = 30mA
  • Small Solution Size
  • -Utilizes Small 2016 4.7μH Inductor
  • Maximum Power Point Tracking (MPPT) Technique Using Fractional VOC Method
  • Programmable Fractional VOC Regulation Point through I 2 C Interface
  • Battery/Supercapacitor Charger
  • Programmable Battery Termination Voltage through I 2 C Interface
  • Programmable Power Good Wake-Up Signal Output Threshold through I 2 C Interface

Ordering Information appears at end of data sheet

MAX20361

Applications

  • Wearable Fitness
  • Medical Devices
  • Industrial IoT Sensors
  • Asset Tracking Devices
  • Wireless Sensor Networks

Pin Configuration

PINNAMEFUNCTION
A1ENActive Low Enable Input. When EN is high the device stops switching and enters a low power state. EN is internally pulled down to GND by a 1M Ω resistor. In the shutdown state, I 2 C is still operational.
A2WAKEWake Signal for System MCU. This push-pull output is asserted when SYS is above WakeThr[2:0] and the device is not in sleep mode.
A3SDAI 2 C Serial Data
A4SCLI 2 C Serial Clock
B1SRCSource Input. Connect the harvesting source power output to SRC. Connect a 10 μ F capacitor between SRC and GND.
B2GNDGround
B3INTOpen-Drain Interrupt Output
B4REFInternal-Voltage Reference
C1LXBoost-Converter Switching Node. Connect a 4.7 μ H inductor between LX and the harvesting source power output (e.g., anode of solar cell).
C2SYSSystem Output. Connect to system input of power management IC. Connect a 1 μ F bypass capacitor between SYS and GND.
C3V CCInternal Supply. Connect a 1 μ F bypass capacitor between V CC and GND.
C4THMThermistor Input. Connect THM to a voltage divider formed by a pullup resistor and a pulldown thermistor.

Electrical Characteristics

(V SYS = +3.0V to +4.2V, V SRC = +0.3V to +2.5V, typical value is at V SYS = +3.8V, V SRC = +0.6V, T A = +25°C.) (Note 1)

PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
SUPPLY
SYS Shutdown Supply CurrentI SYS_SHDNDeviceEnb = 1, any V SRCDeviceEnb = 1, any V SRC190650nA
SYS Sleep Supply CurrentI SYS_SLEEPDeviceEnb = 0, V SRC = 0VDeviceEnb = 0, V SRC = 0V3601200nA
SYS Idle Supply CurrentI SYS_IDLEEN = 0V, boost not switching, not in sleep modeEN = 0V, boost not switching, not in sleep mode1.43μ A
SYSTEM CONTROL (SYS)SYSTEM CONTROL (SYS)
System Termination Voltage-Programmable RangeV SYS_REG50mV steps, programmable through I 2 C50mV steps, programmable through I 2 C4 to 4.7V
System Regulation- Voltage AccuracyV SYS_REG_AC CT A = 0 ° C to +60 ° CSysReg[3:0] = 7, SYS rising-1+1%
WAKE Voltage- Programmable RangeV WAKE_RANG E100mV steps, programmable through I 2 C100mV steps, programmable through I 2 C3 to 3.7V
WAKE Voltage AccuracyV WAKE_ACCWakeThr[2:0] = 0, SYS rising-2+2%
WAKE Debounce Timet WAKE_TDEB7 x Tmeas8 x Tmeasms
BOOST REGULATOR
Input Operating Voltage at SRCV SRC_RANGE02.5V
Minimum Cold-Start VoltageV SCT A = 25°C (Note 3)T A = 25°C (Note 3)225350mV
EfficiencyBOOST_EFFV SRC = 0.75V, V SYS = 3.8V, I SRC = 100 μ A, L = 4.7 μ H, DFE201612E- 4R7M = P2 Series Inductor V = 0.75V, V = 3.8V,V SRC = 0.75V, V SYS = 3.8V, I SRC = 100 μ A, L = 4.7 μ H, DFE201612E- 4R7M = P2 Series Inductor V = 0.75V, V = 3.8V,77%
BOOST_EFFSRC SYS I SRC = 30mA, L = 4.7 μ H, DFE201612E- 4R7M = P2 Series InductorSRC SYS I SRC = 30mA, L = 4.7 μ H, DFE201612E- 4R7M = P2 Series Inductor86
LX Low-Side On ResistanceR ON_LXL0.10.14Ω
LX SYS High-Side On ResistanceR ON_LX_SYS0.290.39Ω
SRC LX Slow Snubber ResistanceR LX_SSNUB20
SRC LX Snubber ResistanceR LX_SNUB342Ω
Peak CurrentI BSTpk090mA
Peak CurrentI BSTpk1120
Peak CurrentI BSTpk2145
Peak CurrentI BSTpk3180
Peak CurrentI BSTpk4285
Peak CurrentI BSTpk5355
Peak CurrentI BSTpk6470
Peak CurrentI BSTpk7715
SRC METER
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
SRC DAC Full-ScaleV DACFSSRC equivalent voltageSRC equivalent voltage2.595V
SRC LeakageI LNKSRCV SRC = 1VV SRC = 1V0.75μ A
MAXIMUM POWER POINT TRACKINGMAXIMUM POWER POINT TRACKINGMAXIMUM POWER POINT TRACKINGMAXIMUM POWER POINT TRACKINGMAXIMUM POWER POINT TRACKINGMAXIMUM POWER POINT TRACKINGMAXIMUM POWER POINT TRACKINGMAXIMUM POWER POINT TRACKING
Fractional Open Circuit Voltage-Programmable RangeV FRAC_VOC_P1.5% steps, programmable through I 2 C1.5% steps, programmable through I 2 C42.5 to 89.0%
Error of Fractional VOC Regulation PointV FRAC_VOC_E RRORV SRC = 0.6V, includes measurement error of VOC and input voltage regulation error, excludes SRC ripple (Note 3)VOC[7:0] = 75, Frac[4:0] = 25, BSTpk = 3, I SRC = 1mA-4.7+4.7%
Open Circuit Measurement Periodt FRAC_VOCATper = 0, Tper = 00, see textATper = 0, Tper = 00, see text64 * Tmeass
Open Circuit Measurement Periodt FRAC_VOCATper = 0, Tper = 01, see textATper = 0, Tper = 01, see text128 * Tmeass
Open Circuit Measurement Periodt FRAC_VOCATper = 0, Tper = 10, see textATper = 0, Tper = 10, see text256 *s
Open Circuit Measurement Settling Timet FRAC_VOC_S ETTLEATmeas = 0, Tmeas = 00, see textATmeas = 0, Tmeas = 00, see text50ms
Open Circuit Measurement Settling Timet FRAC_VOC_S ETTLEATmeas = 0, Tmeas = 01, see textATmeas = 0, Tmeas = 01, see text100ms
Open Circuit Measurement Settling Timet FRAC_VOC_S ETTLEATmeas = 0, Tmeas = 10, see textATmeas = 0, Tmeas = 10, see text250ms
ENENENENENENENEN
EN Input ThresholdVILENBILENB0.4V
V RIHENBIHENB1.0
SCL, SDA, INTSCL, SDA, INTSCL, SDA, INTSCL, SDA, INTSCL, SDA, INTSCL, SDA, INTSCL, SDA, INTSCL, SDA, INT
SDA and INT Output- Low VoltageV OLSDA , V OL INTI = 5mAI = 5mA0.3V
SDA, SCL, INT Input CurrentI SDA , I SCL , I INTV_ from 0V to 5.5VV_ from 0V to 5.5V-10+1μ A
WAKEWAKEWAKEWAKEWAKEWAKEWAKEWAKE
WAKE Output-Low VoltageV OLWAKEI = 5mAI = 5mA0.3V
WAKE Output-High VoltageV OHWAKEI = -5mAI = -5mASYS - 0.3V
THERMAL MONITORING (REF, THM)THERMAL MONITORING (REF, THM)THERMAL MONITORING (REF, THM)THERMAL MONITORING (REF, THM)THERMAL MONITORING (REF, THM)THERMAL MONITORING (REF, THM)THERMAL MONITORING (REF, THM)THERMAL MONITORING (REF, THM)
REF VoltageV REFI REF from 0 μ A to 100 μ AI REF from 0 μ A to 100 μ A1.151.21.25V
Cold Temperature Trip- Point Programmable RangeVCOLDCOLD53.557.560%V REF
Hot Temperature Trip- Point Programmable RangeV HOT16.218.722%V REF
THM Input LeakageI THM-1+1μ A

(V SYS = +3.0V to +4.2V, V SRC = +0.3V to +2.5V, typical value is at V SYS = +3.8V, V SRC = +0.6V, T A = +25°C.) (Note 1)

PARAMETERSYMBOLMINTYPMAXUNITS
SCL and SDA InputV IL0.4V
ThresholdV IH1V
I 2 C TIMINGS
Serial Operating Frequencyf SCL400kHz
Maximum Clock Periodt SCLMAX2.5μ s
START Condition Hold Timet HD:STA0.6μ s
Clock Low Periodt LOW1.3μ s
Clock High Periodt HIGH0.6μ s
START Condition Setup Timet SU:STA0.6μ s
Repeat START Condition Setup Timet SU:STA0.6μ s
Data Hold Timet HD:DAT0ns
Data Valid to SCL Rise Timet SU:DAT100ns
STOP Condition Setup Timet SU:STO0.6μ s
Bus Free Time Between STOP and START Conditionst BUF1.3μ s

Note 1: All devices 100% productions tested at 25°C. Limits over the operating temperature range are guaranteed by design.

Note 2: All capacitance values listed in this document refer to effective capacitance. Be sure to specify capacitors that meets these requirements under typical system operating conditions, taking into consideration the effects of voltage and temperature.

Note 3: Not production tested. Guaranteed by design.

Absolute Maximum Ratings

  • SRC to GND......................................................-0.3V to +3.5V
  • INT , EN , SDA, SCL to GND..................................-0.3V to +6V
  • WAKE to GND....................................... -0.3V to (SYS + 0.3V)
  • REF, THM to GND..................................-0.3V to (V CC + 0.3V)
  • LX to GND..............................................-0.3V to (V CC + 0.3V)
  • Continuous Current into LX, GND or SYS .........-0.5A to +0.5A

Continuous Current into any other Pin .......... -0.05A to +0.05A

Continuous Power Dissipation (Multilayer Board) (T A = +70 o C, derate 13.73mW/ o C above +70 o C) ......................... 1098.4mW

Operating Temperature Range ........................ -40 o C to +85 o C

Junction Temperature Range ......................... -40 o C to +150 o C

Storage Temperature Range ......................... -40 o C to +150 o C

Soldering Temperature (reflow).................................... +260 o C

Stresses beyond those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. These are stress rati ngs only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Thermal Information

When ThmEn3 is 1, the MAX20361 monitors the voltage on THM. The device checks VTHM once if FrcTHM6 is 1 or periodically every Tper1:0 time if THMper6 is 1. During that process, the MAX20361 drives REF to 1.2V (typ) for 1ms (typ). The voltage divider, formed by the pullup resistor from THM to REF and the NTC thermistor from THM to ground, provides a voltage at THM proportional to the temperature as a fraction of VREF. When VTHM is above 57.5% of VREF or below 18.7% of VREF, THMflag6 is set and the boost is halted. These thresholds are equivalent to 0°C and 45°C if a 10kΩ NTC thermistor with β = 3380 and a 22kΩ pullup resistor are used.

The device also performs a THM check at power-on and on the EN falling edge. A fault condition is assumed until this first THM check is completed.

Typical Application

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
MAX20361Analog Devices Inc./Maxim Integrated
MAX20361AAnalog Devices Inc./Maxim Integrated
MAX20361AEWCAnalog Devices Inc./Maxim Integrated
MAX20361BAnalog Devices Inc./Maxim Integrated
MAX20361BEWCAnalog Devices Inc./Maxim Integrated
MAX20361CAnalog Devices Inc./Maxim Integrated
MAX20361CEWCAnalog Devices Inc./Maxim Integrated
MAX20361DAnalog Devices Inc./Maxim Integrated
MAX20361DEWCAnalog Devices Inc./Maxim Integrated
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