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FDS6679AZ

The FDS6679AZ is an electronic component. View the full FDS6679AZ datasheet below including electrical characteristics, absolute maximum ratings.

Overview

Part: FDS6679AZ — Fairchild Semiconductor

Type: P-Channel PowerTrench® MOSFET

Description: This P-Channel MOSFET is produced using Fairchild Semiconductor's advanced PowerTrench process, tailored to minimize on-state resistance, offering -30V drain-to-source voltage and -13A continuous drain current with a maximum rDS(on) of 9.3mΩ.

Operating Conditions:

  • Drain to Source Voltage: -30 V
  • Operating temperature: -55 to +150 °C
  • Max rDS(on): 9.3mΩ at VGS = -10V, ID = -13A

Absolute Maximum Ratings:

  • Max supply voltage: -30 V (Drain to Source Voltage)
  • Max continuous current: -13 A (Drain Current - Continuous)
  • Max junction/storage temperature: +150 °C

Key Specs:

  • Drain to Source Breakdown Voltage (BVDSS): -30 V (min) at ID = -250 μA, VGS = 0V
  • Zero Gate Voltage Drain Current (IDSS): -1 μA (max) at VDS = -24V, VGS = 0V
  • Gate to Source Threshold Voltage (VGS(th)): -1 V (min), -3 V (max) at VGS = VDS, ID = -250 μA
  • Drain to Source On Resistance (rDS(on)): 9.3 mΩ (max) at VGS = -10V, ID = -13A
  • Drain to Source On Resistance (rDS(on)): 14.8 mΩ (max) at VGS = -4.5V, ID = -11A
  • Input Capacitance (Ciss): 3845 pF (max) at VDS = -15V, VGS = 0V, f = 1MHz
  • Total Gate Charge (Qg): 96 nC (max) at VDS = -15V, VGS = -10V, ID = -13A
  • Source to Drain Diode Forward Voltage (VSD): -1.2 V (max) at VGS = 0V, IS = -2.1A

Features:

  • Max rDS(on) = 9.3mΩ at VGS = -10V, ID = -13A
  • Max rDS(on) = 14.8mΩ at VGS = -4.5V, ID = -11A
  • Extended VGS range (-25V) for battery applications
  • HBM ESD protection level of 6 kV typical
  • High performance trench technology for extremely low rDS(on)
  • High power and current handling capability
  • RoHS Compliant

Applications:

  • Power Management
  • Load switching applications common in Notebook Computers
  • Portable Battery Packs

Package:

  • FDS6679AZ

Features

  • Max r DS(on) = 9.3m Ω at V GS = -10V, I D = -13A
  • Max r DS(on) = 14.8m Ω at V GS = -4.5V, I D = -11A
  • Extended V GS range (-25V) for battery applications
  • HBM ESD protection level of 6 k V typical (note 3)
  • High performance trench technology for extremely low r DS(on)
  • High power and current handing capability
  • RoHS Compliant

Electrical Characteristics

SymbolParameterTest ConditionsMinTypMaxUnits
Off CharacteristicsOff Characteristics
B VDSSDrain to Source Breakdown VoltageI D = -250 μ A, V GS = 0V-30V
∆ B VDSS ∆ T JBreakdown Voltage Temperature CoefficientI D = -250 μ A, referenced to 25° C-20mV/°C
I DSSZero Gate Voltage Drain CurrentV DS = -24V, V GS =0V-1μ A
I GSSGate to Source Leakage CurrentV GS = ±25V, V DS =0V±10μ A

Absolute Maximum Ratings

SymbolParameterRatingsUnits
V DSDrain to Source Voltage-30V
V GSGate to Source Voltage±25V
I DDrain Current -Continuous-13A
I D-Pulsed-65A
P DPower Dissipation for Single Operation2.5W
P D1.2
P D1.0
T J , T STGOperating and Storage Temperature-55 to +150°C

Thermal Information

R θ JAThermal Resistance , Junction to Ambient (Note 1a)50°C/W
R θ JCThermal Resistance , Junction to Case (Note 1)25°C/W
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