EFR32MG21A010F1024IM32
Multiprotocol Wireless SoCThe EFR32MG21A010F1024IM32 is a multiprotocol wireless soc from Silicon Labs. View the full EFR32MG21A010F1024IM32 datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.
Official EFR32MG21A010F1024IM32 datasheet (PDF) — the source this page was extracted from.
EFR32MG21A010F1024IM32 Key Specifications
| Parameter | Value |
|---|---|
| CPU | ARM Cortex-M33 with DSP and FPU |
| Max CPU frequency | 80 MHz |
| Flash memory | Up to 1024 kB |
| RAM memory | Up to 96 kB |
| 2.4 GHz TX power | Up to 20 dBm |
| RX current (1 Mbps GFSK) | 8.8 mA |
| TX current (0 dBm) | 9.3 mA |
| EM2 DeepSleep current (96 kB RAM retention) | 5.0 μA |
| ADC | 12-bit, 1 Msps SAR |
EFR32MG21A010F1024IM32 Overview
Part: EFR32MG21A010F1024IM32-B — Silicon Labs
Type: Multiprotocol Wireless SoC
Description: 80 MHz ARM Cortex-M33 MCU with up to 1024 kB Flash, 96 kB RAM, and a 2.4 GHz radio supporting Bluetooth 5.1, Zigbee, and Thread, with up to 20 dBm TX power.
Operating Conditions:
- Supply voltage: 1.71 to 3.8 V
- Operating temperature: -40 to 125 °C
- Max operating frequency: 80 MHz
Absolute Maximum Ratings:
- Max supply voltage: 3.8 V
- Max junction/storage temperature: 150 °C
Key Specs:
- CPU: ARM Cortex-M33 with DSP and FPU
- Max CPU frequency: 80 MHz
- Flash memory: Up to 1024 kB
- RAM memory: Up to 96 kB
- 2.4 GHz TX power: Up to 20 dBm
- RX current (1 Mbps GFSK): 8.8 mA
- TX current (0 dBm): 9.3 mA
- EM2 DeepSleep current (96 kB RAM retention): 5.0 μA
- ADC: 12-bit, 1 Msps SAR
Features:
- 12-channel Peripheral Reflex System
- Hardware Cryptographic Acceleration (AES128/256, SHA-1, SHA-2, ECC, ECDSA, ECDH, J-Pake)
- True Random Number Generator (TRNG)
- ARM TrustZone
- Secure Boot with Root of Trust and Secure Loader (RTSL)
- Up to 20 General Purpose I/O pins
- 3x Universal Synchronous/Asynchronous Receiver/Transmitter (UART/SPI/SmartCard/IrDA/I2S)
- 2x I2C interface with SMBus support
Applications:
- IoT Multi-Protocol Devices
- Lighting
- Connected Home
- Gateways and Digital Assistants
- Building Automation and Security
Package:
- QFN32 4x4 mm (0.4 mm pitch)
EFR32MG21A010F1024IM32 Features
- 32-bit ARM® Cortex®-M33 core with 80 MHz maximum operating frequency
- Up to 1024 kB of flash and 96 kB of RAM
- 12-channel Peripheral Reflex System enabling autonomous interaction of MCU peripherals
- Integrated PA with up to 20 dBm (2.4 GHz) TX power
- Robust peripheral set and up to 20 GPIO in a 4x4 QFN package
EFR32MG21A010F1024IM32 Pin Configuration
EFR32MG21A010F1024IM32 — QFN32 Pinout
| Pin Number | Pin Name | Type | Description |
|---|---|---|---|
| 1 | PC00 | GPIO | GPIO |
| 2 | PC01 | GPIO | GPIO |
| 3 | PC02 | GPIO | GPIO |
| 4 | PC03 | GPIO | GPIO |
| 5 | PC04 | GPIO | GPIO |
| 6 | PC05 | GPIO | GPIO |
| 7 | HFXTAL_I | Analog | High Frequency Crystal Input |
| 8 | HFXTAL_O | Analog | High Frequency Crystal Output |
| 9 | RESETn | Input | Reset Pin |
| 10 | RFVDD | Power | Radio power supply |
| 11 | RFVSS | Ground | Radio Ground |
| 12 | RF2G4_IO2 | Analog | 2.4 GHz RF input/output |
| 13 | RF2G4_IO1 | Analog | 2.4 GHz RF input/output |
| 14 | PAVDD | Power | Power Amplifier (PA) power supply |
| 15 | PB01 | GPIO | GPIO |
| 16 | PB00 | GPIO | GPIO |
| 17 | PA00 | GPIO | GPIO |
| 18 | PA01 | GPIO | GPIO |
| 19 | PA02 | GPIO | GPIO |
| 20 | PA03 | GPIO | GPIO |
| 21 | PA04 | GPIO | GPIO |
| 22 | PA05 | GPIO | GPIO |
| 23 | PA06 | GPIO | GPIO |
| 24 | DECOUPLE | Analog | Decouple output for on-chip voltage regulator. External decoupling capacitor required. |
| 25 | DVDD | Power | Digital power supply |
| 26 | AVDD | Power | Analog power supply |
| 27 | IOVDD | Power | Digital IO power supply |
| 28 | PD04 | GPIO | GPIO |
| 29 | PD03 | GPIO | GPIO |
| 30 | PD02 | GPIO | GPIO |
| 31 | PD01 | GPIO | GPIO |
| 32 | PD00 | GPIO | GPIO |
Notes
- Pin 0 (center of die) is VSS (ground reference), shown in the diagram but not a package pin.
- All GPIO pins (PC00–PC05, PA00–PA06, PB00–PB01, PD00–PD04) support alternate functions; refer to section 6.2 for detailed alternate function assignments.
- RF pins (RF2G4_IO1, RF2G4_IO2) are differential RF input/output for the 2.4 GHz transceiver.
- Power pins (RFVDD, PAVDD, DVDD, AVDD, IOVDD) require appropriate decoupling and bulk capacitance per the power distribution guidelines.
- DECOUPLE pin (24) requires an external capacitor for the on-chip voltage regulator.
EFR32MG21A010F1024IM32 Electrical Characteristics
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
- Typical values are based on T A =25 °C and all supplies at 3.0 V, by production test and/or technology characterization.
- Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
- Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise.
EFR32MG21A010F1024IM32 Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Storage temperature range | T STG | -50 | - | +150 | °C | |
| Junction temperature | T JMAX | -I grade | - | - | +135 | °C |
| Voltage on any supply pin | V DDMAX | -0.3 | - | 3.8 | V | |
| Voltage ramp rate on any supply pin | V DDRAMPMAX | - | - | 1.0 | V / μs | |
| Voltage on HFXO pins | V HFXOPIN | -0.3 | - | 1.2 | V | |
| DC voltage on any GPIO pin | V DIGPIN | -0.3 | - | V IOVDD + 0.3 | V | |
| Input RF level on pins RF2G4_IO1 and RF2G4_IO2 | P RFMAX2G4 | - | - | +10 | dBm | |
| Absolute voltage on RF pins RF2G4_IOx | V MAX2G4 | -0.3 | - | V PAVDD | V | |
| Total current into VDD power lines | I VDDMAX | Source | - | - | 200 | mA |
| Total current into VSS ground lines | I VSSMAX | Sink | - | - | 200 | mA |
| Current per I/O pin | I IOMAX | Sink | - | - | 50 | mA |
| Current per I/O pin | Source | - | - | 50 | mA | |
| Current for all I/O pins | I IOALLMAX | Sink | - | - | 200 | mA |
| Current for all I/O pins | Source | - | - | 200 | mA |
EFR32MG21A010F1024IM32 Thermal Information
Table 4.3. Thermal Characteristics
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Thermal Resistance Junction to Ambient QFN32 (4x4mm) | THE- TA JA_QFN32_4X4 | 2-Layer PCB, Natural Convection 1 | - | 94.3 | - | °C/W |
| Package | 4-Layer PCB, Natural Convection 1 | - | 35.4 | - | °C/W | |
| Thermal Resistance Junction to Case QFN32 (4x4mm) | THE- TA JC_QFN32_4X4 | 2-Layer PCB, Natural Convection 1 | - | 36.3 | - | °C/W |
| Package | 4-Layer PCB, Natural Convection 1 | - | 23.5 | - | °C/W |
- Measured according to JEDEC standard JESD51-2A. Integrated Circuit Thermal Test Method Environmental Conditions - Natural Convection (Still Air).
EFR32MG21A010F1024IM32 Package Information
Figure 7.1. QFN32 Package Drawing
Table 7.1. QFN32 Package Dimensions
| Dimension | Min | Typ | Max |
|---|---|---|---|
| A | 0.80 | 0.85 | 0.90 |
| A1 | 0.00 | 0.02 | 0.05 |
| A3 | 0.20 REF | 0.20 REF | 0.20 REF |
| b | 0.15 | 0.20 | 0.25 |
| D | 3.90 | 4.00 | 4.10 |
| E | 3.90 | 4.00 | 4.10 |
| D2 | 2.60 | 2.70 | 2.80 |
| E2 | 2.60 | 2.70 | 2.80 |
| e | 0.40 BSC | 0.40 BSC | 0.40 BSC |
| L | 0.20 | 0.30 | 0.40 |
| K | 0.20 | - | - |
| R | 0.075 | - | 0.125 |
| aaa | 0.10 | 0.10 | 0.10 |
| bbb | 0.07 | 0.07 | 0.07 |
| ccc | 0.10 | 0.10 | 0.10 |
| ddd | 0.05 | 0.05 | 0.05 |
| eee | 0.08 | 0.08 | 0.08 |
| fff | 0.10 | 0.10 | 0.10 |
-
All dimensions shown are in millimeters (mm) unless otherwise noted.
-
Dimensioning and Tolerancing per ANSI Y14.5M-1994.
-
This drawing conforms to the JEDEC Solid State Outline MO-220, Variation VKKD-4.
-
Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
EFR32MG21A010F1024IM32 Ordering Information
| Ordering Code | Protocol Stack | Max TX Power @Frequency Band | Flash (kB) | RAM (kB) | Security | GPIO | Package |
|---|---|---|---|---|---|---|---|
| EFR32MG21A010F1024IM32-B | • Bluetooth 5.1 • Zigbee • Thread | 10 dBm @2.4 GHz | 1024 | 96 | Secure Element | 20 | QFN32 |
| EFR32MG21A010F512IM32-B | • Bluetooth 5.1 • Zigbee • Thread | 10 dBm @2.4 GHz | 512 | 64 | Secure Element | 20 | QFN32 |
| EFR32MG21A010F768IM32-B | • Bluetooth 5.1 • Zigbee • Thread | 10 dBm @2.4 GHz | 768 | 64 | Secure Element | 20 | QFN32 |
| EFR32MG21A020F1024IM32-B | • Bluetooth 5.1 • Zigbee • Thread | 20 dBm @2.4 GHz | 1024 | 96 | Secure Element | 20 | QFN32 |
| EFR32MG21A020F512IM32-B | • Bluetooth 5.1 • Zigbee • Thread | 20 dBm @2.4 GHz | 512 | 64 | Secure Element | 20 | QFN32 |
| EFR32MG21A020F768IM32-B | • Bluetooth 5.1 • Zigbee • Thread | 20 dBm @2.4 GHz | 768 | 64 | Secure Element | 20 | QFN32 |
Variants on the same datasheet
These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.
| Part Number | Manufacturer | Package |
|---|---|---|
| EFR32MG21 | Silicon Labs | QFN-32 4x4mm |
| EFR32MG21A010F1024IM32-B | Silicon Labs | QFN32 |
| EFR32MG21A010F512IM32-B | Silicon Labs | QFN32 |
| EFR32MG21A010F768IM32-B | Silicon Labs | QFN32 |
| EFR32MG21A020F1024IM32-B | Silicon Labs | QFN32 |
| EFR32MG21A020F512IM32-B | Silicon Labs | QFN32 |
| EFR32MG21A020F768IM32-B | Silicon Labs | QFN32 |
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