ENC424J600T

Part: ENC424J600/624J600 — Microchip Technology Type: Stand-Alone 10/100 Ethernet Controller Description: IEEE 802.3 compliant Fast Ethernet controller with integrated MAC and 10/100Base-T PHY, 24-Kbyte packet buffer SRAM, hardware security acceleration engines, and SPI or parallel host interfaces.

Operating Conditions:

• Supply voltage: 3.0V to 3.6V
• Operating temperature: -40°C to +85°C industrial
• Clock frequency: 25 MHz

Absolute Maximum Ratings:

Key Specs:

• Ethernet speed: 10/100 Mbps
• Packet buffer SRAM: 24 Kbytes
• SPI interface speed: 14 Mbit/s
• Parallel interface speed: up to 160 Mbit/s (demultiplexed, 16-bit)
• Security engines: RSA, Diffie-Hellman, AES (128/192/256-bit), MD5, SHA-1
• Input tolerance: 5V tolerant inputs
• Clock out frequency: 50 kHz to 33.3 MHz

Features:

• IEEE 802.3 Compliant Fast Ethernet Controller
• Integrated MAC and 10/100Base-T PHY
• Hardware Security Acceleration Engines
• 24-Kbyte Transmit/Receive Packet Buffer SRAM
• Supports one 10/100Base-T Port with Automatic Polarity Detection and Correction
• Supports Auto-Negotiation
• Factory Preprogrammed Unique MAC Address
• Available MCU Interfaces: SPI, 8-bit multiplexed parallel, 8-bit or 16-bit multiplexed or demultiplexed parallel

Applications:

• Ethernet network interface for microcontrollers

Package:

• 44-Pin TQFP
• 44-Pin QFN
• 64-Pin TQFP

Due to the high bandwidth and long cable length requirements, Ethernet applications can utilize a significant amount of power. ENC424J600/624J600 devices include power-down and PHY power management features to assist low-power applications. While features cannot completely mitigate power requirements, they can help reduce power consumption when the Ethernet interface is not needed.

TABLE 17-1: THERMAL OPERATING CONDITIONS

TABLE 17-2: THERMAL PACKAGING CHARACTERISTICS

TABLE 17-3: DC CHARACTERISTICS: ENC424J600/624J600 (INDUSTRIAL)

• Ambient temperature under bias.............................................................................................-40°C to +85°C (Industrial)
• Voltage on VDD, VDDOSC, VDDPLL , VDDRX and VDDTX, with respect to VSS ................................................. -0.3V to 4.0V
• Voltage on any digital pin, with respect to VSS ............................................................................................. -0.3V to 6.0V
• Voltage on OSC1 and RBIAS analog pins, with respect to VSS .........................................................-0.3V to VDD + 0.3V
• Voltage on TPIN+/- and TPOUT+/-, with respect to VSS .............................................................................. -0.3V to 5.0V
• Voltage on VCAP, with respect to all VSS pins (Note 1) ................................................................................ -0.3V to 2.0V
• ESD protection on all pins..........................................................................................................................................2 kV
• Current sourced or sunk by any digital output pin...................................................................................................25 mA
• Current out of all VSS pins.....................................................................................................................................420 mA
• Current into all VDD pins........................................................................................................................................300 mA

Note 1: VCAP is not designed to supply an external load. No external voltage should be applied to this pin.

† Notice: Stresses above those listed under 'Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.