LT1763CS8-3.3

LT1763 Series

Manufacturer

Linear Technology Corporation

Overview

Part: LT1763 Series from Linear Technology Corporation

Type: 500mA, Low Noise, LDO Micropower Regulators

Key Specs:

  • Low Noise: 20μVRMS (10Hz to 100kHz)
  • Output Current: 500mA
  • Low Quiescent Current: 30μA
  • Wide Input Voltage Range: 1.8V to 20V
  • Low Dropout Voltage: 300mV
  • Very Low Shutdown Current: < 1μA
  • Fixed Output Voltages: 1.5V, 1.8V, 2.5V, 3V, 3.3V, 5V
  • Adjustable Output: 1.22V to 20V
  • Stable with 3.3μF Output Capacitor

Features:

  • No Protection Diodes Needed
  • Stable with Aluminum, Tantalum or Ceramic Capacitors
  • Reverse Battery Protection
  • No Reverse Current
  • Overcurrent and Overtemperature Protected
  • Quiescent current does not rise in dropout
  • Low output noise with external 0.01μF bypass capacitor

Applications:

  • Cellular Phones
  • Battery-Powered Systems
  • Noise-Sensitive Instrumentation Systems

Package:

  • 8-Lead SO
  • 12-Lead (4mm × 3mm × 0.75mm) DFN
{
  "manufacturer": "Linear Technology Corporation",
  "part_family": "LT1763",
  "component_type": "LDO Micropower Regulator",
  "family_variants": [
    "LT1763CDE",
    "LT1763IDE",
    "LT1763MPDE",
    "LT1763CDE-1.5",
    "LT1763IDE-1.5",
    "LT1763MPDE-1.5",
    "LT1763CDE-1.8",
    "LT1763IDE-1.8",
    "LT1763MPDE-1.8",
    "LT1763CDE-2.5",
    "LT1763IDE-2.5",
    "LT1763MPDE-2.5",
    "LT1763CDE-3",
    "LT1763IDE-3",
    "LT1763MPDE-3",
    "LT1763CDE-3.3",
    "LT1763IDE-3.3",
    "LT1763MPDE-3.3",
    "LT1763CDE-5",
    "LT1763IDE-5",
    "LT1763MPDE-5",
    "LT1763CS8",
    "LT1763IS8",
    "LT1763MPS8",
    "LT1763CS8-1.5",
    "LT1763IS8-1.5",
    "LT1763CS8-1.8",
    "LT1763IS8-1.8

Features

  • n Low Noise: 20μVRMS (10Hz to 100kHz)
  • n Output Current: 500mA
  • n Low Quiescent Current: 30μA
  • n Wide Input Voltage Range: 1.8V to 20V
  • n Low Dropout Voltage: 300mV
  • n Very Low Shutdown Current: < 1μA
  • n No Protection Diodes Needed
  • n Fixed Output Voltages: 1.5V, 1.8V, 2.5V, 3V, 3.3V, 5V
  • n Adjustable Output from 1.22V to 20V
  • n Stable with 3.3μF Output Capacitor
  • n Stable with Aluminum, Tantalum or Ceramic Capacitors
  • n Reverse Battery Protection
  • n No Reverse Current
  • n Overcurrent and Overtemperature Protected
  • n 8-Lead SO and 12-Lead (4mm × 3mm) DFN Packages

Applications

  • n Cellular Phones
  • n Battery-Powered Systems
  • n Noise-Sensitive Instrumentation Systems

Pin Configuration

Electrical Characteristics

PARAMETERCONDITIONSMINTYPMAXUNITS
Minimum Operating VoltageC, I Grade: ILOAD = 500mA (Notes 3, 11)
MP Grade: ILOAD = 500mA (Notes 3, 11)
1.8
1.8
2.3
2.35
V
V
Regulated Output Voltage
(Note 4)
    LT1763-1.5VIN = 2V, ILOAD = 1mA
2

Absolute Maximum Ratings

  • OUT Pin Voltage ±20V
  • Input to Output Differential Voltage ±20V
  • SENSE Pin Voltage ±20V
  • ADJ Pin Voltage ±7V
  • BYP Pin Voltage ±0.6V
  • SHDN Pin Voltage
  • Output Short-Circuit Duration Indefi nite
  • Operating Junction Temperature Range (Note 2)

  • C, I Grade –40°C to 125°C
  • MP Grade –55°C to 125°C
  • Storage Temperature Range
  • S8 Package –65°C to 150°C
  • DFN Package –65°C to 150°C
  • Lead Temperature (Soldering, 10 sec)
  • S8 Package 300°C

Thermal Information

The power handling capability of the device will be limited by the maximum rated junction temperature (125°C). The power dissipated by the device will be made up of two components:

    1. Output current multiplied by the input/output voltage differential: (IOUT)(VIN – VOUT), and
    1. GND pin current multiplied by the input voltage: (IGND)(VIN).

The GND pin current can be found by examining the GND Pin Current curves in the Typical Performance Characteristics section. Power dissipation will be equal to the sum of the two components listed above.

The LT1763 series regulators have internal thermal limiting designed to protect the device during overload conditions. For continuous normal conditions, the maximum junction temperature rating of 125°C must not be exceeded. It is important to give careful consideration to all sources of thermal resistance from junction-to-ambient. Additional heat sources mounted nearby must also be considered.

For surface mount devices, heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. Copper board stiffeners and plated through-holes can also be used to spread the heat generated by power devices.

The following tables list thermal resistance for several different board sizes and copper areas. All measurements were taken in still air on 3/32" FR-4 board with one ounce copper.

COPPER AREATHERMAL RESISTANCE
TOPSIDE*BACKSIDEBOARD AREA(JUNCTION-TO-AMBIENT)
2500mm22500mm22500mm240°C/W
1000mm22500mm22500mm245°C/W
225mm22500mm22500mm250°C/W
100mm22500mm22500mm260°C/W

Table 1. DE Package, 12-Lead DFN

* Device is mounted on topside

  • TOPSIDE*
  • 2500mm2
  • 1000mm2
  • 225mm2
  • 100mm2
  • 50mm2

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
LT1763Linear Technology Corporation
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