LMR62014XMFX/NOPB.B

Part: LMR62014 from Texas Instruments

Type: Step-Up Voltage Regulator

Key Specs:

• Input Voltage Range: 2.7V to 14V
• Output Voltage: up to 20V
• Switch Current: up to 1.4A
• Switching Frequency: 1.6 MHz
• Shutdown Quiescent Current: <1 μA
• Maximum Duty Cycle: 93%

Features:

• Input Voltage Range of 2.7V to 14V
• Output Voltage up to 20V
• Switch Current up to 1.4A
• 1.6 MHz Switching Frequency
• Low Shutdown Iq, <1 μA
• Cycle-by-Cycle Current Limiting
• Internally Compensated
• 5-Pin SOT-23 Packaging
• Fully Enabled for WEBENCH® Power Designer
• Current-mode boost converter
• Thermal shutdown protection
• Logic-level shutdown pin

Applications:

• Boost Conversions from 3.3V, 5V, and 12V
• Space Constrained Applications
• Embedded Systems
• LCD Displays
• LED Applications

Package:

• SOT-23: 2.92 x 2.84 x 1.08mm

• Input Voltage Range of 2.7V to 14V
• Output Voltage up to 20V
• Switch Current up to 1.4A
• 1.6 MHz Switching Frequency
• Low Shutdown Iq, <1 μA
• Cycle-by-Cycle Current Limiting
• Internally Compensated
• 5-Pin SOT-23 Packaging (2.92 x 2.84 x 1.08mm)
• Fully Enabled for WEBENCH® Power Designer

• Boost Conversions from 3.3V, 5V, and 12V
• Space Constrained Applications
• Embedded Systems
• LCD Displays
• LED Applications

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Limits in standard typeface are for T_J = 25°C, and limits in boldface type apply over the full operating temperature range (-40°C ≤ T_J ≤ +125°C). Unless otherwise specified: V_IN = 5V, V_SHDN = 5V, I_L = 0A.

⁽¹⁾ Limits are ensured by testing, statistical correlation, or design.

⁽²⁾ Typical values are derived from the mean value of a large quantity of samples tested during characterization and represent the most likely expected value of the parameter at room temperature.

⁽³⁾ L = 10 μ H, C_OUT = 4.7 μ F, duty cycle = maximum

⁽⁴⁾ Switch current limit is dependent on duty cycle (see Typical Performance Characteristics).

⁽⁵⁾ Specified limits are the same for Vin = 3.3V input.

• Storage Temperature Range

• Operating Junction Temperature Range

• Lead Temp. (Soldering, 5 sec.)

• Power Dissipation ⁽³⁾

• FB Pin Voltage

• SW Pin Voltage

• Input Supply Voltage

• SHDN Pin Voltage

• θ _J-A (SOT-23)

• ESD Rating Human Body Model (4)

• For soldering specifications see SNOA549

• (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of the limits set forth under the operating ratings which specify the intended range of operating conditions.

• (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

• (3) The maximum power dissipation which can be safely dissipated for any application is a function of the maximum junction temperature, T_J(MAX) = 125^°C , the junction-to-ambient thermal resistance for the SOT-23 package, θ_J-A = 265^°C/W , and the ambient temperature, T_A . The maximum allowable power dissipation at any ambient temperature for designs using this device can be calculated using the formula: frac{T_J(MAX) T_A}{θ_J-A} = frac{125 T_A}{265} If power dissipation exceeds the maximum specified above, the internal thermal protection circuitry will protect the device by reducing the output voltage as required to maintain a safe junction temperature.

(4) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin.

Product Folder Links: LMR62014

At higher duty cycles, the increased ON time of the FET means the maximum output current will be determined by power dissipation within the LMR62014 FET switch. The switch power dissipation from ON-state conduction is calculated by:

$P_(SW) = DC × I_(ND)(AVE)² × R_DS(ON)$ (11)

There will be some switching losses as well, so some derating needs to be applied when calculating IC power dissipation.