LSM6DSV32XTR

Part: LSM6DSV32X — STMicroelectronics

Type: 6-Axis Inertial Measurement Unit (IMU) and AI Sensor

Description: Low-power 6-axis IMU featuring a ±32 g 3-axis accelerometer and ±4000 dps 3-axis gyroscope with triple-channel architecture for UI, EIS, and OIS, embedded sensor fusion, Qvar electrostatic sensing, and machine learning core.

Operating Conditions:

• Supply voltage: 1.71 V to 3.6 V (Analog supply)
• IO supply voltage: 1.08 V to 3.6 V (Independent IO supply)
• Operating temperature: -40 to +85 °C

Key Specs:

• Accelerometer full-scale range: ±4 / ±8 / ±16 / ±32 g
• Gyroscope full-scale range: ±125 / ±250 / ±500 / ±1000 / ±2000 / ±4000 dps
• Current consumption: 0.65 mA (combo high-performance mode)
• FIFO size: Up to 4.5 KB
• Auxiliary SPI data rate (OIS channel): 7.68 kHz
• Finite state machine rate: Up to 960 Hz

Features:

• Triple-channel architecture for independent UI, EIS, and OIS data processing
• Machine learning core (MLC) with exportable features and filters for edge AI applications
• Programmable finite state machine (FSM) and adaptive self-configuration (ASC)
• Embedded Qvar electrostatic sensor for touch and gesture detection (tap, double tap, triple tap, long press, swipe)
• Embedded analog hub for external analog input ADC conversion and processing
• Embedded low-power sensor fusion (SFLP) algorithm providing 6-axis game rotation vector (quaternions)
• Primary interfaces: SPI (3- and 4-wire), I²C, MIPI I3C v1.1; Auxiliary SPI for OIS data output
• Hardware interrupts: free-fall, wake-up, 6D/4D orientation, click and double click, step detector/counter, tilt, significant motion

Applications:

• Wearables, smartphones, and handheld devices
• IoT and connected devices
• Motion tracking, gesture detection, AR/VR/MR and metaverse applications
• Indoor navigation
• EIS and OIS for camera applications
• Vibration monitoring and compensation

Package:

• LGA-14L (2.5 x 3.0 x 0.83 mm typ., 0.86 mm max height)

• Triple-channel architecture for UI, EIS, and OIS data processing
• "Always-on" experience with low power consumption for both accelerometer and gyroscope
• Smart FIFO up to 4.5 KB
• Android compliant
• ±4/±8/±16/±32 g full scale
• ±125/±250/±500/±1000/±2000/±4000 dps full scale
• SPI / I²C & MIPI I3C ® v1.1 serial interface with main processor data synchronization
• Auxiliary SPI for OIS data output for gyroscope and accelerometer
• OIS configurable from aux. SPI, primary interface (SPI / I²C & MIPI I3C ® v1.1)
• EIS dedicated channel on primary interface with dedicated filtering
• Advanced pedometer, step detector, and step counter
• Significant motion detection, tilt detection
• Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click
• Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
• Machine learning core with exportable features and filters for AI applications
• Embedded adaptive self-configuration (ASC)
• Embedded Qvar (electrostatic sensor) for user interface functions (tap, double tap, triple tap, long press, L/R - R/L swipe)
• Embedded analog hub for ADC and processing analog input data
• Embedded sensor fusion low-power algorithm
• Embedded temperature sensor
• Analog supply voltage: 1.71 V to 3.6 V
• Independent IO supply (extended range: 1.08 V to 3.6 V)
• Power consumption: 0.65 mA in combo high-performance mode
• Compact footprint: 2.5 mm x 3 mm x 0.83 mm
• ECOPACK and RoHS compliant

• Wearables
• Smartphones and handheld devices
• IoT and connected devices
• Motion tracking and gesture detection, augmented reality (AR) / virtual reality (VR) / mixed reality (MR) applications & metaverse applications
• Indoor navigation
• EIS and OIS for camera applications
• Vibration monitoring and compensation

LGA-14L (2.5 x 3.0 x 0.83 mm) typ.

Figure 1. Pin connections

Direction of detectable angular rate (top view)

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.