IS31FL3741A-QFLS2-TR

LED Driver

The IS31FL3741A-QFLS2-TR is a led driver from Integrated Silicon Solution, Inc.. View the full IS31FL3741A-QFLS2-TR datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Integrated Silicon Solution, Inc.

Overview

Part: IS31FL3236 — Integrated Silicon Solution, Inc.

Type: LED Driver

Description: 36-channel constant current LED driver with independent 256-step PWM control and I2C interface, capable of driving LEDs up to 38mA per channel.

Operating Conditions:

Supply voltage: 2.7V to 5.5V
Operating temperature: -40°C to +85°C
Max I2C clock frequency: 400 kHz
PWM steps: 256

Absolute Maximum Ratings:

Max supply voltage: +6.0V
Max junction temperature: +150°C
Storage temperature range: -65°C to +150°C

Key Specs:

Number of channels: 36
Max global output current: 38 mA (VCC = 4.2V, VOUT = 0.8V, REXT = 2kΩ, SL = '00')
Output current setting: I_MAX, I_MAX/2, I_MAX/3, I_MAX/4
Quiescent power supply current: 9 mA (Typ, REXT = 3.3kΩ)
Shutdown current: 3 μA (Typ, VSDB = 0V or software shutdown, TA = 25°C, VCC = 3.6V)
Logic '1' input voltage: 1.4 V (Min, VCC = 2.7V~5.5V)
Logic '0' input voltage: 0.4 V (Max, VCC = 2.7V~5.5V)
I2C serial clock frequency: 400 kHz (Max)

Features:

2.7V to 5.5V supply
I2C interface, automatic address increment function
Internal reset register
Modulate LED brightness with 256 steps PWM
Each channel can be controlled independently
Each channel can be scaled independently by 1, 1/2, 1/3 and 1/4
-40°C to +85°C temperature range
QFN-44 (5mm × 5mm) and eTQFP-48 package

Applications:

Mobile phones and other hand-held devices for LED display
LED in home appliances

Package:

QFN-44 (5mm × 5mm)
eTQFP-48

Features

2.7V to 5.5V supply
I2C interface, automatic address increment function
Internal reset register
Modulate LED brightness with 256 steps PWM
Each channel can be controlled independently
Each channel can be scaled independently by 1, 1/2, 1/3 and 1/4
-40°C to +85°C temperature range
QFN-44 (5mm × 5mm) and eTQFP-48 package

Applications

Mobile phones and other hand-held devices for LED display
LED in home appliances

February 2018

Pin Configuration

Electrical Characteristics

Typical values are T A = 25°C, VCC = 3.6V.

Symbol	Parameter	Condition	Min.	Typ.	Max.	Unit
V CC	Supply voltage		2.7		5.5	V
I MAX	Maximum global output current	V CC = 4.2V, V OUT = 0.8V R EXT = 2k Ω , SL = '00' (Note 1)		38		mA
I OUT	Output current	V OUT = 0.6V R EXT = 3.3k Ω , SL = '00'		23		mA
I CC	Quiescent power supply current R EXT = 3.3k Ω	Quiescent power supply current R EXT = 3.3k Ω		9		mA
I SD	Shutdown current	V SDB = 0V or software shutdown T A = 25°C, V CC = 3.6V	2	3	5	μ A
I OZ	Output leakage current	V SDB = 0V or software shutdown, V OUT = 5.5V			0.2	μ A
V EXT	Output voltage of R_EXT pin			1.3		V
Logic Electrical Characteristics (SDA, SCL, SDB)	Logic Electrical Characteristics (SDA, SCL, SDB)	Logic Electrical Characteristics (SDA, SCL, SDB)	Logic Electrical Characteristics (SDA, SCL, SDB)	Logic Electrical Characteristics (SDA, SCL, SDB)	Logic Electrical Characteristics (SDA, SCL, SDB)	Logic Electrical Characteristics (SDA, SCL, SDB)
V IL	Logic '0' input voltage	V CC = 2.7V~5.5V			0.4	V
V IH	Logic '1' input voltage	V CC = 2.7V~5.5V	1.4			V
I IL	Logic '0' input current	V INPUT = 0V (Note 2)		5		nA
I IH	Logic '1' input current	V INPUT = V CC (Note 2)		5		nA

Absolute Maximum Ratings

Supply voltage, V CC	-0.3V ~ +6.0V
Voltage at SCL, SDA, SDB, OUT1 to OUT36	-0.3V ~ V CC +0.3V
Maximum junction temperature, T JMAX	+150°C
Storage temperature range, T STG	-65°C ~ +150°C
Operating temperature range, T A =T J	-40°C ~ +85°C
Package thermal resistance, junction to ambient (4 layer standard test PCB based on JEDEC standard), θ JA	32.65°C/W (QFN) 38.72°C/W (eTQFP)
ESD (HBM) ESD (CDM)	±8kV ±1kV

Typical Application

Figure 1 Typical Application Circuit

Note 1: The maximum global output current is set up to 23mA when REXT = 3.3k Ω . The maximum global output current can be set by external resistor, R EXT . Please refer to the detail information in Page 11.

Note 2: The IC should be placed far away from the mobile antenna in order to prevent the EMI.

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