LC709203FQH-0XTWG

• Wireless Handsets
• Smartphones / PDA devices
• MP3 players
• Digital cameras
• Portable Game Players
• USB-related devices

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WDFN8 3x4, 0.65P Pb-Free, Halogen Free type

WLCSP9, 1.60x1.76 Pb-Free, Halogen Free type

WDFN8	WLP9	Pin Name	I/O	Description
1	1B	TEST	I	Connect this pin to V SS .
2	1A	V SS		Connect this pin to the battery's negative ( ) pin.
3	3A	V DD		Connect this pin to the battery's positive (+) pin.
4	2A	ALARMB	O	This pin indicates alarm by low output(open drain). Pull-up must be done externally. Alarm conditions are specified by registers (0x13 or 0x14). Connect this pin to V SS when not in use.
5	3B	TSW	O	Power supply output for thermistor. This pin goes HIGH during temperature read operation. Resistance value of TSW (for thermistor pull-up) must be the same value as the thermistor. (Note 1)
6	3C	TSENSE	I	Thermistor sense input. If you connect this pin to thermistor, insert 100 resistance between them for ESD. (Note 1)
7	1C	SDA	I/O	I 2 C Data pin (open drain). Pull-up must be done externally.
8	2C	SCL	I/O	I 2 C Clock pin (open drain). Pull-up must be done externally.
	2B	NC		Don't care.

Note 1 : TSW and TSENSE must be disconnected as figure 1 when not in use.

Table 2. Absolute Maximum Ratings at Ta = 25 C, V SS = 0 V

Parameter	Symbol	Pin/Remarks	Conditions		Specification	Specification	Specification	Unit
				V DD [ V ]	min	typ	max
Maximum supply voltage	V DD max	V DD			0.3		+6.5	V
Input voltage	V I (1)	TSENSE			0.3		V DD +0.3	V
Output voltage	V o (1) V o (2)	TSW ALARMB			0.3 0.3		V DD +0.3	V V
Input/output voltage	V IO (1)	SDA, SCL			0.3		+5.5	V
Allowable power dissipation	Pd max	WDFN8	Ta = 40 to +85 C				480	mW
Allowable power dissipation		WLP9					210	mW
Operating ambient temperature	Topr				40		+85	C
Storage ambient temperature	Tstg				55		+125	C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

Table 3. Allowable Operating Conditions at Ta = 40 to +85 C, V SS = 0 V

Parameter	Symbol	Pin/Remarks	Conditions		Specification	Specification	Specification	Unit
				V DD [ V ]	min	typ	max
Operating supply voltage	V DD (1)	V DD			2.5		4.5	V
High level input voltage	V IH (1)	TSENSE		2.5 to 4.5	0.7V DD		V DD	V
	V IH (2)	ALARMB, SDA, SCL		2.5 to 4.5	1.4			V
Low level input voltage	V IL (1)	TSENSE		2.5 to 4.5	V SS		0.25V DD	V
	V IL (2)	ALARMB, SDA, SCL		2.5 to 4.5			0.5	V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.

Table 4. Electrical Characteristics at Ta = 40 to +85 C, V SS = 0 V

Parameter	Symbol	Pin/Remarks	Conditions		Specification	Specification	Specification	Unit
				V DD [V]	min	typ	max
High level input current	I IH (1)	SDA, SCL	V IN = V DD (including output transistor off leakage current)	2.5 to 4.5			1	A
Low level input current	I IL (1)	SDA, SCL	V IN = V SS (including output transistor off leakage current)	2.5 to 4.5	1			A
High level output voltage	V OH (1)	TSW	I OH = 0.4 mA	3.0 to 4.5	V DD 0.4			V
High level output voltage	V OH (2)		I OH = 0.2 mA	2.5 to 4.5	V DD 0.4			V
Low level output voltage	V OL (1)	TSW, ALARMB,	I OL = 3.0 mA	3.0 to 4.5			0.4	V
Low level output voltage	V OL (2)	SDA, SCL	I OL = 1.3 mA	2.5 to 4.5			0.4	V
Hysteresis voltage	VHYS(1)	SDA, SCL		2.5 to 4.5		0.1V DD		V
Pin capacitance	CP	All pins	Pins other than the pin under test VIN = V SS Ta = 25 C	2.5 to 4.5		10		pF
Reset Release Voltage(Note 2)	V RR	V DD					2.4	V
Initialization Time after Reset release(Note 2)	T INIT			2.4 to 4.5			90	ms
Auto sleep set time	T ATS			2.4 to 4.5		1	1.2	s
Time measurement accuracy	T ME		Ta = 20 C to +70 C	2.5 to 4.5	3.5		+3.5	%
Consumption current	I DD (1)	V DD	Operational mode	2.5 to 4.5		3	4.5	A
(Note 3)	I DD (2)		Sleep mode	2.5 to 4.5		1	2	A
Voltage measurement	V ME (1)	V DD	Ta = +25 C	3.6	7.5		+7.5	mV/cell
accuracy	V ME (2)		Ta = 20 C to +70 C	2.5 to 4.5	20		+20	mV/cell

Note 2 : Once V DD voltage exceeds over the V RR , this LSI will release RESET status. And the LSI goes into Sleep mode T INIT after it. Note 3 : Consumption current is a value in the range of 20 C to +70 C.

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

Table 5. I 2 C Slave Characteristics at Ta = 40 to +85 C, V SS = 0 V

Parameter	Symbol	Pin/Remarks	Conditions		Specification	Specification	unit
				V DD [V]	min	Max
Clock frequency	TSCL	SCL		2.5 to 4.5		400	kHz
Bus free time between STOP condition and START condition	TBUF	SCL, SDA	See Fig. 5.	2.5 to 4.5	1.3		s
Hold time (repeated) START condition First clock pulse is generated after this interval	THD:STA	SCL, SDA	See Fig. 5.	2.5 to 4.5	0.6		s
Repeated START condition setup time	TSU:STA	SCL, SDA	See Fig. 5.	2.5 to 4.5	0.6		s
STOP condition setup time	TSU:STO	SCL, SDA	See Fig. 5.	2.5 to 4.5	0.6		s
Data hold time	THD:DAT	SCL, SDA	See Fig. 5.	2.5 to 4.5	0	0.9	s
Data setup time	TSU:DAT	SCL, SDA	See Fig. 5.	2.5 to 4.5	100		ns
Clock low period	TLOW	SCL	See Fig. 5.	2.5 to 4.5	1.3		s
Clock high period	THIGH	SCL	See Fig. 5.	2.5 to 4.5	0.6		s
Clock/data fall time	TF	SCL, SDA		2.5 to 4.5	20 + 0.1C B	300	ns
Clock/data rise time	TR	SCL, SDA		2.5 to 4.5	20 + 0.1C B	300	ns
Wake up time from Sleep mode	TWU	SDA	See Fig. 6.	2.5 to 4.5		400	s
SDA low pulse width to wake up	TSP	SDA	See Fig. 6.	2.5 to 4.5	0.6		s
Wake up retention time from the falling edge of SDA	TWR1	SDA	See Fig. 6.	2.5 to 4.5	500		ms
Wake up retention time from STOP condition	TWR2	SCL, SDA	See Fig. 6.	2.5 to 4.5	500		ms

Figure 5. I 2 C Timing Diagram

Table 5. I 2 C Slave Characteristics at Ta = 40 to +85 C, V SS = 0 V

Figure 1. Example of an application schematic using LC709203F (Temperature input via I 2 C.)

Figure 2. Example of an application schematic using LC709203F (The temperature is measured directly by a thermistor.)

Figure 1. Example of an application schematic using LC709203F (Temperature input via I 2 C.)

Figure 3. Simplified Block Diagram

Figure 2. Example of an application schematic using LC709203F (The temperature is measured directly by a thermistor.)

Figure 4. Pin Assignment

Figure 3. Simplified Block Diagram