M24512-DFXXX

2.6 Supply voltage (VCC)

Overview

Part: M24512

Type: Serial I²C bus EEPROM

Key Specs:

  • Memory array: 512 Kbit (64 Kbyte)
  • Page size: 128 byte
  • I2C clock frequency: 1 MHz, 400 kHz, 100 kHz
  • Supply voltage (1 MHz clock): 1.7 V to 5.5 V
  • Supply voltage (M24512-W): 2.5 V to 5.5 V
  • Supply voltage (M24512-R): 1.8 V to 5.5 V
  • Supply voltage (M24512-DF): 1.7 V to 5.5 V
  • Byte write time: within 5 ms
  • Page write time: within 5 ms
  • Operating temperature range: -40 °C up to +85 °C
  • Write cycles: More than 4 million
  • Data retention: More than 200-years

Features:

  • Compatible with I2C bus modes: 1 MHz, 400 kHz, 100 kHz
  • Memory array: 512 Kbit (64 Kbyte) of EEPROM
  • Page size: 128 byte
  • Additional write lockable page (M24512-D order codes)
  • Single supply voltage and high speed: 1 MHz clock from 1.7 V to 5.5 V
  • Byte write within 5 ms
  • Page write within 5 ms
  • Operating temperature range: -40 °C up to +85 °C
  • Random and sequential read modes
  • Write protect of the whole memory array
  • Enhanced ESD/latch-Up protection
  • More than 4 million write cycles
  • More than 200-years data retention
  • ECOPACK2® packages
  • Unsawn wafer (each die is tested)

Applications:

  • null

Package:

  • SO8 ECOPACK2®: null
  • TSSOP8 ECOPACK2®: 169 mil width
  • UFDFPN8 ECOPACK2®: 2x3 mm
  • WLCSP ECOPACK2®: null
  • Unsawn wafer: null

Features

  • Compatible with following I2C bus modes:
    • 1 MHz
    • 400 kHz
    • 100 kHz
  • Memory array:
    • 512 Kbit (64 Kbyte) of EEPROM
    • Page size: 128 byte
    • Additional write lockable page (M24512-D order codes)
  • Single supply voltage and high speed:
    • 1 MHz clock from 1.7 V to 5.5 V
  • Write time:
    • Byte write within 5 ms
    • Page write within 5 ms
  • Operating temperature range:
    • -40 °C up to +85 °C
  • Random and sequential read modes
  • Write protect of the whole memory array
  • Enhanced ESD/latch-Up protection
  • More than 4 million write cycles
  • More than 200-years data retention
  • Packages:
    • SO8 ECOPACK2®
    • TSSOP8 ECOPACK2®
    • UFDFPN8 ECOPACK2®
    • WLCSP ECOPACK2®
    • Unsawn wafer (each die is tested)

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
M24512
M24512-125
M24512-D
M24512-DF
M24512-DFMC6TGDFN-8(2x3)
M24512-DR
M24512-R
M24512-RXXX
M24512-W
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