MAX13443E

±15kV ESD-Protected, ±80V Fault-Protected, Fail-Safe RS-485/J1708 Transceivers

Manufacturer

Analog Devices Inc./Maxim Integrated

Category

Integrated Circuits (ICs)

Overview

Part: MAX13442E/MAX13443E/MAX13444E from Maxim Integrated

Type: RS-485/J1708 Transceivers

Key Specs:

  • ESD Protection: ±15kV
  • Fault Protection: ±80V (MAX13442E/MAX13444E), ±60V (MAX13443E)
  • Data Rate: up to 250kbps (MAX13442E/MAX13444E), up to 10Mbps (MAX13443E)
  • Transceivers on Bus: 128
  • Supply Voltage: +4.75V to +5.25V
  • Common-Mode Input Range: -7V to +12V
  • Foldback Current Limit: ±6mA

Features:

  • ±15kV ESD Protection
  • ±80V Fault Protection (±60V MAX13443E)
  • Guaranteed 10Mbps Data Rate (MAX13443E)
  • Hot-Swappable for Telecom Applications
  • True Fail-Safe Receiver Inputs
  • Enhanced Slew-Rate-Limiting Facilitates Error-Free Data Transmission (MAX13442E/MAX13444E)
  • Allow Up to 128 Transceivers on the Bus
  • -7V to +12V Common-Mode Input Range
  • ±6mA FoldBack Current Limit
  • Industry-Standard Pinout

Applications:

  • RS-422/RS-485 Communications
  • Truck and Trailer
  • Telecommunications Systems
  • Automotive Applications
  • HVAC Controls
  • Industrial Networks

Package:

  • 8-pin SO

Features

  • ±15kV ESD Protection
  • ±80V Fault Protection (±60V MAX13443E)
  • Guaranteed 10Mbps Data Rate (MAX13443E)
  • Hot-Swappable for Telecom Applications
  • True Fail-Safe Receiver Inputs
  • Enhanced Slew-Rate-Limiting Facilitates Error-Free Data Transmission (MAX13442E/MAX13444E)
  • Allow Up to 128 Transceivers on the Bus
  • -7V to +12V Common-Mode Input Range
  • ±6mA FoldBack Current Limit
  • Industry-Standard Pinout

Applications

  • RS-422/RS-485 Communications ● Truck and Trailer
  • Telecommunications Systems
  • Automotive Applications
  • HVAC Controls
  • Applications ● Industrial Networks

Applications

  • RS-422/RS-485 Communications ● Truck and Trailer
  • Telecommunications Systems
  • Automotive Applications
  • HVAC Controls
  • Applications ● Industrial Networks

Pin Configuration

Electrical Characteristics

(VCC = +4.75V to +5.25V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V and TA = +25°C.)

ParameterValue
Continuous Power Dissipation (TA = +70°C)
SO (derate 7.6mW/°C above +70°C)606mW
Operating Temperature Range-40°C to +125°C
Storage Temperature Range-65°C to +150°C
Junction Temperature+150°C
Lead Temperature (soldering, 10s)+300°C
Soldering Temperature (reflow)+260°C

Absolute Maximum Ratings

SymbolParameterConditionsMinTypMaxUnit
VCCSupply Voltage2.75.5V
IOUTOutput Current±20mA
VOUTOutput Voltage0VCCV
TAOperating Temperature Range-40+85°C
TJJunction Temperature Range-40+125°C
TSTGStorage Temperature Range-65+150°C
ESDESD SusceptibilityHBM±2000V
ESDESD SusceptibilityCDM±500V
ESDESD SusceptibilityMM±200V
RθJAThermal Resistance8-Pin SOIC120°C/W
RθJAThermal Resistance8-Pin MSOP210°C/W
RθJAThermal Resistance8-Pin TSSOP180°C/W
RθJAThermal Resistance8-Pin DFN100°C/W
RθJAThermal Resistance5-Pin SOT-23250°C/W
RθJAThermal Resistance6-Pin SOT-23250°C/W
RθJAThermal Resistance10-Pin MSOP180°C/W
RθJAThermal Resistance10-Pin DFN100°C/W
RθJAThermal Resistance14-Pin TSSOP120°C/W
RθJAThermal Resistance16-Pin TSSOP100°C/W
RθJAThermal Resistance20-Pin TSSOP90°C/W
RθJAThermal Resistance24-Pin TSSOP80°C/W
RθJAThermal Resistance28-Pin TSSOP70°C/W
RθJAThermal Resistance32-Pin TSSOP60°C/W
RθJAThermal Resistance38-Pin TSSOP50°C/W
RθJAThermal Resistance48-Pin TSSOP40°C/W
RθJAThermal Resistance48-Pin TQFP40°C/W
RθJAThermal Resistance64-Pin TQFP35°C/W
RθJAThermal Resistance100-Pin TQFP30°C/W
ParameterValue
VCC+7V
RE, DE, DE, DI, TXD-0.3V to (VCC + 0.3V)
A, B (Note 1) (MAX13442E/MAX13444E)±80V
A, B (Note 1) (MAX13443E)±60V
RO-0.3V to (VCC + 0.3V)
Short-Circuit Duration (RO, A, B)Continuous

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

(Note 2) Package Thermal Characteristics

SO

Junction-to-Ambient Thermal Resistance (θJA) ........132°C/W Junction-to-Case Thermal Resistance (θJC)...............38°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Thermal Information

SO

Junction-to-Ambient Thermal Resistance (θJA) ........132°C/W Junction-to-Case Thermal Resistance (θJC)...............38°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
MAX13442EAnalog Devices Inc./Maxim Integrated—
MAX13443EASAMaxim Integrated—
MAX13443EASA+TAnalog Devices Inc./Maxim Integrated8-SOIC (0.154", 3.90mm Width)
MAX13444EAnalog Devices Inc./Maxim Integrated—
MAX1344XAnalog Devices Inc./Maxim Integrated—
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