LM7805

Part: LM340, LM340A, LM7805, LM7812, LM7815

Type: Fixed Voltage Regulators

Key Specs:

• Output Current: up to 1.5 A
• Output Voltage Options: Fixed 5-V, 12-V, and 15-V
• Output Voltage Tolerances: ±2% at T_J = 25°C (LM340A)
• Line Regulation: 0.01% / V at 1-A Load (LM340A)
• Load Regulation: 0.3% / A (LM340A)

Features:

• Internal Thermal Overload, Short-Circuit and SOA Protection
• Available in Space-Saving SOT-223 Package
• Output Capacitance Not Required for Stability
• Monolithic 3-terminal positive voltage regulators
• Employ internal current-shutdown safe-area thermal and compensation
• Essentially indestructible (with adequate heat sinking)
• Can be used with external components to obtain adjustable output voltages and currents
• Easy to use and minimize external components
• Input bypassing needed only if regulator is far from filter capacitor

Applications:

• Industrial Power Supplies
• SMPS Post Regulation
• HVAC Systems
• AC Inventors
• Test and Measurement Equipment

• Output Current up to 1.5 A
• Available in Fixed 5-V, 12-V, and 15-V Options
• Output Voltage Tolerances of ±2% at T_J = 25°C (LM340A)
• Line Regulation of 0.01% / V of at 1-A Load (LM340A)
• Load Regulation of 0.3% / A (LM340A)
• Internal Thermal Overload, Short-Circuit and SOA Protection
• Available in Space-Saving SOT-223 Package
• Output Capacitance Not Required for Stability

• Industrial Power Supplies
• SMPS Post Regulation
• HVAC Systems
• AC Inventors
• Test and Measurement Equipment
• Brushed and Brushless DC Motor Drivers
• Solar Energy String Invertors

Available Packages

LM7805 and LM7812 KTT Package 3-Pin DDPAK/TO-263 Top View

LM7805, LM7812, and LM7815 NDE Package 3-Pin TO-220 Top View

LM340K-5.0 NDS Package 2-Pin TO-3 Top View

Pin Functions

| | PIN | |-------------|-----|-----|--------------------|--|--|--| | NAME
NO. | | I/O | DESCRIPTION | | INPUT | 1 | I | Input voltage pin | | GND | 2 | I/O | Ground pin | | OUTPUT
3 | | O | Output voltage pin |

IOUT = 1 A, 0°C ≤ T^J ≤ 125°C (LM340A) unless otherwise specified(1)

⁽¹⁾ All characteristics are measured with a 0.22-μF capacitor from input to ground and a 0.1-μF capacitor from output to ground. All characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (t^w ≤ 10 ms, duty cycle ≤ 5%). Output voltage changes due to changes in internal temperature must be taken into account separately.

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over operating free-air temperature range (unless otherwise noted) (1)(2)

| | | MIN | MAX | UNIT | |---------------------------------------|-----------------------------------------------------------------------------------------------------------------------------------------------------------------------|-----|-----|------|--| | DC input voltage | power dissipation ⁽³⁾ In junction temperature Inperature (soldering, 10 sec.) TO-3 package (NDS) Lead temperature 1,6 mm (1/16 in) from case for 10 sec. | | | V | | Internal power dissipation (3) | rnal power dissipation (3) kimum junction temperature d temperature (soldering, 10 sec.) TO-3 package (NDS) Lead temperature 1,6 mm (1/16 in) from case for 10 | | Maximum junction temperature | · · · · | | Land to an automa (acidaria a 10 aca) | TO-3 package (NDS) | | 300 | °C | | Lead temperature (soldering, 10 sec.) | Lead temperature 1,6 mm (1/16 in) from case for 10 s | | 230 | °C | | Storage temperature | | -65 | 150 | °C |

• (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
• (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
• (3) The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation $(T_{JMAX} = 125^{\circ}\text{C} \text{ or } 150^{\circ}\text{C})$ , the junction-to-ambient thermal resistance $(\theta_{JA})$ , and the ambient temperature $(T_A)$ . $P_{DMAX} = (T_{JMAX} T_A)/\theta_{JA}$ . If this dissipation is exceeded, the die temperature rises above $T_{JMAX}$ and the electrical specifications do not apply. If the die temperature rises above 150°C, the device goes into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal resistance $(\theta_{JA})$ is 39°C/W. When using a heat sink, $\theta_{JA}$ is the sum of the 4°C/W junction-to-case thermal resistance $(\theta_{JC})$ of the TO-3 package and the case-to-ambient thermal resistance of the heat sink. For the TO-220 package (NDE), $\theta_{JA}$ is 54°C/W and $\theta_{JC}$ is 4°C/W. If SOT-223 is used, the junction-to-ambient thermal resistance is 174°C/W and can be reduced by a heat sink (see Applications Hints on heat sinking).If the DDPAK\TO-263 package is used, the thermal resistance can be reduced by increasing the PCB copper area thermally connected to the package: Using 0.5 square inches of copper area, $\theta_{JA}$ is 50°C/W; with 1 square inch of copper area, $\theta_{JA}$ is 37°C/W; and with 1.6 or more inches of copper area, $\theta_{JA}$ is 32°C/W.

over operating free-air temperature range (unless otherwise noted)

6.4 Thermal Information

| | | LM340, LM7805 Family | |------------------------|----------------------------------------------|-----------------------|------------------|---------------|--------|------|--| | | THERMAL METRIC ⁽¹⁾ | KTT
(DDPAK/TO-263) | DCY
(SOT-223) | NDS
(TO-3) | UNIT | | | | 3 PINS | 3 PINS | 4 PINS | 2 PINS | | $R_{\theta JA}$ | Junction-to-ambient thermal resistance | 23.9 | 44.8 | 62.1 | 39 | °C/W | | $R_{\theta JC(top)}$ | Junction-to-case (top) thermal resistance | 16.7 | 45.6 | 44 | 2 | °C/W | | $R_{\theta JB}$ | Junction-to-board thermal resistance | 5.3 | 24.4 | 10.7 | _ | °C/W | | ΨЈT | Junction-to-top characterization parameter | 3.2 | 11.2 | 2.7 | _ | °C/W | | ΨЈB | Junction-to-board characterization parameter | 5.3 | 23.4 | 10.6 | _ | °C/W | | R _θ JC(bot) | Junction-to-case (bottom) thermal resistance | 1.7 | 1.5 | _ | _ | °C/W | For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

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| | | LM340, LM7805 Family | |------------------------|----------------------------------------------|-----------------------|------------------|---------------|--------|------|--| | | THERMAL METRIC ⁽¹⁾ | KTT
(DDPAK/TO-263) | DCY
(SOT-223) | NDS
(TO-3) | UNIT | | | | 3 PINS | 3 PINS | 4 PINS | 2 PINS | | $R_{\theta JA}$ | Junction-to-ambient thermal resistance | 23.9 | 44.8 | 62.1 | 39 | °C/W | | $R_{\theta JC(top)}$ | Junction-to-case (top) thermal resistance | 16.7 | 45.6 | 44 | 2 | °C/W | | $R_{\theta JB}$ | Junction-to-board thermal resistance | 5.3 | 24.4 | 10.7 | _ | °C/W | | ΨЈT | Junction-to-top characterization parameter | 3.2 | 11.2 | 2.7 | _ | °C/W | | ΨЈB | Junction-to-board characterization parameter | 5.3 | 23.4 | 10.6 | _ | °C/W | | R _θ JC(bot) | Junction-to-case (bottom) thermal resistance | 1.7 | 1.5 | _ | _ | °C/W | For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

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