ESP32-S3-WROOM-1-N16R2

Part: ESP32-S3-WROOM-1-N16R8 — Espressif

Type: Wi-Fi + Bluetooth LE MCU Module

Description: 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth 5 LE module built around the ESP32-S3 dual-core Xtensa LX7 SoC at up to 240 MHz, with 16 MB Quad SPI flash, 8 MB Octal SPI PSRAM and an on-board PCB antenna.

Operating Conditions:

• Supply voltage: 3.0–3.6 V (3.3 V typ)
• Operating ambient temperature: -40 to 65 °C (R8 variant; can be improved to 85 °C if PSRAM ECC is enabled, which reduces usable PSRAM by 1/16)
• Current delivered by external power supply: 0.5 A minimum

Absolute Maximum Ratings:

• Max supply voltage (VDD33): 3.6 V (min -0.3 V)
• Storage temperature: -40 to 105 °C

Key Specs:

• CPU: Xtensa dual-core 32-bit LX7 with single-precision FPU, up to 240 MHz
• Memory: 384 KB ROM, 512 KB SRAM, 16 KB RTC SRAM
• Flash: 16 MB (Quad SPI); PSRAM: 8 MB (Octal SPI)
• Wi-Fi: 802.11b/g/n, up to 150 Mbps (802.11n), 2412–2484 MHz
• Bluetooth LE: Bluetooth 5 and Bluetooth mesh; 125 Kbps, 500 Kbps, 1 Mbps and 2 Mbps
• GPIOs: up to 36, including 4 strapping pins
• Supply: 3.0–3.6 V, with at least 0.5 A from the external supply
• Module size: 18.0 × 25.5 × 3.1 mm

Features:

• Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna
• Peripherals: SPI, LCD interface, camera interface, UART, I2C, I2S, RMT, pulse counter, LED PWM, full-speed USB 2.0 OTG, USB Serial/JTAG, MCPWM, SD/MMC host, GDMA, TWAI (ISO 11898-1 compatible), ADC, touch sensor, temperature sensor
• Integrated 40 MHz crystal oscillator
• Low-power co-processor that can monitor peripherals while the CPU is powered off
• Acceleration for neural network and signal processing workloads
• On-board PCB antenna (the -1U variant uses an external antenna connector)
• RoHS/REACH green certification

Applications:

• Smart home
• Industrial automation
• Health care
• Consumer electronics
• Smart agriculture
• POS machines
• Service robots
• Audio devices
• IoT sensor hubs and data loggers
• Cameras for video streaming
• USB devices
• Speech and image recognition
• Wi-Fi + Bluetooth networking card
• Touch and proximity sensing

Package:

• SMD module, 41 pins (including EPAD ground), 18.0 × 25.5 × 3.1 mm

• FS and LS data rates

• HNP and SRP as A-device or B-device

• Dynamic FIFO (DFIFO) sizing

• Multiple modes of memory access

• -Scatter/Gather DMA mode

• -Buffer DMA mode

• -Slave mode

• Can choose integrated transceiver or external transceiver

• Utilizing integrated transceiver with USB Serial/JTAG by time-division multiplexing when only integrated transceiver is used

• Support USB OTG using one of the transceivers while USB Serial/JTAG using the other one when both integrated transceiver or external transceiver are used

• Smart Home
• Industrial Automation
• Health Care
• Consumer Electronics
• Smart Agriculture
• POS Machines
• Service Robot
• Audio Devices
• Generic Low-power IoT Sensor Hubs
• Generic Low-power IoT Data Loggers
• Cameras for Video Streaming
• USB Devices
• Speech Recognition
• Image Recognition
• Wi-Fi + Bluetooth Networking Card
• Touch and Proximity Sensing

The module has 41 pins. See pin definitions in T able 3-1 Pin Definitions .

For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to ESP32-S3 Series Datasheet .

Table 3-1. Pin Definitions

Cont'd on next page

Table 3-1 - cont'd from previous page

Table 6-3. DC Characteristics (3.3 V, 25 °C)

Table 6-3. DC Characteristics (3.3 V, 25 °C)

Stresses above those listed in T able 6-1 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under T able 6-2 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Table 6-1. Absolute Maximum Ratings

Table 6-2. Recommended Operating Conditions

This section provides the following resources for your reference:

• Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 11-1 ESP32-S3-WROOM-1 Recommended PCB Land Pattern and Figure 11-2 ESP32-S3-WROOM-1U Recommended PCB Land Pattern .
• Source files of recommended PCB land patterns to measure dimensions not covered in Figure 11-1 and Figure 11-2. You can view the source files for ESP32-S3-WROOM-1 and ESP32-S3-WROOM-1U with Autodesk Viewer.
• 3D models of ESP32-S3-WROOM-1 and ESP32-S3-WROOM-1U. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt).

Figure 11-1. ESP32-S3-WROOM-1 Recommended PCB Land Pattern

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Figure 11-2. ESP32-S3-WROOM-1U Recommended PCB Land Pattern