ISO7740F

ISO774x High-Speed, Robust-EMC Reinforced and Basic Quad-Channel Digital Isolators

Manufacturer

Texas Instruments

Overview

Part 1: Markdown Summary

Part: ISO774x from Texas Instruments

Type: Quad-Channel Digital Isolator

Key Specs:

  • Data rate: 100Mbps
  • Isolation rating: Up to 5000VRMS
  • Supply range: 2.25V to 5.5V
  • Temperature range: –55°C to 125°C
  • Power consumption: 1.5mA per channel at 1Mbps (typical)
  • Propagation delay: 10.7ns typical (5V Supplies)

Features:

  • Robust isolation barrier: >30-year projected lifetime at 1500VRMS working voltage, Up to 12.8kV surge capability, ±100kV/μs typical CMTI
  • 2.25V to 5.5V level translation
  • Default output high (ISO774x) and low (ISO774xF) options
  • Robust electromagnetic compatibility (EMC): System-level ESD, EFT, and surge immunity, ±8kV IEC 61000-4-2 contact discharge protection across isolation barrier, Low emissions
  • Wide-SOIC (DW-16) and QSOP (DBQ-16) package options
  • Automotive version available: ISO774x-Q1
  • Safety-related certifications: DIN EN IEC 60747-17 (VDE 0884-17), UL 1577, IEC 61010-1, IEC 62368-1, IEC 60601-1, and GB 4943.1
  • Enable pins for high impedance output and reduced power consumption
  • Channel configurations: ISO7740 (all four channels same direction), ISO7741 (three forward, one reverse), ISO7742 (two forward, two reverse)

Applications:

  • Industrial automation
  • Motor control
  • Power supplies
  • Solar inverters
  • Medical equipment

Package:

  • SOIC (DW): 10.30mm × 10.30mm (package size), 10.30mm × 7.50mm (body size)
  • SSOP (DBQ): 4.90mm × 6.0mm (package size), 4.90mm × 3.90mm (body size)

Features

  • 100Mbps data rate
  • Robust isolation barrier:

    • 30-year projected lifetime at 1500VRMS working voltage

    • Up to 5000VRMS isolation rating
    • Up to 12.8kV surge capability
    • ±100kV/μs typical CMTI
  • Wide supply range: 2.25V to 5.5V
  • 2.25V to 5.5V level translation
  • Default output high (ISO774x ) and low (ISO774xF) options
  • Wide temperature range: –55°C to 125°C
  • Low power consumption, typical 1.5mA per channel at 1Mbps
  • Low propagation delay: 10.7ns typical (5V Supplies)
  • Robust electromagnetic compatibility (EMC)
    • System-level ESD, EFT, and surge immunity
    • ±8kV IEC 61000-4-2 contact discharge protection across isolation barrier
    • Low emissions
  • Wide-SOIC (DW-16) and QSOP (DBQ-16) package options
  • Automotive version available: ISO774x-Q1
  • Safety-related certifications:
    • DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 component recognition program
    • IEC 61010-1, IEC 62368-1, IEC 60601-1, and GB 4943.1 certifications

Applications

Package Information

PART NUMBERPACKAGE(1)PACKAGE
SIZE(2)		BODY SIZE (NOM)
ISO7740SOIC (DW)10.30mm ×
10.30mm		10.30mm ×
7.50mm
ISO7741
ISO7742		SSOP (DBQ)4.90mm ×
6.0mm		4.90mm × 3.90mm
ISO7741BSOIC (DW)10.30mm ×
10.30mm		10.30mm ×
7.50mm
  • (1) For more information, see Section 11.
  • (2) The package size (length × width) is a nominal value and includes pins, where applicable.

Pin Configuration

Figure 4-1. ISO7740 DW and DBQ Packages 16-Pin SOIC-WB and QSOP Top View

Figure 4-2. ISO7741 DW and DBQ Packages 16-Pin SOIC-WB and QSOP Top View

Figure 4-3. ISO7742 DW and DBQ Packages 16-Pin SOIC-WB and QSOP Top View

Table 4-1. Pin Functions

PIN_ (1)PEOGRAPION
NAMEISO7740ISO7741ISO7742Type (1)DESCRIPTION
EN1_77IOutput enable 1. Output pins on side 1 are enabled when EN1 is high or open and in high-impedance state when EN1 is low.
EN2101010ıOutput enable 2. Output pins on side 2 are enabled when EN2 is high or open and in high-impedance state when EN2 is low.
GND1222Cround connection for V
GNDT888Ground connection for V CC1
GND2999Cround connection for V
GNDZ151515_Ground connection for V CC2
INA333IInput, channel A
INB444IInput, channel B
INC5512IInput, channel C
IND61111IInput, channel D
NC7___Not connected
OUTA1414140Output, channel A
OUTB1313130Output, channel B
OUTC121250Output, channel C
OUTD11660Output, channel D
V CC1111_Power supply, side 1
V CC2161616_Power supply, side 2

(1) I = Input, O = Output

Electrical Characteristics

VCC1 = VCC2 = 5 V ±10% (over recommended operating conditions unless otherwise noted)

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
V OHHigh-level output voltageI OH = -4 mA; See Figure 6-1V CCO - 0.4 (1)4.8V
V OLLow-level output voltageI OL = 4 mA; See Figure 6-10.20.4V
V IT+(IN)Rising input switching threshold0.6 x V CCI0.7 x V CCIV
V IT-(IN)Falling input switching threshold0.3 x V CCI0.4 x V CCIV
V I(HYS)Input threshold voltage hysteresis0.1 x V CCI0.2 x V CCIV
I IHHigh-level input currentV IH = V CCI (1) at INx·10μΑ
I ILLow-level input currentV IL = 0 V at INx-10μΑ
I IHHigh-level input currentV IH = V CCI (1) at ENx20μΑ
I ILLow-level input currentV IL = 0 V at ENx-20μA
CMTІCommon mode transient immunityV I = V CCI or 0 V, V CM = 1200 V;
See Figure 6-4		85100kV/μs
CıInput Capacitance (2)VI = VCC/2 + 0.4 × sin(2π ft), f = 1
MHz, VCC = 5 V		2pF

(1) VCCI = Input-side VCC; VCCO = Output-side VCC (2) Measured from input pin to same side ground.

Absolute Maximum Ratings

See(1)

MINMAXUNIT
VCC1, VCC2Supply voltage (2)-0.56V
VVoltage at INx, OUTx, ENx-0.5VCCX + 0.5 (3)V
IOOutput current-1515mA
TJJunction temperature150°C
TstgStorage temperature-65150°C
  • (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime
  • (2) All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values
  • (3) Maximum voltage must not exceed 6 V.

5.2 ESD Ratings

VALUEUNIT
V(ESD)Human body model (HBM), per ANSI/
ESDA/JEDEC JS-001, all pins		±6000
Electrostatic dischargeCharged device model (CDM), per
JEDEC specification JESD22-C101, all
pins		±1500V
Contact discharge per IEC 61000-4-2;
Isolation barrier withstand test(1) (2)		±8000
  • (1) IEC ESD strike is applied across the barrier with all pins on each side tied together creating a two-terminal device.
  • (2) Testing is carried out in air or oil to determine the intrinsic contact discharge capability of the device.

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Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MINNOMMAXUNIT
VCC1, VCC2Supply Voltage2.255.5V
VCC(UVLO+)UVLO threshold when supply voltage is rising22.25V
VCC(UVLO-)UVLO threshold when supply voltage is falling1.71.8V
VHYS(UVLO)Supply voltage UVLO hysteresis100200mV
IOHVCCO = 5 V (1)-4
High level output currentVCCO = 3.3 V-2mA
VCCO = 2.5 V-1
VCCO = 5 V4
IOLLow level output currentVCCO = 3.3 V2mA
VCCO = 2.5 V1
VIHHigh level Input voltage0.7 x VCCI (1)VCCIV
VILLow level Input voltage00.3 x VCCIV
DRData Rate(2)0100Mbps
TAAmbient temperature-5525125°C

(1) VCCI = Input-side VCC; VCCO = Output-side VCC.

(2) 100 Mbps is the maximum specified data rate, although higher data rates are possible.

5.4 Thermal Information

ISO774x
THERMAL METRIC(1)DW (SOIC)DBQ (QSOP)
16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance83.4109
RθJC(top)Junction-to-case (top) thermal resistance4654.4
RθJBJunction-to-board thermal resistance4851.9
ψJTJunction-to-top characterization parameter19.114.2
ψJBJunction-to-board characterization parameter47.551.4
RθJC(bot)Junction-to-case (bottom) thermal resistance——

5.5 Power Ratings

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ISO7740
PDMaximum power dissipation (both sides)VCC1 = VCC2 = 5.5 V, TJ
= 150°C, CL =		210mW
PD1Maximum power dissipation (side-1)15 pF, Input a 50-MHz 50% duty cycle
square wave		45mW
PD2Maximum power dissipation (side-2)165mW
ISO7741
PDMaximum power dissipation (both sides)VCC1 = VCC2 = 5.5 V, TJ
= 150°C, CL =		210mW
PD1Maximum power dissipation (side-1)15 pF, Input a 50-MHz 50% duty cycle75mW
PD2Maximum power dissipation (side-2)square wave135mW
ISO7742
PDMaximum power dissipation (both sides)VCC1 = VCC2 = 5.5 V, TJ
= 150°C, CL =		210mW
PD1Maximum power dissipation (side-1)15 pF, Input a 50-MHz 50% duty cycle105mW
PD2Maximum power dissipation (side-2)square wave105mW

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5.6 Insulation Specifications

PARAMETERTEST CONDITIONSVALUEUNIT
DW-16DBQ-16
CLRExternal clearance(1)Shortest terminal-to-terminal distance through air>8>3.7mm
CPGExternal creepage(1)Shortest terminal-to-terminal distance across the package surface>8>3.7mm
DTIDistance through the
insulation		Minimum internal gap (internal clearance)>17>17μm
CTIComparative tracking indexDIN EN 60112 (VDE 0303-11); IEC 60112>600>600V
Material groupAccording to IEC 60664-1II
Rated mains voltage ≤ 300 VRMSI-IVI-III
Overvoltage category per
IEC 60664-1		Rated mains voltage ≤ 600 VRMSI-IVn/a
Rated mains voltage ≤ 1000 VRMSI-IIIn/a
DIN EN IEC 60747-17 (VDE 0884-17) (2)
Maximum repetitive peakISO774x2121566VPK
VIORMisolation voltageAC voltage (bipolar)ISO7741B1414n/aVPK
AC voltage; Time dependent dielectric breakdownISO774x1500400
n/a
566
n/a
4242
5000
n/a
10000
n/a
Maximum working isolation(TDDB) Test; See Figure 8-7ISO7741B1000VRMS
VIOWMvoltageISO774x2121≤5
≤5
≤5
≅1
>1012
>1011
>109
2
DC voltageISO7741B1414VDC
VIOTMMaximum transient isolation
voltage		VTEST = VIOTM,
t = 60 s (qualification);
VTEST = 1.2 x VIOTM,
t= 1 s (100% production)		8000VPK
Maximum impulse voltage(3) Tested in air, 1.2/50-μs waveform per IECISO774x8000
VIMP62368-1ISO7741B6000VPK
Maximum surge isolationVIOSM ≥ 1.3 x VIMP; Tested in oil (qualificationISO774x12800
VIOSMvoltage(4)test), 1.2/50-μs waveform per IEC 62368-1ISO7741B7800VPK
Method a, After Input-output safety test subgroup 2/3,
Vini = VIOTM, tini = 60 s;
Vpd(m) = 1.2 x VIORM, tm = 10 s		≤5
Method a, After environmental tests subgroup 1,Vpd(m) = 1.6 x VIORM,
tm = 10 s (ISO774x)
qpdApparent charge(5)Vini = VIOTM, tini = 60 s;Vpd(m) = 1.3 x VIORM,
tm = 10 s (ISO7741B)		≤5pC
Method b: At routine test (100% production) and preconditioning (type
test);
Vini = 1.2 x VIOTM, tini = 1 s;
Vpd(m) = 1.875 x VIORM (ISO774x) or Vpd(m) = 1.5 x VIORM (ISO7741B),
tm = 1 s (method b1) or
Vpd(m) = Vini, tm = tini (method b2)		≤5
CIOBarrier capacitance, input to
output(6)		VIO = 0.4 x sin (2πft), f = 1 MHz≅1pF
VIO = 500 V, TA = 25°C>1012
RIOIsolation resistance(6)VIO = 500 V, 100°C ≤ TA ≤ 125°C>1011Ω
VIO = 500 V at TS = 150°C>109
Pollution degree2
55/125/55/125/

PARAMETERTEST CONDITIONSVALUEUNIT
DW-16DBQ-16
VISOMaximum withstanding
isolation voltage		VTEST = VISO , t = 60 s (qualification),
VTEST = 1.2 x VISO , t = 1 s (100% production)		50003000VRMS
  • (1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become equal in certain cases. Techniques such as inserting grooves and/or ribs on a printed-circuit board are used to help increase these specifications.
  • (2) This coupler is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured by means of suitable protective circuits.
  • (3) Testing is carried out in air to determine the surge immunity of the package.
  • (4) Testing is carried out in oil to determine the intrinsic surge immunity of the isolation barrier.
  • (5) Apparent charge is electrical discharge caused by a partial discharge (pd).
  • (6) All pins on each side of the barrier tied together creating a two-terminal device.

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5.7 Safety-Related Certifications

VDECSAULCQCTUV
Certified according to DIN
EN IEC 60747-17 (VDE
0884-17)		Certified according to IEC
62368-1 and IEC 60601-1		Certified according to
UL 1577 Component
Recognition Program		Certified according to GB
4943.1		Certified according to EN
61010-1 and EN 62368-1
Maximum transient
isolation voltage, 8000 VPK
(DW-16) and 4242 VPK
(DBQ-16);
Maximum repetitive peak
isolation voltage, 2121 VPK
(DW-16, Reinforced),
1414 VPK (DW-16, Basic)
and 566 VPK (DBQ-16);
Maximum surge isolation
voltage, 12800 VPK
(DW-16, Reinforced),
7800 VPK (DW-16, Basic)
and 10000 VPK (DBQ-16)		Reinforced insulation
per CSA 62368-1 and
IEC 62368-1 600VRMS
(DW-16) and 370
VRMS (DBQ-16) max
working voltage (pollution
degree 2, material group
I);
2 MOPP (Means of Patient
Protection) per CSA
60601-1 and IEC 60601-1,
250 VRMS (DW-16) max
working
voltage		DW-16: Single protection,
5000 VRMS;
DBQ-16: Single protection,
3000 VRMS		DW-16: Reinforced
Insulation, Altitude ≤ 5000
m, Tropical Climate, 700
VRMS maximum working
voltage;
DBQ-16: Basic Insulation,
Altitude ≤ 5000 m, Tropical
Climate, 400 VRMS
maximum working voltage		5000 VRMS (DW-16) and
3000 VRMS (DBQ-16)
Reinforced insulation per
EN 61010-1 up to
working voltage of 600
VRMS (DW-16) and 300
VRMS (DBQ-16)
5000 VRMS (DW-16) and
3000 VRMS (DBQ-16)
Reinforced insulation per
EN 62368-1 up to
working voltage of 600
VRMS (DW-16) and 370
VRMS (DBQ-16)
Reinforced certificate:
40040142
Basic certificate:
40047657		Master contract number:
220991		File number: E181974Certificate numbers:
CQC21001304083
(DW-16)
CQC18001199097
(DBQ-16)		Client ID number: 77311

5.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
DW-16 PACKAGE
R θJA =83.4°C/W, V I = 5.5 V, T J = 150°C,
T A = 25°C, see Figure 5-1		273
IsSafety input, output, or supply currentRθ JA = 83.4°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 5-1416mA
TARθ JA = 83.4 °C/W, VI = 2.75 V, TJ = 150 °C, TA = 25 °C, see Figure 5-1545
PsSafety input, output, or total powerRθ JA = 83.4°C/W, TJ = 150°C, TA = 25°C, see Figure 5-31499mW
TsMaximum safety temperature150°C
DBQ-16 PACKAGE
R θJA =109°C/W, V I = 5.5 V, T J = 150°C,
T A = 25°C, see Figure 5-2		209
IsSafety input, output, or supply currentRθ JA = 109°C/W, VI = 3.6 V, TJ = 150°C,
TA = 25°C, see Figure 5-2		319
417
Rθ JA = 109°C/W, VI = 2.75 V, TJ = 150°C,
TA = 25°C, see Figure 5-2
PsSafety input, output, or total powerRθ JA = 109°C/W, TJ = 150°C, TA = 25°C, see Figure 5-41147mW
T SMaximum safety temperature150°C

(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA.

Copyright © 2024 Texas Instruments Incorporated Product Folder Links: ISO7740 ISO7741 ISO7742

The junction-to-air thermal resistance, Rθ JA , in the table above is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:

TJ = TA + Rθ JA × P , where P is the power dissipated in the device.

TJ(max) = TS = TA + Rθ JA × PS , where TJ(max) is the maximum allowed junction temperature.

PS = IS × VI , where VI is the maximum input voltage.

Thermal Information

ISO774x
THERMAL METRIC(1)DW (SOIC)DBQ (QSOP)
16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance83.4109
RθJC(top)Junction-to-case (top) thermal resistance4654.4
RθJBJunction-to-board thermal resistance4851.9
ψJTJunction-to-top characterization parameter19.114.2
ψJBJunction-to-board characterization parameter47.551.4
RθJC(bot)Junction-to-case (bottom) thermal resistance——

5.5 Power Ratings

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ISO7740
PDMaximum power dissipation (both sides)VCC1 = VCC2 = 5.5 V, TJ
= 150°C, CL =		210mW
PD1Maximum power dissipation (side-1)15 pF, Input a 50-MHz 50% duty cycle
square wave		45mW
PD2Maximum power dissipation (side-2)165mW
ISO7741
PDMaximum power dissipation (both sides)VCC1 = VCC2 = 5.5 V, TJ
= 150°C, CL =		210mW
PD1Maximum power dissipation (side-1)15 pF, Input a 50-MHz 50% duty cycle75mW
PD2Maximum power dissipation (side-2)square wave135mW
ISO7742
PDMaximum power dissipation (both sides)VCC1 = VCC2 = 5.5 V, TJ
= 150°C, CL =		210mW
PD1Maximum power dissipation (side-1)15 pF, Input a 50-MHz 50% duty cycle105mW
PD2Maximum power dissipation (side-2)square wave105mW

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5.6 Insulation Specifications

PARAMETERTEST CONDITIONSVALUEUNIT
DW-16DBQ-16
CLRExternal clearance(1)Shortest terminal-to-terminal distance through air>8>3.7mm
CPGExternal creepage(1)Shortest terminal-to-terminal distance across the package surface>8>3.7mm
DTIDistance through the
insulation		Minimum internal gap (internal clearance)>17>17μm
CTIComparative tracking indexDIN EN 60112 (VDE 0303-11); IEC 60112>600>600V
Material groupAccording to IEC 60664-1II
Rated mains voltage ≤ 300 VRMSI-IVI-III
Overvoltage category per
IEC 60664-1		Rated mains voltage ≤ 600 VRMSI-IVn/a
Rated mains voltage ≤ 1000 VRMSI-IIIn/a
DIN EN IEC 60747-17 (VDE 0884-17) (2)
Maximum repetitive peakISO774x2121566VPK
VIORMisolation voltageAC voltage (bipolar)ISO7741B1414n/aVPK
AC voltage; Time dependent dielectric breakdownISO774x1500400
n/a
566
n/a
4242
5000
n/a
10000
n/a
Maximum working isolation(TDDB) Test; See Figure 8-7ISO7741B1000VRMS
VIOWMvoltageISO774x2121≤5
≤5
≤5
≅1
>1012
>1011
>109
2
DC voltageISO7741B1414VDC
VIOTMMaximum transient isolation
voltage		VTEST = VIOTM,
t = 60 s (qualification);
VTEST = 1.2 x VIOTM,
t= 1 s (100% production)		8000VPK
Maximum impulse voltage(3) Tested in air, 1.2/50-μs waveform per IECISO774x8000
VIMP62368-1ISO7741B6000VPK
Maximum surge isolationVIOSM ≥ 1.3 x VIMP; Tested in oil (qualificationISO774x12800
VIOSMvoltage(4)test), 1.2/50-μs waveform per IEC 62368-1ISO7741B7800VPK
Method a, After Input-output safety test subgroup 2/3,
Vini = VIOTM, tini = 60 s;
Vpd(m) = 1.2 x VIORM, tm = 10 s		≤5
Method a, After environmental tests subgroup 1,Vpd(m) = 1.6 x VIORM,
tm = 10 s (ISO774x)
qpdApparent charge(5)Vini = VIOTM, tini = 60 s;Vpd(m) = 1.3 x VIORM,
tm = 10 s (ISO7741B)		≤5pC
Method b: At routine test (100% production) and preconditioning (type
test);
Vini = 1.2 x VIOTM, tini = 1 s;
Vpd(m) = 1.875 x VIORM (ISO774x) or Vpd(m) = 1.5 x VIORM (ISO7741B),
tm = 1 s (method b1) or
Vpd(m) = Vini, tm = tini (method b2)		≤5
CIOBarrier capacitance, input to
output(6)		VIO = 0.4 x sin (2πft), f = 1 MHz≅1pF
VIO = 500 V, TA = 25°C>1012
RIOIsolation resistance(6)VIO = 500 V, 100°C ≤ TA ≤ 125°C>1011Ω
VIO = 500 V at TS = 150°C>109
Pollution degree2
55/125/55/125/

PARAMETERTEST CONDITIONSVALUEUNIT
DW-16DBQ-16
VISOMaximum withstanding
isolation voltage		VTEST = VISO , t = 60 s (qualification),
VTEST = 1.2 x VISO , t = 1 s (100% production)		50003000VRMS
  • (1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become equal in certain cases. Techniques such as inserting grooves and/or ribs on a printed-circuit board are used to help increase these specifications.
  • (2) This coupler is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured by means of suitable protective circuits.
  • (3) Testing is carried out in air to determine the surge immunity of the package.
  • (4) Testing is carried out in oil to determine the intrinsic surge immunity of the isolation barrier.
  • (5) Apparent charge is electrical discharge caused by a partial discharge (pd).
  • (6) All pins on each side of the barrier tied together creating a two-terminal device.

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Product Folder Links: ISO7740 ISO7741 ISO7742

5.7 Safety-Related Certifications

VDECSAULCQCTUV
Certified according to DIN
EN IEC 60747-17 (VDE
0884-17)		Certified according to IEC
62368-1 and IEC 60601-1		Certified according to
UL 1577 Component
Recognition Program		Certified according to GB
4943.1		Certified according to EN
61010-1 and EN 62368-1
Maximum transient
isolation voltage, 8000 VPK
(DW-16) and 4242 VPK
(DBQ-16);
Maximum repetitive peak
isolation voltage, 2121 VPK
(DW-16, Reinforced),
1414 VPK (DW-16, Basic)
and 566 VPK (DBQ-16);
Maximum surge isolation
voltage, 12800 VPK
(DW-16, Reinforced),
7800 VPK (DW-16, Basic)
and 10000 VPK (DBQ-16)		Reinforced insulation
per CSA 62368-1 and
IEC 62368-1 600VRMS
(DW-16) and 370
VRMS (DBQ-16) max
working voltage (pollution
degree 2, material group
I);
2 MOPP (Means of Patient
Protection) per CSA
60601-1 and IEC 60601-1,
250 VRMS (DW-16) max
working
voltage		DW-16: Single protection,
5000 VRMS;
DBQ-16: Single protection,
3000 VRMS		DW-16: Reinforced
Insulation, Altitude ≤ 5000
m, Tropical Climate, 700
VRMS maximum working
voltage;
DBQ-16: Basic Insulation,
Altitude ≤ 5000 m, Tropical
Climate, 400 VRMS
maximum working voltage		5000 VRMS (DW-16) and
3000 VRMS (DBQ-16)
Reinforced insulation per
EN 61010-1 up to
working voltage of 600
VRMS (DW-16) and 300
VRMS (DBQ-16)
5000 VRMS (DW-16) and
3000 VRMS (DBQ-16)
Reinforced insulation per
EN 62368-1 up to
working voltage of 600
VRMS (DW-16) and 370
VRMS (DBQ-16)
Reinforced certificate:
40040142
Basic certificate:
40047657		Master contract number:
220991		File number: E181974Certificate numbers:
CQC21001304083
(DW-16)
CQC18001199097
(DBQ-16)		Client ID number: 77311

5.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
DW-16 PACKAGE
R θJA =83.4°C/W, V I = 5.5 V, T J = 150°C,
T A = 25°C, see Figure 5-1		273
IsSafety input, output, or supply currentRθ JA = 83.4°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 5-1416mA
TARθ JA = 83.4 °C/W, VI = 2.75 V, TJ = 150 °C, TA = 25 °C, see Figure 5-1545
PsSafety input, output, or total powerRθ JA = 83.4°C/W, TJ = 150°C, TA = 25°C, see Figure 5-31499mW
TsMaximum safety temperature150°C
DBQ-16 PACKAGE
R θJA =109°C/W, V I = 5.5 V, T J = 150°C,
T A = 25°C, see Figure 5-2		209
IsSafety input, output, or supply currentRθ JA = 109°C/W, VI = 3.6 V, TJ = 150°C,
TA = 25°C, see Figure 5-2		319
417
Rθ JA = 109°C/W, VI = 2.75 V, TJ = 150°C,
TA = 25°C, see Figure 5-2
PsSafety input, output, or total powerRθ JA = 109°C/W, TJ = 150°C, TA = 25°C, see Figure 5-41147mW
T SMaximum safety temperature150°C

(1) The maximum safety temperature, TS, has the same value as the maximum junction temperature, TJ, specified for the device. The IS and PS parameters represent the safety current and safety power respectively. The maximum limits of IS and PS should not be exceeded. These limits vary with the ambient temperature, TA.

Copyright © 2024 Texas Instruments Incorporated Product Folder Links: ISO7740 ISO7741 ISO7742

The junction-to-air thermal resistance, Rθ JA , in the table above is that of a device installed on a high-K test board for leaded surface-mount packages. Use these equations to calculate the value for each parameter:

TJ = TA + Rθ JA × P , where P is the power dissipated in the device.

TJ(max) = TS = TA + Rθ JA × PS , where TJ(max) is the maximum allowed junction temperature.

PS = IS × VI , where VI is the maximum input voltage.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
ISO7740Texas Instruments—
ISO7740-Q1Texas Instruments—
ISO7740-Q1.HTMLTexas Instruments—
ISO7740DBQRTexas InstrumentsSSOP-16-150mil
ISO7740DBQR.ATexas Instruments—
ISO7740DWRTexas Instruments—
ISO7740DWR.ATexas Instruments—
ISO7740FDBQRTexas Instruments—
ISO7740FDBQR.ATexas Instruments—
ISO7740FDWRTexas Instruments—
ISO7740FDWR.ATexas Instruments—
ISO7741Texas Instruments—
ISO7741BTexas Instruments—
ISO7742Texas Instruments—
ISO774XTexas Instruments—
ISO774X-Q1Texas Instruments—
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