FS8205A
Dual N-Channel Enhancement Mode Power MOSFETThe FS8205A is a dual n-channel enhancement mode power mosfet from Fortune Semiconductor Corporation. View the full FS8205A datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Manufacturer
Fortune Semiconductor Corporation
Category
Dual N-Channel Enhancement Mode Power MOSFET
Package
TSSOP-8
Key Specifications
| Parameter | Value |
|---|---|
| Gate-Source Voltage (VGS) | ±12 V |
| Storage Temperature Range | -55 to 150 °C |
| Drain-Source Voltage (VDS) | 20 V |
| Operating Junction Temperature Range | -55 to 150 °C |
| Total Power Dissipation (PD @ 25°C) | 1 W |
| Continuous Drain Current (ID @ 25°C) | 6 A |
| On-Resistance (RDS(ON) @ VGS=2.5V, ID=3A) | 35 mΩ max |
| On-Resistance (RDS(ON) @ VGS=4.5V, ID=4A) | 25 mΩ max |
Overview
Part: FS8205A — Fortune Semiconductor Corporation
Type: Dual N-Channel Enhancement Mode Power MOSFET
Description: Dual N-Channel Enhancement Mode Power MOSFET featuring low on-resistance (25 mΩ max at VGS=4.5V, ID=4A) and a continuous drain current of 6 A at 25 °C, suitable for Li-ion battery management applications.
Operating Conditions:
- Operating junction temperature: -55 to 150 °C
- Gate threshold voltage: 0.5–1.0 V (VDS = VGS, ID = 250μA)
Absolute Maximum Ratings:
- Max drain-source voltage: 20 V
- Max gate-source voltage: ±12 V
- Max continuous drain current: 6 A (TA= 25 °C)
- Max pulsed drain current: 25 A
- Max junction/storage temperature: -55 to 150 °C
Key Specs:
- Drain-Source Breakdown Voltage (BVDSS): 20 V (VGS = 0V, ID = 250μA)
- Static Drain-Source On-Resistance (RDS(ON)): 25 mΩ max (VGS = 4.5V, ID = 4A)
- Static Drain-Source On-Resistance (RDS(ON)): 35 mΩ max (VGS = 2.5V, ID = 3A)
- Gate Threshold Voltage (VGS(th)): 0.5 V min, 1.0 V max (VDS = VGS, ID = 250μA)
- Drain-Source Leakage Current (IDSS): 1 μA max (Tj = 25 °C, VDS = 20V, VGS = 0V)
- Gate-Source Leakage (IGSS): ±10 μA max (VGS = ±10V)
- Thermal Resistance Junction-ambient (Rthj-a): 125 °C/W max
Features:
- Low on-resistance
- RDS(ON) = 25 mΩ MAX. (VGS = 4.5V, ID = 4A)
- RDS(ON) = 35 mΩ MAX. (VGS = 2.5V, ID = 3A)
Applications:
- Li-ion battery management applications
Package:
- TSSOP-8
Features
- 1.1 Low on-resistance 1.1.1 RDS(ON) = 25 m Ω MAX. (VGS = 4.5V, ID = 4A) 1.1.2 RDS(ON) = 35 m Ω MAX. (VGS = 2.5V, ID = 3A)
Pin Configuration
FSC'
Electrical Characteristics
Electrical Characteristics @Tj = 25 °C ( unless otherwise specified )
| Symbol | Parameter | Test Conditions | Min. | Typ. | Max. | Units |
|---|---|---|---|---|---|---|
| Static Characteristics | Static Characteristics | Static Characteristics | Static Characteristics | Static Characteristics | Static Characteristics | Static Characteristics |
| BV DSS | Drain-Source Breakdown Voltage | V GS = 0V, I D = 250μA | 20 | - | - | V |
| Δ BV DSS / Δ T j | Breakdown Voltage Temperature Coefficient | Reference to 25 °C , I D =1mA | - | 0.1 | - | V/ °C |
| R DS(ON) | Static Drain-Source On-Resistance 2 | V GS = 4.5V, I D = 4A | - | 21 | 25 | m Ω |
| V GS = 2.5V, I D = 3A | - | 27 | 35 | m Ω | ||
| V GS(th) | Gate Threshold Voltage | V DS = V GS , I D = 250μA | 0.5 | - | 1.0 | V |
| I DSS | Drain-Source Leakage Current (T j = 25 °C ) | V DS =20V, V GS = 0V | - | - | 1 | μA |
| I DSS | Drain-Source Leakage Current (T j = 70 °C ) | V DS =20V, V GS = 0V | - | - | 25 | μA |
| I GSS | Gate-Source Leakage | V GS = ± 10V | - | - | ± 10 | μA |
| Symbol | Parameter | Test Conditions | Min. | Typ. | Max. | Units |
|---|---|---|---|---|---|---|
| I S | Continuous Source Current (Body Diode) | V D = V G = 0V, V S = 1.2V | - | - | 0.83 | A |
| V SD | Forward On Voltage 2 | T j = 25 °C , I S = 1.25A, V GS = 0V | - | - | 1.2 | V |
FSC'
Properties
- Source-Drain Diode Notes : 1. Pulse width limited by Max. junction temperature. 2. Pulse width ≦ 300us, duty cycle ≦ 2%. 3. Surface mounted on 1 in 2 copper pad of FR4 board ; 208 °C /W when mounted on Min. copper pad. For Reference Onl
Absolute Maximum Ratings
| Symbol | Parameter | Rating | Units |
|---|---|---|---|
| VDS | Drain-Source Voltage | 20 | V |
| VGS | Gate-Source Voltage | ± 12 | V |
| ID @TA= 25 °C | Continuous Drain Current3 | 6 | A |
| ID @TA= 70 °C | Continuous Drain Current3 | 5 | A |
| IDM | Pulsed Drain Current1 | 25 | A |
| PD @TA= 25 °C | Total Power Dissipation | 1 | W |
| Linear Derating Factor | 0.008 | W/ °C | |
| TSTG | Storage Temperature Range | -55 to 150 | °C |
| TJ | Operating Junction Temperature Range | -55 to 150 | °C |
Properties
Thermal Information
| Symbol | Parameter | Value | Unit |
|---|---|---|---|
| Rthj-a | Thermal Resistance Junction-ambient3 | Max. 125 | °C /W |
For Reference Onl
Package Information
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