Overview

Part: LP5907 from Texas Instruments

Type: Low-Noise, Low-IQ LDO

Key Specs:

Input voltage range: 2.2V to 5.5V
Output voltage range: 1.2V to 4.5V
Output current: up to 250mA
Low output voltage noise: < 6.5µVRMS
PSRR: 82dB at 1kHz
Output voltage tolerance: ±2%
IQ (enabled): 12μA
Low dropout: 120mV (typical)
Operating junction temperature: –40°C to 125°C

Features:

Stable with 1-µF ceramic input and output capacitors
No noise bypass capacitor required
Remote output capacitor placement
Thermal-overload and short-circuit protection

Applications:

Smartphones
Tablets
Communications equipment
Digital still cameras
Factory automation

Package:

YKE, YKG, YKM, YCR (DSBGA, 4): 0.685mm × 0.685mm
DBV (SOT-23, 5): 2.9mm × 2.8mm
DQN (X2SON, 4): 1mm × 1mm

Features

For a more updated portfolio device, see the TPS7A20
Input voltage range: 2.2V to 5.5V • Output voltage range: 1.2V to 4.5V
Stable with 1-µF ceramic input and output capacitors
No noise bypass capacitor required
Remote output capacitor placement
Thermal-overload and short-circuit protection
Operating junction temperature: –40°C to 125°C
Low output voltage noise: < 6.5µVRMS
PSRR: 82dB at 1kHz
Output voltage tolerance: ±2%
Very low IQ (enabled): 12μA
Low dropout: 120mV (typical)
Create a custom design using the LP5907 with the WEBENCH® Power Designer

Applications

Pin Configuration

Figure 4-1. YKE, YKG, YKM, and YCR Packages, 4-Pin DSBGA

Table 4-1. Pin Functions: DSBGA

| PII | N | TYPE | DESCRIPTION | |------------|-----|------|--------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------|--| | DSBGA NAME | | ITPE | DESCRIPTION | | A1 | IN | I | Input voltage supply. Connect a 1µF capacitor at this input. | | A2 | OUT | 0 | Regulated output voltage. Connect a minimum 1 $\mu$ F low-ESR capacitor to this pin. Connect this output to the load circuit. An internal 230 $\Omega$ (typical) pulldown resistor prevents a charge remaining on V _OUT when the regulator is in the shutdown mode (V _EN low). | | B1 | EN | I | Enable input. A low voltage (< $V_{IL}$ ) on this pin turns the regulator off and discharges the output pin to GND through an internal 230 $\Omega$ pulldown resistor. A high voltage (> $V_{IH}$ ) on this pin enables the regulator output. This pin has an internal 1M $\Omega$ pulldown resistor to hold the regulator off by default. | | B2 | GND | _ | Common ground |

Figure 4-2. DQN Package, 4-Pin X2SON (Bottom View)

Figure 4-3. DBV Package, 5-Pin SOT-23 (Top View)

Table 4-2. Pin Functions: X2SON, SOT-23

| | PIN | | TYPE | DESCRIPTION | |-------------|-------|--------|------|----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------|--| | NAME | X2SON | SOT-23 | ITPE | | EN | 3 | 3 | I | Enable input. A low voltage ( $<$ V ${IL}$ ) on this pin turns the regulator off and discharges the output pin to GND through an internal 230 $\Omega$ pulldown resistor. A high voltage ( $>$ V ${IH}$ ) on this pin enables the regulator output. This pin has an internal 1M $\Omega$ pulldown resistor to hold the regulator off by default. | | GND | 2 | 2 | _ | Common ground. | | IN | 4 | 1 | I | Input voltage supply. Connect a 1µF capacitor at this input. | | N/C | _ | 4 | _ | No internal electrical connection. | | OUT | 1 | 5 | 0 | Regulated output voltage. Connect a minimum 1 $\mu$ F low-ESR capacitor to this pin. Connect this output to the load circuit. An internal 230 $\Omega$ (typical) pulldown resistor prevents a charge remaining on V _OUT when the regulator is in shutdown mode (V _EN low). | | Thermal Pad | 5 | _ | _ | Thermal pad for the X2SON package, connect to GND or leave floating. Do not connect to any potential other than GND. | Copyright © 2025 Texas Instruments Incorporated

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Electrical Characteristics

$V_{IN} = V_{OUT(NOM)} + 1V$ , $V_{EN} = 1.2V$ , $I_{OUT} = 1$ mA, $C_{IN} = 1$ $\mu$ F, and $C_{OUT} = 1$ $\mu$ F (unless otherwise noted)(1) (2) (3)

PARAMETER		TEST COND	ITIONS	MIN	TYP	MAX	UNIT
V _IN	Input voltage	T _A = 25°C		2.2		5.5	V
		$V_{IN} = (V_{OUT(NOM)} + 1V)$ to $I_{OUT} = 1$ mA to 250mA	-2		2
ΔV _OUT	Output voltage tolerance	$V_{IN} = (V_{OUT(NOM)} + 1V)$ to $I_{OUT} = 1$ mA to 250mA $(V_{OUT} < 1.8V, SOT-23, X2)$	-3		3	%V _OUT
	Line regulation	$V_{IN} = (V_{OUT(NOM)} + 1V)$ to $I_{OUT} = 1$ mA	5.5V,		0.02		%/V
	Load regulation	I _OUT = 1mA to 250mA			0.001		%/mA
	Load current	See ⁽⁴⁾		0		250	mA
I _LOAD	Maximum output current			250			mA
		V _EN = 1.2V, I _OUT = 0mA			12	25
IQ	Quiescent current ⁽⁵⁾	V _EN = 1.2V, I _OUT = 250mA				425	μΑ
		V _EN = 0.3V (disabled)		0.2	1
I _G	Ground current ⁽⁶⁾	V _EN = 1.2V, I _OUT = 0mA			14		μA
		I _OUT = 100mA		50
$V_{DO}$	Dropout voltage ⁽⁷⁾	I _OUT = 250mA (DSBGA pa		120	200	mV
		I _OUT = 250mA (SOT-23, X	2SON packages)			250
I _sc	Short-circuit current limit	T _A = 25°C ⁽⁸⁾		250	500		mA
		f = 100Hz, I _OUT = 20mA			90
D0DD	5	f = 1kHz, I _OUT = 20mA			82
PSRR	Power-supply rejection ratio ⁽⁹⁾	f = 10kHz, I _OUT = 20mA		65		dB
		f = 100kHz, I _OUT = 20mA			60
	Q 1 1 1 (Q)	DW 4011 4 400111	I _OUT = 1mA		10		.,
e _N	Output noise voltage ⁽⁹⁾	BW = 10Hz to 100kHz	I _OUT = 250mA		6.5		$\mu V_{RMS}$
R _AD	Output automatic discharge pulldown resistance	V _EN < V _IL (output disabled	)		230		Ω
-	Thermal shutdown	T _J rising			160		°C
T _SD	Thermal hysteresis	T _J falling from shutdown	• •		15		-0
LOGIC IN	PUT THRESHOLDS	-1

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (3)

		MIN	MAX	UNIT
VIN	Input voltage	–0.3	6	V
VOUT	Output voltage	–0.3	See(2)	V
VEN	Enable input voltage	–0.3	6	V
	Continuous power dissipation(4)	Internally limited		W
TJMAX	Junction temperature		150	°C
Tstg	Storage temperature	–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under the Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Abs Max VOUT is the lessor of VIN + 0.3V, or 6V.
(3) All voltages are with respect to the GND pin.
(4) Internal thermal shutdown circuitry protects the device from permanent damage.

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1) (2)

		MIN	MAX	UNIT
VIN	Input supply voltage	2.2	5.5	V
VEN	Enable input voltage	0	5.5	V
IOUT	Output current	0	250	mA
TJ	Junction temperature	–40	125	°C
TA	Ambient temperature(3)	–40	85	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the GND pin.
(3) In applications where high power dissipation and poor package thermal resistance is present, the maximum ambient temperature can need to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the device or package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See the Application and Implementation section.

Product Folder Links: LP5907

Thermal Information

| | | | | LP59 | 07 | |-----------------------|----------------------------------------------|-----------------|----------------|----------------|----------------|----------------|----------------|------| | | THERMAL METRIC(1) | DBV
(SOT-23) | DQN
(X2SON) | YCR
(DSBGA) | YKE
(DSBGA) | YKG
(DSBGA) | YKM
(DSBGA) | UNIT | | | | 5 PINS | 4 PINS | 4 PINS | 4 PINS | 4 PINS | 4 PINS | | $R_{\theta JA}$ | Junction-to-ambient thermal resistance | 193.4 | 216.1 | 189.4 | 206.1 | 191.6 | 194.1 | °C/W | | R _0JC(top) | Junction-to-case (top) thermal resistance | 102.1 | 161.7 | 2.4 | 1.5 | 2.4 | 3.0 | °C/W | | $R_{\theta JB}$ | Junction-to-board thermal resistance | 45.8 | 162.1 | 56.6 | 37.0 | 58.9 | 62.7 | °C/W | | ΨЈT | Junction-to-top characterization parameter | 8.4 | 5.1 | 1.1 | 15.0 | 1.1 | 1.1 | °C/W | | ΨЈB | Junction-to-board characterization parameter | 45.3 | 161.7 | 56.5 | 36.8 | 58.9 | 62.7 | °C/W | | R _0JC(bot) | Junction-to-case (bottom) thermal resistance | n/a | 123.0 | n/a | n/a | n/a | n/a | °C/W |

⁽¹⁾ For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.

LP5907MFX-3.3