LTST-C19HE1WT-H

Part: LTST-C19HE1WT-H — LITE-ON TECHNOLOGY CORPORATION

Type: Full Color SMD Chip LED

Description: Extra thin (0.35 Hmm) full color SMD chip LED available in Red, Green, and Blue, with typical luminous intensities ranging from 28 mcd (Blue) to 280 mcd (Green) at 20 mA, and a wide viewing angle of 130 degrees.

Operating Conditions:

• Operating temperature: -20 °C to +80 °C
• DC forward current: 20 mA (Blue, Green), 30 mA (Red)

Absolute Maximum Ratings:

• Max power dissipation: 80 mW (Blue, Green), 75 mW (Red)
• Max peak forward current (1/10 Duty Cycle, 0.1ms Pulse Width): 100 mA (Blue, Green), 80 mA (Red)
• Max DC forward current: 20 mA (Blue, Green), 30 mA (Red)
• Max reverse voltage: 5 V
• Max storage temperature: -30 °C to +85 °C

Key Specs:

• Luminous Intensity (Blue): 28.0 mcd (min) to 180.0 mcd (max) at IF = 20mA
• Luminous Intensity (Green): 160.0 mcd (min) to 280.0 mcd (max) at IF = 20mA
• Luminous Intensity (Red): 85.0 mcd (min) to 240.0 mcd (max) at IF = 20mA
• Viewing Angle: 130 deg (TYP)
• Peak Emission Wavelength (Blue): 468 nm (TYP)
• Peak Emission Wavelength (Green): 520 nm (TYP)
• Peak Emission Wavelength (Red): 632 nm (TYP)
• Forward Voltage (Blue, Green): 2.80 V (MIN) to 3.90 V (MAX) at IF = 20mA
• Forward Voltage (Red): 1.80 V (MIN) to 2.40 V (MAX) at IF = 20mA
• Reverse Current: 10 μA (MAX) at VR = 5V

Features:

• ROHS, Green Product
• Extra Thin (0.35 Hmm)
• Package in 8mm tape on 7" diameter reels
• EIA STD package
• I.C. compatible
• Compatible with automatic placement equipment
• Compatible with infrared and vapor phase reflow solder process

Applications:

• Ordinary electronic equipment (such as office equipment, communication equipment and household applications)

Package:

• SMD Chip LED (0.35 Hmm extra thin)

• Meet ROHS, Green Product.
• Extra Thin (0.35Hmm) Full Color SMD Chip LED.
• Package in 8mm tape on 7" diameter reels.
• EIA STD package.
• I.C. compatible.
• Compatible with automatic placement equipment.
• Compatible with infrared and vapor phase reflow solder process.