HC32F460JEUA

Part: HC32F460 series — Huada Semiconductor Co., Ltd.

Type: 32-bit ARM Cortex-M4 Microcontroller

Description: 32-bit ARM Cortex-M4 MCU with FPU, MPU, DSP, up to 200 MHz operation, 512 KB Flash, 192 KB SRAM, USB FS (Device/Host), 14 Timers, 2 ADCs, 1 PGA, 3 CMPs, and 20 communication interfaces.

Operating Conditions:

• Supply voltage: 1.8–3.6 V
• Operating temperature: -40 to +105 °C (suffix-dependent — see Table 3-1 for grade-specific ranges)
• Max CPU frequency: 200 MHz

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V
• Max junction/storage temperature: 150 °C

Key Specs:

• CPU frequency: up to 200 MHz
• Flash memory: up to 512 KB
• SRAM: up to 192 KB
• ADC resolution: 12-bit
• ADC sampling rate: 2 MSPS
• Stop mode current consumption: typ. 90 μA @ 25°C
• Power down mode current consumption: as low as 1.8 μA @ 25°C
• GPIO: Max 83
• 5V-tolerant IO: Max 81

Features:

• ARMv7-M architecture 32bit Cortex-M4 CPU with integrated FPU, MPU, DSP, and CoreSight debugging unit
• Flash acceleration unit for 0-wait program execution
• Multiple low power consumption modes: Sleep, Stop, Power down
• 8-channel dual-host DMAC and USBFS dedicated DMAC
• Data Calculation Unit (DCU)
• 2 independent 12bit 2MSPS ADC, 1 PGA, 3 independent voltage comparators, 1 on-chip temperature sensor
• Multiple timer types: 3 multi-function 16bit PWM (Timer6), 3 16-bit motor PWM (Timer4), 6 16bit universal (TimerA), 2 16bit basic (Timer0)
• Up to 20 communication interfaces: 3 I2C, 4 USART, 4 SPI, 4 I2S, 2 SDIO, 1 QSPI, 1 CAN, 1 USB 2.0 FS
• Data encryption function: AES/HASH/TRNG

Applications:

Package:

• LQFP100 (14×14mm)
• VFBGA100 (7×7mm)
• LQFP64 (10×10mm)
• QFN60 (7×7mm)
• QFN48 (5×5mm)
• LQFP48 (7×7mm)

ARM Cortex-M4 32bit MCU+FPU, 250DMIPS, up to 512KB Flash, 192KB SRAM, USB FS (Device/Host), 14 Timers, 2 ADCs, 1 PGA, 3 CMPs, 20 communication interfaces

• ⚫ ARMv7-M architecture 32bit Cortex-M4 CPU, integrated FPU, MPU, DSP supporting SIMD instructions, and CoreSight standard debugging unit. The highest working frequency is 200MHz, and the Flash acceleration unit realizes 0-wait program execution, reaching the computing performance of 250DMIPS or 680Coremarks
• ⚫ Built-in memory
• -Flash memory up to 512KByte, supports security protection and data encryption *1
• -Maximum 192KByte SRAM, including 32KByte 200MHz single-cycle access highspeed RAM, 4KByte Retention RAM
• ⚫ Power, Clock, Reset Management
• -System power supply (Vcc): 1.8-3.6V
• -6 independent clock sources: External main clock crystal (4-25MHz), external secondary crystal (32.768kHz), internal high-speed RC (16/20MHz), internal medium-speed RC (8MHz), internal low-speed RC (32kHz), internal WDT dedicated RC (10kHz)
• -14 kinds of reset sources including power-on reset (POR), low voltage detection reset (LVDR), port reset (PDR), each reset source has an independent flag bit
• ⚫ Low power operation
• -Peripherals can be turned off or on independently
• -Three low power consumption modes: Sleep, Stop, Power down mode
• -Supports switching between ultra-high-speed mode, high-speed mode, and ultra-low-speed mode in Run mode and Sleep mode
• -Standby power consumption: Stop mode typ.90μA@25°C, Power down mode is as low as 1.8μA@25°C
• -In Power down mode, support 16 ports to wake
• up, support ultra-low power RTC work, 4KByte SRAM to hold data
• -Standby wakes up quickly, Stop mode wakes up as fast as 2us, Power down mode wakes up as fast as 20us
• ⚫ Peripheral operation support system significantly reduces CPU processing load
• -8-channel dual-host DMAC
• -USBFS dedicated DMAC
• -Data Calculation Unit (DCU)
• -Supports mutual triggering of peripheral events (AOS)
• ⚫ High-performance simulation
• -2 independent 12bit 2MSPS ADC
• -1 programmable gain amplifier (PGA)
• -3 independent voltage comparators (CMP), supporting 2 internal reference voltages
• -1 on-chip temperature sensor (OTS)
• ⚫ Timer
• -3 multi-function 16bit PWM Timer (Timer6)
• -3 16-bit motor PWM Timers (Timer4)
• -6 16bit universal Timer (TimerA)
• -2 16bit basic Timer (Timer0)
• ⚫ Maximum 83 GPIO
• -CPU single cycle access, maximum 100MHz output
• -Maximum 81 5V-tolerant IO
• ⚫ Maximum 20 communication interfaces
• -3 I2C, support SMBus protocol
• -4 USART, support ISO7816-3 protocol
• -4 SPI
• -4 I2S, built-in audio PLL to support audio-level sampling accuracy
• -2 SDIO, support SD/MMC/eMMC format
• -1 QSPI, support 200Mbps high-speed access (XIP)
• -1 CAN, supporting ISO11898-1 standard

protocol

• -1 USB 2.0 FS, built-in PHY, support Device/Host
• ⚫ Data encryption function
• -AES/HASH/TRNG
• ⚫ Encapsulation form:
• LQFP100 (14×14mm) VFBGA100 (7×7mm) LQFP64 (10×10mm) QFN60 (7×7mm)

QFN48 (5×5mm) LQFP48 (7×7mm)

*1: For the specific specifications of Flash security protection and data encryption, please consult the sales window.

I appreciate your detailed request, but I must be transparent: No datasheet section with pin configuration data has been provided in your message.

You've included:

• A section header "2 Pin Configuration and Functions (Pinouts)"
• A subsection header "2.1 Pin configuration diagram"
• No actual pin table, pin diagram image, or pin descriptions

What I need to extract the pinout for HC32F460JEUA:

1. A pin table (text) listing pin names and their functions, OR
2. A pin diagram image showing pin numbers and names, OR
3. Both (preferred, since the diagram provides numbering and the table provides descriptions)

Next steps:

Please provide:

• The actual pin configuration table from the datasheet (the rows that follow the "2.1 Pin configuration diagram" header)
• Any pin diagram/package drawing images for the LQFP100 package
• Ensure the content covers the HC32F460JEUA variant specifically

Once you supply the pin data or images, I'll extract a clean, structured pinout table following all the rules you've outlined.

Table3 - 21 I/O AC characteristics

1. The maximum frequency is atFigure3 -6 Defined in.
2. The load capacitance C L must take the capacitance of the PCB and MCU pins into account (the

capacitance of the pins and the circuit board can be roughly estimated as 10 pF).

最大频率条件: (t r + t f ) ≤ (2/3)T 并且 Duty cycle= 50%± 5% (负载电容 CL 在'输入 / 输出交流特性'表格的'条件'一栏中标明)

Figure3 -6 I/O AC characteristic definition

If the load on the device exceeds Table3-2 Voltage characteristics , Table3-3 Current characteristics withTable3 -4 Thermal characteristics The absolute maximum ratings listed in may cause permanent damage to the device. These values are just rated stresses and do not mean that the device works properly under these conditions. Long-term operation may affect the reliability .

sensitivity Table3-2 Voltage characteristics

1. Within the allowable range, all main power (VCC, A VCC) and ground (VSS, A VSS) pins must always be connected to an external power supply.
2. The maximum value of VIN must always be followed. For information on the maximum allowable injection current value, see Table3-3 .

Table3-3 Current characteristics

Table3-3 Current characteristics

1. Within the allowable range, all main power (VCC, A VCC) and ground (VSS, A VSS) pins must always be connected to an external power supply.

Table3 -4 Thermal characteristics

Table3 -4 Thermal characteristics

When the packaged chip is working at the specified working environment temperature, the junction temperature Tj (°C) of the chip table can be calculated according to the following formula:

• Tamb refers to the working environment temperature when the packaged chip is working, the unit is °C;
• θJA refers to the thermal resistance coefficient of the package to the working environment, the unit is °C/W;
• PD is equal to the sum of internal power consumption of the chip and I/O power consumption, and the unit is W. The internal power consumption of the chip is the I DD × V DD of the product . I/O power consumption refers to the power consumption generated by the I/O pins when the chip is working. Usually, the value of this part is very small and can be ignored.

The junction temperature Tj on the table of the chip when the chip is operating at the specified operating ambient temperature must not exceed the maximum junction temperature TJ allowed by the chip.

Table4 -1 Thermal resistance coefficient table of each package

Table4 -1 Thermal resistance coefficient table of each package

HC32F460 series provide 48pin, 64pin, 100pin LQFP package, 48pin, 60pin QFN package, 100pin of VFBGA Package, It is suitable for high-performance motor frequency conversion control, intelligent hardware, IoT connection modules and other fields.