The LSM6DSV32X is a high-performance, low-power 6-axis small IMU, featuring a 3-axis digital accelerometer at 32 g and a 3-axis digital gyroscope, that offers the best IMU sensor with a triple-channel architecture for processing acceleration and angular rate data on three separate channels (user interface, OIS, and EIS) with dedicated configuration, processing, and filtering.

The LSM6DSV32X enables processes in edge computing, leveraging embedded advanced dedicated features such as a finite state machine (FSM) for configurable motion tracking and a machine learning core (MLC) for context awareness with exportable AI features for IoT applications.

The LSM6DSV32X supports the adaptive self-configuration (ASC) feature, which allows the FSM to automatically reconfigure the device in real time based on the detection of a specific motion pattern or based on the output of a specific decision tree configured in the MLC, without any intervention from the host processor.

The LSM6DSV32X embeds Qvar (electric charge variation detection) for user interface functions like tap, double tap, triple tap, long press, or L/R - R/L swipe.

The LSM6DSV32X embeds an analog hub able to connect an external analog input and convert it to a digital signal for processing.

• Triple-channel architecture for UI, EIS, and OIS data processing
• "Always-on" experience with low power consumption for both accelerometer and gyroscope
• Smart FIFO up to 4.5 KB
• Android compliant
• ±4/±8/±16/±32 g full scale
• ±125/±250/±500/±1000/±2000/±4000 dps full scale
• SPI / I²C & MIPI I3C ® v1.1 serial interface with main processor data synchronization
• Auxiliary SPI for OIS data output for gyroscope and accelerometer
• OIS configurable from aux. SPI, primary interface (SPI / I²C & MIPI I3C ® v1.1)
• EIS dedicated channel on primary interface with dedicated filtering
• Advanced pedometer, step detector, and step counter
• Significant motion detection, tilt detection
• Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click
• Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
• Machine learning core with exportable features and filters for AI applications
• Embedded adaptive self-configuration (ASC)
• Embedded Qvar (electrostatic sensor) for user interface functions (tap, double tap, triple tap, long press, L/R - R/L swipe)
• Embedded analog hub for ADC and processing analog input data
• Embedded sensor fusion low-power algorithm
• Embedded temperature sensor
• Analog supply voltage: 1.71 V to 3.6 V
• Independent IO supply (extended range: 1.08 V to 3.6 V)
• Power consumption: 0.65 mA in combo high-performance mode
• Compact footprint: 2.5 mm x 3 mm x 0.83 mm
• ECOPACK and RoHS compliant

• Wearables
• Smartphones and handheld devices
• IoT and connected devices
• Motion tracking and gesture detection, augmented reality (AR) / virtual reality (VR) / mixed reality (MR) applications & metaverse applications
• Indoor navigation
• EIS and OIS for camera applications
• Vibration monitoring and compensation

LGA-14L (2.5 x 3.0 x 0.83 mm) typ.

LSM6DSV32XTR — 14-VFLGA Pinout

Notes

• Pin 12 (CS): Chip Select input; used in SPI mode.
• Pin 13 (SCL) and Pin 14 (SDA): I²C interface pins (alternative to SPI).
• Pins 1–3: Configurable for SPI (SDO, SDx, SCx) or I²C (SA0, SDA, SCL) operation depending on mode selection.
• Pin 4 (INT1): Interrupt output for motion/event detection.
• Pins 5, 8: Power supply pins (Vdd_IO for I/O, Vdd for core).
• Pins 6, 7: Ground connections.
• Pin 11 (OCS_Aux): Auxiliary output chip select for extended functionality.

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.